Inventor · disambiguated record
Maria L. Cobarruviaz
Also filed as: COBARRUVIAZ MARIA L
6 granted patents·494 citations·filing 1989–1999
87Inventor score
Files withHEWLETT PACKARD CO5
Top patents by PatentIndex Score
6 records- 0193US5055425AStacked solid via formation in integrated circuit systemsHEWLETT PACKARD CO·Filed 1989·Granted Oct 8, 1991·121 cites·8 claims
- 0291US6011314ARedistribution layer and under bump material structure for converting periphery conductive pads to an array of solder bumpsHEWLETT PACKARD CO·Filed 1999·Granted Jan 4, 2000·189 cites·19 claims
- 0389US5162260AStacked solid via formation in integrated circuit systemsHEWLETT PACKARD CO·Filed 1991·Granted Nov 10, 1992·124 cites·6 claims
- 0462US5221421AControlled etching process for forming fine-geometry circuit lines on a substrateHEWLETT PACKARD CO·Filed 1992·Granted Jun 22, 1993·35 cites·26 claims
- 0545US5200300AMethods for forming high density multi-chip carriersHEWLETT PACKARD CO·Filed 1991·Granted Apr 6, 1993·16 cites·15 claims
- 0641US5399528AMulti-layer fabrication in integrated circuit systemsFiled 1993·Granted Mar 21, 1995·9 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →