Inventor · disambiguated record
Hidemichi Fujiwara
Also filed as: FUJIWARA HIDEMICHI
12 granted patents·9 pending applications·43 citations·filing 2001–2024
86Inventor score
Top patents by PatentIndex Score
21 records- 0185US10818405B2Metal fine particle-containing compositionFURUKAWA ELECTRIC CO LTD·Filed 2016·Granted Oct 27, 2020·2 cites·17 claims
- 0277US8475923B2Heat transfer film, semiconductor device, and electronic apparatusKATAYAMA MASAKO·Filed 2008·Granted Jul 2, 2013·9 cites·7 claims
- 0373US2019264072A1Joining film, tape for wafer processing, method for producing joined body, and joined bodyFURUKAWA ELECTRIC CO LTD·Filed 2019·Application pending·0 cites
- 0470US6573454B2Electric distribution assemblyFURUKAWA ELECTRIC CO LTD·Filed 2001·Granted Jun 3, 2003·20 cites·8 claims
- 0569US8337726B2Fine particle dispersion and method for producing fine particle dispersionHARADA TAKUYA·Filed 2007·Granted Dec 25, 2012·4 cites·6 claims
- 0666US10046418B2Electrically conductive paste, and electrically conducive connection member produced using the pasteMASUMORI SHUNJI·Filed 2011·Granted Aug 14, 2018·4 cites·31 claims
- 0764US2021348038A1Joining film, tape for wafer processing, method for producing joined body, and joined bodyFURUKAWA ELECTRIC CO LTD·Filed 2021·Application pending·0 cites
- 0863US2021189198A1Joining film, tape for wafer processing, method for producing joined body, and joined bodyFURUKAWA ELECTRIC CO LTD·Filed 2021·Application pending·0 cites
- 0963US2021189197A1Joining film, tape for wafer processing, method for producing joined body, and joined bodyFURUKAWA ELECTRIC CO LTD·Filed 2021·Application pending·0 cites
- 1063US2024408703A1Bonding material composition, method for manufacturing bonding material composition, bonding film, method for manufacturing bonded body, and bonded bodyFURUKAWA ELECTRIC CO LTD·Filed 2024·Application pending·0 cites
- 1161US11466181B2Metal particle-containing composition and electrically conductive adhesive filmFURUKAWA ELECTRIC CO LTD·Filed 2021·Granted Oct 11, 2022·0 cites·15 claims
- 1258US10626483B2Copper alloy wire rodFURUKAWA ELECTRIC CO LTD·Filed 2018·Granted Apr 21, 2020·0 cites·5 claims
- 1358US8277693B2Method for producing fine particle dispersion and fine particle dispersionHARADA TAKUYA·Filed 2007·Granted Oct 2, 2012·1 cites·6 claims
- 1455US12374646B2Bonding film, tape for wafer processing, method for producing bonded body, and bonded body and pasted bodyFURUKAWA ELECTRIC CO LTD·Filed 2022·Granted Jul 29, 2025·0 cites·20 claims
- 1554US9221130B2Material for thermal bonding, coating material for thermal bonding, coating, and electronic component bonding methodASADA TOSHIAKI·Filed 2011·Granted Dec 29, 2015·1 cites·11 claims
- 1650US6867372B2Power cable for mobile and terminal for the power cableFURUKAWA ELECTRIC CO LTD·Filed 2001·Granted Mar 15, 2005·2 cites·14 claims
- 1745US2009151998A1Electromagnetic wave shielding wiring circuit forming method and electromagnetic wave shielding sheetFURUKAWA ELECTRIC CO LTD·Filed 2008·Application pending·0 cites
- 1843US2014127409A1Method for producing fine particle dispersionHARADA TAKUYA·Filed 2012·Application pending·0 cites
- 1938US2003059336A1Aluminum alloy material for use in a terminal, and terminal using the materialFiled 2002·Application pending·0 cites
- 2034US2019273062A1Joining film and tape for wafer processingFURUKAWA ELECTRIC CO LTD·Filed 2019·Application pending·0 cites
- 2131US10177079B2Conductive connecting member and manufacturing method of sameNISHIKUBO HIDEO·Filed 2011·Granted Jan 8, 2019·0 cites·15 claims
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