Inventor · disambiguated record
Hiromichi Kumakura
Also filed as: KUMAKURA HIROMICHI
11 granted patents·2 pending applications·248 citations·filing 2001–2017
88Inventor score
Top patents by PatentIndex Score
13 records- 0193US10020373B1Semiconductor deviceSANKEN ELECTRIC CO LTD·Filed 2017·Granted Jul 10, 2018·17 cites·10 claims
- 0293US9391136B1Semiconductor deviceSANKEN ELECTRIC CO LTD·Filed 2015·Granted Jul 12, 2016·13 cites·6 claims
- 0392US6759841B2Hall-effect current detectorSANKEN ELECTRIC CO LTD·Filed 2002·Granted Jul 6, 2004·83 cites·7 claims
- 0492US6545457B2Current detector utilizing hall effectSANKEN ELECTRIC CO LTD·Filed 2001·Granted Apr 8, 2003·98 cites·6 claims
- 0587US6781358B2Hall-effect current detectorSANKEN ELECTRIC CO LTD·Filed 2002·Granted Aug 24, 2004·36 cites·11 claims
- 0667US9941124B1Semiconductor deviceSANKEN ELECTRIC CO LTD·Filed 2017·Granted Apr 10, 2018·1 cites·2 claims
- 0746US10297557B2Semiconductor device and method for manufacturing the semiconductor deviceSANKEN ELECTRIC CO LTD·Filed 2017·Granted May 21, 2019·0 cites·19 claims
- 0846US10158013B1Semiconductor device and method for manufacturing the semiconductor deviceSANKEN ELECTRIC CO LTD·Filed 2017·Granted Dec 18, 2018·0 cites·18 claims
- 0944US9130063B2Semiconductor device and method of manufacturing the sameSANKEN ELECTRIC CO LTD·Filed 2014·Granted Sep 8, 2015·0 cites·8 claims
- 1043US10186586B1Semiconductor device and method for forming the semiconductor deviceSANKEN ELECTRIC CO LTD·Filed 2017·Granted Jan 22, 2019·0 cites·16 claims
- 1139US2012079446A1Semiconductor module design method and semiconductor moduleKUMAKURA HIROMICHI·Filed 2011·Application pending·0 cites
- 1235US7067923B2Semiconductor device having hall-effect and manufacturing method thereofSANKEN ELECTRIC CO LTD·Filed 2003·Granted Jun 27, 2006·0 cites·15 claims
- 1334US2019035899A1Semiconductor Device and Method for Manufacturing the Semiconductor DeviceSANKEN ELECTRIC CO LTD·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →