Inventor · disambiguated record
Chee-Hau Ng
Also filed as: NG CHEE-HAU
7 granted patents·2 pending applications·2 citations·filing 2018–2025
72Inventor score
Files withUNITED MICROELECTRONICS CORP9
Top patents by PatentIndex Score
9 records- 0187US11670567B2Semiconductor structure and method of wafer bondingUNITED MICROELECTRONICS CORP·Filed 2020·Granted Jun 6, 2023·2 cites·20 claims
- 0273US12080622B2Semiconductor structure and method of wafer bondingUNITED MICROELECTRONICS CORP·Filed 2023·Granted Sep 3, 2024·0 cites·20 claims
- 0370US2025349599A1Method of forming protective layer utilized in silicon remove processUNITED MICROELECTRONICS CORP·Filed 2025·Application pending·0 cites
- 0467US12300534B2Method of forming protective layer utilized in silicon remove processUNITED MICROELECTRONICS CORP·Filed 2022·Granted May 13, 2025·0 cites·10 claims
- 0560US11398548B2Semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2020·Granted Jul 26, 2022·0 cites·8 claims
- 0655US12324168B2Semiconductor device and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2022·Granted Jun 3, 2025·0 cites·11 claims
- 0751US2025241057A1Semiconductor device and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2025·Application pending·0 cites
- 0850US10903314B2Semiconductor device and method for manufacturing the sameUNITED MICROELECTRONICS CORP·Filed 2018·Granted Jan 26, 2021·0 cites·12 claims
- 0944US10622253B2Manufacturing method of semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2018·Granted Apr 14, 2020·0 cites·15 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →