Inventor · disambiguated record
Tsuyoshi Sugiyama
Also filed as: SUGIYAMA TSUYOSHI
22 granted patents·8 pending applications·326 citations·filing 1989–2018
96Inventor score
Top patents by PatentIndex Score
30 records- 0192US9745443B2Inorganic filler-containing epoxy resin cured product and laminate including the sameTDK CORP·Filed 2015·Granted Aug 29, 2017·5 cites·4 claims
- 0289US6682853B2Nonaqueous electrolyte secondary battery and method of manufacturing the sameSONY CORP·Filed 2001·Granted Jan 27, 2004·52 cites·13 claims
- 0385US7563539B2Non-aqueous electrolyte secondary batterySONY CORP·Filed 2005·Granted Jul 21, 2009·7 cites·4 claims
- 0484US6689177B2Nonaqueous-electrolyte secondary battery and method of manufacturing the sameSONY CORP·Filed 2001·Granted Feb 10, 2004·26 cites·7 claims
- 0584US4963707AResistance welding control systemNIPPON DENSO CO·Filed 1989·Granted Oct 16, 1990·49 cites·12 claims
- 0677US7223495B2Non-aqueous electrolyte secondary batterySONY CORP·Filed 2005·Granted May 29, 2007·3 cites·5 claims
- 0775US6967066B2Non-aqueous electrolyte secondary batterySONY CORP·Filed 2001·Granted Nov 22, 2005·12 cites·6 claims
- 0874US5955184AHalogen-free flame-retardant epoxy resin composition as well as prepreg and laminate containing the sameTOSHIBA CHEM CORP·Filed 1995·Granted Sep 21, 1999·49 cites·9 claims
- 0970US5804644AHydrogenerated rubber compositionASAHI CHEMICAL IND·Filed 1995·Granted Sep 8, 1998·44 cites·25 claims
- 1069US7052551B2Method of manufacturing a batterySONY CORP·Filed 2003·Granted May 30, 2006·8 cites·6 claims
- 1168US6884270B2Method of manufacturing a battery including a positive electrode, a negative electrode and an electrolyte layerSONY CORP·Filed 2001·Granted Apr 26, 2005·8 cites·15 claims
- 1267US8007937B2Battery packSONY CORP·Filed 2006·Granted Aug 30, 2011·1 cites·11 claims
- 1367US6776807B2Method of manufacturing a batterySONY CORP·Filed 2001·Granted Aug 17, 2004·7 cites·12 claims
- 1466US7573008B2PTC elementTDK CORP·Filed 2006·Granted Aug 11, 2009·3 cites·8 claims
- 1564US8323827B2Laminate packing material for battery and laminate batteryHATTA KAZUHITO·Filed 2006·Granted Dec 4, 2012·1 cites·16 claims
- 1662US6805720B1Electrode and gel electrolyte cell production methodSONY CORP·Filed 2000·Granted Oct 19, 2004·9 cites·18 claims
- 1758US7270913B2Nonaqueous-electrolyte secondary battery and method of manufacturing the sameSONY CORP·Filed 2003·Granted Sep 18, 2007·3 cites·6 claims
- 1858US5994429AHalogen-free flame-retardant epoxy resin compositionTOSHIBA CHEM CORP·Filed 1996·Granted Nov 30, 1999·19 cites·30 claims
- 1956US7524393B2Gel electrolyte batterySONY CORP·Filed 2003·Granted Apr 28, 2009·2 cites·11 claims
- 2052US6214455B1Bisphenol A and novolak epoxy resins with nitrogen-containing phenolic resinTOSHIBA CHEM CORP·Filed 1999·Granted Apr 10, 2001·18 cites·4 claims
- 2150US2005155215A1Method of manufacturing a batteryFiled 2005·Application pending·0 cites
- 2248US7160415B2Gel electrolyte batterySONY CORP·Filed 2003·Granted Jan 9, 2007·0 cites·12 claims
- 2348US2020377647A1Resin composition, resin sheet, cured resin product, resin substrate, and laminate substrateTDK CORP·Filed 2018·Application pending·0 cites
- 2448US2005281898A1Anti-tumor agent, beverages and foods using the same, and a process for manufacturing the anti-tumor agentVALIDUX CO LTD·Filed 2004·Application pending·0 cites
- 2546US2015118498A1Resin composition, resin sheet, cured resin product and substrateTDK CORP·Filed 2014·Application pending·0 cites
- 2645US10329403B2Resin composition, resin sheet, resin cured product, and resin substrateTDK CORP·Filed 2016·Granted Jun 25, 2019·0 cites·12 claims
- 2745US2018112029A1Resin composition, resin sheet, resin cured product, and resin substrateTDK CORP·Filed 2016·Application pending·0 cites
- 2844US2007075823A1ThermistorTDK CORP·Filed 2006·Application pending·0 cites
- 2943US2006099702A1Agent-containing Bacillus natto culture extract and preservation method of Bacillus natto culture extractOTO CORP·Filed 2005·Application pending·0 cites
- 3035US2003148107A1Halogen-free nonflammable epoxy resin composition, halogen-free nonfammable epoxy resin composition for build-up type multi-layer board, prepreg, copper-clad laminate, printed wiring board, copper foil-attached resin film, carrier-attached resin film, build-up type laminate, and build-up type multi-layer boardKYOCERA CHEM CORP·Filed 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →