Inventor · disambiguated record
Donna S. Zupanski-Nielsen
Also filed as: ZUPANSKI-NIELSEN DONNA S
13 granted patents·7 pending applications·105 citations·filing 2003–2022
91Inventor score
Top patents by PatentIndex Score
20 records- 0195US7312529B2Structure and method for producing multiple size interconnectionsIBM·Filed 2005·Granted Dec 25, 2007·36 cites·18 claims
- 0288US10413359B2Laser-assisted transdermal delivery of nanoparticulates and hydrogelsIBM·Filed 2013·Granted Sep 17, 2019·18 cites·16 claims
- 0386US10456197B2Laser-assisted transdermal delivery of nanoparticulates and hydrogelsIBM·Filed 2013·Granted Oct 29, 2019·18 cites·20 claims
- 0481US8487304B2High performance compliant wafer test probeCHEY S JAY·Filed 2010·Granted Jul 16, 2013·5 cites·23 claims
- 0576US12042222B2Laser-assisted transdermal delivery of nanoparticulates and hydrogelsIBM·Filed 2022·Granted Jul 23, 2024·0 cites·19 claims
- 0674US8026613B2Interconnections for flip-chip using lead-free solders and having reaction barrier layersIBM·Filed 2008·Granted Sep 27, 2011·4 cites·6 claims
- 0774US7863183B2Method for fabricating last level copper-to-C4 connection with interfacial cap structureIBM·Filed 2006·Granted Jan 4, 2011·6 cites·18 claims
- 0874US7410833B2Interconnections for flip-chip using lead-free solders and having reaction barrier layersIBM·Filed 2004·Granted Aug 12, 2008·14 cites·18 claims
- 0971US7923849B2Interconnections for flip-chip using lead-free solders and having reaction barrier layersIBM·Filed 2008·Granted Apr 12, 2011·3 cites·9 claims
- 1066US11612433B2Laser-assisted transdermal delivery of nanoparticulates and hydrogelsIBM·Filed 2019·Granted Mar 28, 2023·0 cites·20 claims
- 1165US11324552B2Laser-assisted transdermal delivery of nanoparticulates and hydrogelsIBM·Filed 2019·Granted May 10, 2022·0 cites·14 claims
- 1250US2012012642A1Interconnections for flip-chip using lead-free solders and having reaction barrier layersFOGEL KEITH E·Filed 2011·Application pending·0 cites
- 1348US9335346B2High performance compliant wafer test probeCHEY S JAY·Filed 2012·Granted May 10, 2016·0 cites·20 claims
- 1443US2008038913A1Methods of forming aluminum-free wire bond pad and pad so formedIBM·Filed 2006·Application pending·0 cites
- 1542US2007187828A1Ild layer with intermediate dielectric constant material immediately below silicon dioxide based ild layerIBM·Filed 2006·Application pending·0 cites
- 1642US2008029898A1Via stack structuresFAROOQ MUKTA G·Filed 2006·Application pending·0 cites
- 1741US6900142B2Inhibition of tin oxide formation in lead free interconnect formationIBM·Filed 2003·Granted May 31, 2005·1 cites·9 claims
- 1840US2007080455A1Semiconductors and methods of makingIBM·Filed 2005·Application pending·0 cites
- 1934US2013190742A1System and method for modification and/or smoothing of tissue with laser ablationCONNORS DANIEL PATRICK·Filed 2011·Application pending·0 cites
- 2032US2013269780A1Interface between a i-iii-vi2 material layer and a molybdenum substrateGRAND PIERRE-PHILIPPE·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →