Inventor · disambiguated record
Naoki Sadayori
Also filed as: SADAYORI NAOKI
11 granted patents·8 pending applications·60 citations·filing 2003–2018
87Inventor score
Files withNITTO DENKO CORP17
Top patents by PatentIndex Score
19 records- 0183US7290902B2Direct-type backlightNITTO DENKO CORP·Filed 2005·Granted Nov 6, 2007·13 cites·13 claims
- 0277US6961185B2Microlens arrayNITTO DENKO CORP·Filed 2004·Granted Nov 1, 2005·13 cites·9 claims
- 0372US7221007B2Sheet for optical-semiconductor element encapsulation and process for producing optical semiconductor device using the sheetNITTO DENKO CORP·Filed 2005·Granted May 22, 2007·3 cites·5 claims
- 0466US7189591B2Process for producing light-emitting semiconductor deviceNITTO DENKO CORP·Filed 2004·Granted Mar 13, 2007·17 cites·7 claims
- 0563US11508893B2Method of producing semiconductor sintered bodyNITTO DENKO CORP·Filed 2018·Granted Nov 22, 2022·0 cites·5 claims
- 0661US6800425B2Process of producing polymer optical waveguideNITTO DENKO CORP·Filed 2003·Granted Oct 5, 2004·7 cites·5 claims
- 0760US11404620B2Method of producing semiconductor sintered body, electrical/electronic member, and semiconductor sintered bodyNITTO DENKO CORP·Filed 2018·Granted Aug 2, 2022·0 cites·5 claims
- 0859US11616182B2Method of producing semiconductor sintered body, electrical/electronic member, and semiconductor sintered bodyNITTO DENKO CORP·Filed 2018·Granted Mar 28, 2023·0 cites·20 claims
- 0955US6846550B2Adhesive film for underfill and semiconductor device using the sameNITTO DENKO CORP·Filed 2003·Granted Jan 25, 2005·7 cites·4 claims
- 1049US2004158021A1Polycarbodiimide having high index of refraction and production method thereofNITTO DENKO CORP·Filed 2004·Application pending·0 cites
- 1146US7034101B2Polycarbodiimide copolymer and production method thereofNITTO DENKO CORP·Filed 2004·Granted Apr 25, 2006·0 cites·5 claims
- 1240US2006022356A1Resin for optical-semiconductor element encapsulationNITTO DENKO CORP·Filed 2005·Application pending·0 cites
- 1340US2006118973A1Sheet for optical-semiconductor-element encapsulation and process for producing optical semiconductor device with the sheetNITTO DENKO CORP·Filed 2005·Application pending·0 cites
- 1437US7018718B2Adhesive film for underfill and semiconductor device using the sameNITTO DENKO CORP·Filed 2004·Granted Mar 28, 2006·0 cites·4 claims
- 1537US2005073633A1Pressure sensitive ashesive optical film and image viewing displayFiled 2003·Application pending·0 cites
- 1637US2004157992A1Resin for the encapsulation of photosemiconductor element, photosemiconductor device comprising encapsulated optical semiconductor element, and process for producing the deviceNITTO DENKO CORP·Filed 2004·Application pending·0 cites
- 1736US2005136570A1Process for producing optical semiconductor deviceNITTO DENKO CORP·Filed 2004·Application pending·0 cites
- 1836US2005127378A1Optical semiconductor deviceNITTO DENKO CORP·Filed 2004·Application pending·0 cites
- 1935US2005084670A1Pressure-sensitive adhesive type optical film and image displayFiled 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →