Assignee

ASADA TOSHIAKI

JP·1 granted patent·1 citations·filing 2011–2011

Technology mixB22F1 B23K1 B82Y1 C08K1 C09J1 H01B1

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1 record

0154US9221130B2Material for thermal bonding, coating material for thermal bonding, coating, and electronic component bonding methodASADA TOSHIAKI·Filed 2011·Granted Dec 29, 2015·1 cites·11 claims

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