Inventor · disambiguated record
Wen-Shen Li
Also filed as: LI WEN-SHEN
5 granted patents·1 pending application·0 citations·filing 2017–2022
61Inventor score
Files withUNITED MICROELECTRONICS CORP6
Top patents by PatentIndex Score
6 records- 0163US11715709B2Manufacturing method of radiofrequency device including mold compound layerUNITED MICROELECTRONICS CORP·Filed 2022·Granted Aug 1, 2023·0 cites·7 claims
- 0260US11398548B2Semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2020·Granted Jul 26, 2022·0 cites·8 claims
- 0350US11362048B2Radiofrequency device and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2018·Granted Jun 14, 2022·0 cites·6 claims
- 0450US10903314B2Semiconductor device and method for manufacturing the sameUNITED MICROELECTRONICS CORP·Filed 2018·Granted Jan 26, 2021·0 cites·12 claims
- 0544US10622253B2Manufacturing method of semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2018·Granted Apr 14, 2020·0 cites·15 claims
- 0629US2019051666A1Semiconductor device and fabrication method thereofUNITED MICROELECTRONICS CORP·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →