Inventor · disambiguated record
Zhong Qiang Hua
Also filed as: HUA ZHONG QIANG
26 granted patents·13 pending applications·904 citations·filing 1995–2021
96Inventor score
Files withAPPLIED MATERIALS INC32HUA ZHONG QIANG3MANDREKAR TUSHAR V1ROGERS MATTHEW SCOTT1VARIAN SEMICONDUCTOR EQUIPMENT ASS INC1
Top patents by PatentIndex Score
39 records- 0198US7967913B2Remote plasma clean process with cycled high and low pressure clean stepsAPPLIED MATERIALS INC·Filed 2009·Granted Jun 28, 2011·477 cites·19 claims
- 0295US8114761B2Method for doping non-planar transistorsMANDREKAR TUSHAR V·Filed 2010·Granted Feb 14, 2012·136 cites·10 claims
- 0394US6372291B1In situ deposition and integration of silicon nitride in a high density plasma reactorAPPLIED MATERIALS INC·Filed 1999·Granted Apr 16, 2002·147 cites·19 claims
- 0492US11289312B2Physical vapor deposition (PVD) chamber with in situ chamber cleaning capabilityAPPLIED MATERIALS INC·Filed 2019·Granted Mar 29, 2022·4 cites·18 claims
- 0590US11049701B2Biased cover ring for a substrate processing systemAPPLIED MATERIALS INC·Filed 2017·Granted Jun 29, 2021·3 cites·19 claims
- 0685US11114306B2Methods for depositing dielectric materialAPPLIED MATERIALS INC·Filed 2018·Granted Sep 7, 2021·3 cites·17 claims
- 0784US7789993B2Internal balanced coil for inductively coupled high density plasma processing chamberAPPLIED MATERIALS INC·Filed 2007·Granted Sep 7, 2010·8 cites·6 claims
- 0884US7572647B2Internal balanced coil for inductively coupled high density plasma processing chamberAPPLIED MATERIALS INC·Filed 2007·Granted Aug 11, 2009·10 cites·7 claims
- 0981US5705233AFiber-reinforced cementitious compositesWISCONSIN ALUMNI RES FOUND·Filed 1995·Granted Jan 6, 1998·49 cites·10 claims
- 1076US7704897B2HDP-CVD SiON films for gap-fillAPPLIED MATERIALS INC·Filed 2008·Granted Apr 27, 2010·7 cites·27 claims
- 1173US7141138B2Gas delivery system for semiconductor processingAPPLIED MATERIALS INC·Filed 2003·Granted Nov 28, 2006·13 cites·16 claims
- 1272US6812153B2Method for high aspect ratio HDP CVD gapfillAPPLIED MATERIALS INC·Filed 2002·Granted Nov 2, 2004·13 cites·7 claims
- 1370US10811257B2Techniques for forming low stress etch-resistant mask using implantationVARIAN SEMICONDUCTOR EQUIPMENT ASS INC·Filed 2018·Granted Oct 20, 2020·1 cites·16 claims
- 1469US10858735B2Alignment systems employing actuators providing relative displacement between lid assemblies of process chambers and substrates, and related methodsAPPLIED MATERIALS INC·Filed 2019·Granted Dec 8, 2020·0 cites·18 claims
- 1568US11631591B2Methods for depositing dielectric materialAPPLIED MATERIALS INC·Filed 2021·Granted Apr 18, 2023·0 cites·20 claims
- 1667US10435786B2Alignment systems employing actuators providing relative displacement between lid assemblies of process chambers and substrates, and related methodsAPPLIED MATERIALS INC·Filed 2014·Granted Oct 8, 2019·0 cites·15 claims
- 1766US10128337B2Methods for forming fin structures with desired profile for 3D structure semiconductor applicationsAPPLIED MATERIALS INC·Filed 2016·Granted Nov 13, 2018·1 cites·19 claims
- 1866US8404583B2Conformality of oxide layers along sidewalls of deep viasHUA ZHONG QIANG·Filed 2011·Granted Mar 26, 2013·3 cites·10 claims
- 1964US7159597B2Multistep remote plasma clean processAPPLIED MATERIALS INC·Filed 2002·Granted Jan 9, 2007·19 cites·23 claims
- 2063US7498268B2Gas delivery system for semiconductor processingAPPLIED MATERIALS INC·Filed 2006·Granted Mar 3, 2009·1 cites·9 claims
- 2160US6822185B2Temperature controlled dome-coil system for high power inductively coupled plasma systemsAPPLIED MATERIALS INC·Filed 2002·Granted Nov 23, 2004·7 cites·56 claims
- 2253US2008188090A1Internal balanced coil for inductively coupled high density plasma processing chamberAPPLIED MATERIALS INC·Filed 2007·Application pending·0 cites
- 2351US2014187045A1Silicon nitride gapfill implementing high density plasmaAPPLIED MATERIALS INC·Filed 2013·Application pending·0 cites
- 2451US2014186544A1Metal processing using high density plasmaAPPLIED MATERIALS INC·Filed 2013·Application pending·0 cites
- 2550US9809881B2Method and apparatus for multizone plasma generationROGERS MATTHEW SCOTT·Filed 2011·Granted Nov 7, 2017·0 cites·16 claims
- 2650US7064077B2Method for high aspect ratio HDP CVD gapfillAPPLIED MATERIALS INC·Filed 2004·Granted Jun 20, 2006·2 cites·20 claims
- 2749US2019088457A1Sync controller for high impulse magnetron sputteringAPPLIED MATERIALS INC·Filed 2018·Application pending·0 cites
- 2849US2018108519A1POWER DELIVERY FOR HIGH POWER IMPULSE MAGNETRON SPUTTERING (HiPIMS)APPLIED MATERIALS INC·Filed 2017·Application pending·0 cites
- 2946US10570506B2Method to improve film quality for PVD carbon with reactive gas and bias powerAPPLIED MATERIALS INC·Filed 2017·Granted Feb 25, 2020·0 cites·13 claims
- 3043US2008142483A1Multi-step dep-etch-dep high density plasma chemical vapor deposition processes for dielectric gapfillsAPPLIED MATERIALS INC·Filed 2007·Application pending·0 cites
- 3141US2012015113A1Methods for forming low stress dielectric filmsHUA ZHONG QIANG·Filed 2010·Application pending·0 cites
- 3241US2013252440A1Pretreatment and improved dielectric coverageAPPLIED MATERIALS INC·Filed 2012·Application pending·0 cites
- 3340US10566177B2Pulse shape controller for sputter sourcesAPPLIED MATERIALS INC·Filed 2016·Granted Feb 18, 2020·0 cites·18 claims
- 3439US2004231798A1Gas delivery system for semiconductor processingAPPLIED MATERIALS INC·Filed 2004·Application pending·0 cites
- 3538US10858727B2High density, low stress amorphous carbon film, and process and equipment for its depositionAPPLIED MATERIALS INC·Filed 2017·Granted Dec 8, 2020·0 cites·9 claims
- 3636US2018122679A1Stress balanced electrostatic substrate carrier with contactsAPPLIED MATERIALS INC·Filed 2016·Application pending·0 cites
- 3735US2019127842A1Pulsed dc source for high power impulse magnetron sputtering physical vapor deposition of dielectric films and methods of applicationAPPLIED MATERIALS INC·Filed 2017·Application pending·0 cites
- 3835US2018025931A1Processed wafer as top plate of a workpiece carrier in semiconductor and mechanical processingAPPLIED MATERIALS INC·Filed 2016·Application pending·0 cites
- 3931US2012058281A1Methods for forming low moisture dielectric filmsHUA ZHONG QIANG·Filed 2011·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →