Inventor · disambiguated record
Hiroshi Shimozawa
Also filed as: SHIMOZAWA HIROSHI
7 granted patents·197 citations·filing 1989–1995
87Inventor score
Top patents by PatentIndex Score
7 records- 0184US5223739APlastic molded semiconductor device having waterproof capTOSHIBA KK·Filed 1990·Granted Jun 29, 1993·82 cites·6 claims
- 0264US5272377AMaleimide resin composition and resin encapsulated semiconductor device manufactured using the compositionTOSHIBA KK·Filed 1991·Granted Dec 21, 1993·34 cites·12 claims
- 0360US5258426ASemiconductor device encapsulantTOSHIBA KK·Filed 1990·Granted Nov 2, 1993·29 cites·18 claims
- 0452US5789359ADetergent, method of cleaning, and apparatus for cleaningTOSHIBA SILICONE·Filed 1994·Granted Aug 4, 1998·25 cites·25 claims
- 0549US5068267ASemiconductor device encapsulant consisting of epoxy resin compositionTOSHIBA KK·Filed 1989·Granted Nov 26, 1991·17 cites·10 claims
- 0645US5438113AThermosetting resin compositionTOSHIBA KK·Filed 1993·Granted Aug 1, 1995·6 cites·10 claims
- 0737US5637667AThermosetting resin compositionTOSHIBA KK·Filed 1995·Granted Jun 10, 1997·4 cites·11 claims
Join the waitlist — get patent alerts
Get an alert when Hiroshi Shimozawa files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →