Inventor · disambiguated record
Markus Brunnbauer
Also filed as: BRUNNBAUER MARKUS
56 granted patents·9 pending applications·651 citations·filing 2006–2018
98Inventor score
Files withINFINEON TECHNOLOGIES AG30BRUNNBAUER MARKUS12MEYER THORSTEN11BARTH HANS-JOACHIM3BEER GOTTFRIED2
Top patents by PatentIndex Score
65 records- 0198US7834464B2Semiconductor chip package, semiconductor chip assembly, and method for fabricating a deviceINFINEON TECHNOLOGIES AG·Filed 2007·Granted Nov 16, 2010·87 cites·10 claims
- 0296US8202763B2Semiconductor chip package, semiconductor chip assembly, and method for fabricating a deviceMEYER THORSTEN·Filed 2010·Granted Jun 19, 2012·26 cites·16 claims
- 0395US8330273B2Semiconductor device including molding compound layer forms a common plane with the surface of the semiconductor chipBRUNNBAUER MARKUS·Filed 2010·Granted Dec 11, 2012·25 cites·23 claims
- 0495US8012807B2Method for producing chip packages, and chip package produced in this wayINFINEON TECHNOLOGIES AG·Filed 2007·Granted Sep 6, 2011·23 cites·21 claims
- 0595US7906860B2Semiconductor deviceINFINEON TECHNOLOGIES AG·Filed 2007·Granted Mar 15, 2011·53 cites·18 claims
- 0695US7759163B2Semiconductor moduleINFINEON TECHNOLOGIES AG·Filed 2008·Granted Jul 20, 2010·49 cites·17 claims
- 0794US8829663B2Stackable semiconductor package with encapsulant and electrically conductive feed-throughPOHL JENS·Filed 2007·Granted Sep 9, 2014·36 cites·21 claims
- 0894US7943423B2Reconfigured wafer alignmentINFINEON TECHNOLOGIES AG·Filed 2009·Granted May 17, 2011·28 cites·24 claims
- 0993US9293423B2Workpiece with semiconductor chips, semiconductor device and method for producing a workpiece with semiconductor chipsINTEL MOBILE COMM GMBH·Filed 2014·Granted Mar 22, 2016·11 cites·15 claims
- 1093US8178953B2On-chip RF shields with front side redistribution linesBARTH HANS-JOACHIM·Filed 2008·Granted May 15, 2012·22 cites·25 claims
- 1193US7687895B2Workpiece with semiconductor chips and molding, semiconductor device and method for producing a workpiece with semiconductors chipsINFINEON TECHNOLOGIES AG·Filed 2007·Granted Mar 30, 2010·30 cites·41 claims
- 1291US7863088B2Semiconductor device including covering a semiconductor with a molding compound and forming a through hole in the molding compoundINFINEON TECHNOLOGIES AG·Filed 2007·Granted Jan 4, 2011·18 cites·18 claims
- 1390US8106497B2Semiconductor module having a semiconductor chip stack and methodBRUNNBAUER MARKUS·Filed 2007·Granted Jan 31, 2012·25 cites·17 claims
- 1490US8093711B2Semiconductor deviceZUDOCK FRANK·Filed 2009·Granted Jan 10, 2012·32 cites·22 claims
- 1590US7732242B2Composite board with semiconductor chips and plastic housing composition and methodINFINEON TECHNOLOGIES AG·Filed 2007·Granted Jun 8, 2010·22 cites·6 claims
- 1690US7429782B2Semiconductor stack block comprising semiconductor chips and methods for producing the sameINFINEON TECHNOLOGIES AG·Filed 2006·Granted Sep 30, 2008·19 cites·16 claims
- 1787US8188585B2Electronic device and method for producing a deviceBRUNNBAUER MARKUS·Filed 2007·Granted May 29, 2012·10 cites·28 claims
- 1886US8063469B2On-chip radio frequency shield with interconnect metallizationBARTH HANS-JOACHIM·Filed 2008·Granted Nov 22, 2011·14 cites·24 claims
- 1985US8779563B2Workpiece with semiconductor chips, semiconductor device and method for producing a workpiece with semiconductor chipsINTEL MOBILE COMM GMBH·Filed 2012·Granted Jul 15, 2014·6 cites·11 claims
- 2085US8309454B2Structure for electrostatic discharge in embedded wafer level packagesBRUNNBAUER MARKUS·Filed 2007·Granted Nov 13, 2012·10 cites·14 claims
- 2182US7592689B2Semiconductor module comprising semiconductor chips and method for producing the sameINFINEON TECHNOLOGIES AG·Filed 2007·Granted Sep 22, 2009·10 cites·11 claims
- 2281US8076784B2Stacked semiconductor chipsBRUNNBAUER MARKUS·Filed 2010·Granted Dec 13, 2011·5 cites·18 claims
- 2380US9570352B2Method of dicing a wafer and semiconductor chipINFINEON TECHNOLOGIES AG·Filed 2015·Granted Feb 14, 2017·3 cites·15 claims
- 2480US7911068B2Component and method for producing a componentINFINEON TECHNOLOGIES AG·Filed 2006·Granted Mar 22, 2011·8 cites·14 claims
- 2580US7843055B2Semiconductor device having an adhesion promoting layer and method for producing itINFINEON TECHNOLOGIES AG·Filed 2007·Granted Nov 30, 2010·9 cites·20 claims
- 2679US8786105B1Semiconductor device with chip having low-k-layersMEYER THORSTEN·Filed 2013·Granted Jul 22, 2014·5 cites·30 claims
- 2779US8080880B2Semiconductor device with arrangement of parallel conductor lines being insulated, between and orthogonal to external contact padsBRUNNBAUER MARKUS·Filed 2009·Granted Dec 20, 2011·8 cites·13 claims
- 2878US7674654B2Producing thin integrated semiconductor devicesINFINEON TECHNOLOGIES AG·Filed 2007·Granted Mar 9, 2010·8 cites·19 claims
- 2977US8471393B2Semiconductor component including a semiconductor chip and a passive componentMEYER THORSTEN·Filed 2006·Granted Jun 25, 2013·8 cites·20 claims
- 3076US7666777B2Electronic structure with components connected by way of solderable connecting elements and methodINFINEON TECHNOLOGIES AG·Filed 2006·Granted Feb 23, 2010·7 cites·9 claims
- 3174US8617929B2On-Chip RF shields with front side redistribution linesBARTH HANS-JOACHIM·Filed 2012·Granted Dec 31, 2013·3 cites·20 claims
- 3274US8071428B2Semiconductor devicePOHL JENS·Filed 2009·Granted Dec 6, 2011·5 cites·18 claims
- 3373US10373871B2Method of separating semiconductor dies from a semiconductor substrate, semiconductor substrate assembly and semiconductor die assemblyINFINEON TECHNOLOGIES AG·Filed 2018·Granted Aug 6, 2019·1 cites·20 claims
- 3472US10748801B2Carrier arrangement and method for processing a carrier by generating a crack structureINFINEON TECHNOLOGIES AG·Filed 2018·Granted Aug 18, 2020·1 cites·13 claims
- 3572US8217504B2Article and panel comprising semiconductor chips, casting mold and methods of producing the sameMEYER THORSTEN·Filed 2008·Granted Jul 10, 2012·4 cites·10 claims
- 3672US8158046B2Mold apparatus and methodBRUNNBAUER MARKUS·Filed 2007·Granted Apr 17, 2012·4 cites·11 claims
- 3770US7915089B2Encapsulation methodINFINEON TECHNOLOGIES AG·Filed 2007·Granted Mar 29, 2011·4 cites·22 claims
- 3868US8742563B2Component and method for producing a componentMEYER THORSTEN·Filed 2010·Granted Jun 3, 2014·2 cites·16 claims
- 3964US8247897B2Blank including a composite panel with semiconductor chips and plastic package molding compound and method and mold for producing the sameBRUNNBAUER MARKUS·Filed 2007·Granted Aug 21, 2012·2 cites·9 claims
- 4063US7811860B2Method for producing a device and deviceINFINEON TECHNOLOGIES AG·Filed 2007·Granted Oct 12, 2010·2 cites·25 claims
- 4161US8431063B2Heat treatment for a panel and apparatus for carrying out the heat treatment methodBEER GOTTFRIED·Filed 2006·Granted Apr 30, 2013·2 cites·12 claims
- 4260US7867878B2Stacked semiconductor chipsINFINEON TECHNOLOGIES AG·Filed 2007·Granted Jan 11, 2011·1 cites·12 claims
- 4359US7952188B2Semiconductor module with a dielectric layer including a fluorocarbon compound on a chipINFINEON TECHNOLOGIES AG·Filed 2007·Granted May 31, 2011·1 cites·37 claims
- 4458US7585701B2Carrier sheet with adhesive film and method for producing semiconductor devices using the carrier sheet with adhesive filmINFINEON TECHNOLOGIES AG·Filed 2006·Granted Sep 8, 2009·1 cites·8 claims
- 4555US9601475B2Workpiece with semiconductor chips, semiconductor device and method for producing a workpiece with semiconductor chipsINTEL DEUTSCHLAND GMBH·Filed 2016·Granted Mar 21, 2017·0 cites·20 claims
- 4654US9972535B2Method of separating semiconductor dies from a semiconductor substrate, semiconductor substrate assembly and semiconductor die assemblyINFINEON TECHNOLOGIES AG·Filed 2017·Granted May 15, 2018·0 cites·23 claims
- 4754US9093322B2Semiconductor deviceMEYER THORSTEN·Filed 2007·Granted Jul 28, 2015·1 cites·17 claims
- 4853US8604622B2Semiconductor chip package, semiconductor chip assembly, and method for fabricating a deviceMEYER THORSTEN·Filed 2012·Granted Dec 10, 2013·0 cites·9 claims
- 4953US2014357075A1Semiconductor deviceMEYER THORSTEN·Filed 2014·Application pending·0 cites
- 5052US9362144B2Article and panel comprising semiconductor chips, casting mold and methods of producing the sameMEYER THORSTEN·Filed 2012·Granted Jun 7, 2016·0 cites·8 claims
Showing the top 50 of 65 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →