Inventor · disambiguated record
Chandra S. Tiwari
Also filed as: TIWARI CHANDRA · TIWARI CHANDRA S
30 granted patents·11 pending applications·10 citations·filing 2004–2025
93Inventor score
Top patents by PatentIndex Score
41 records- 0189US11444093B2Memory arrays and methods of forming memory arraysMICRON TECHNOLOGY INC·Filed 2020·Granted Sep 13, 2022·3 cites·28 claims
- 0285US2025301648A1Microelectronic devices including pillars with upper portions having perimeters interrputed by elongate isolation structuresLODESTAR LICENSING GROUP LLC·Filed 2025·Application pending·0 cites
- 0383US12324154B2Microelectronic devices including pillars with partially-circular upper portions and circular lower portions, and related methodsLODESTAR LICENSING GROUP LLC·Filed 2023·Granted Jun 3, 2025·0 cites·19 claims
- 0482US12279431B2Integrated assemblies and methods of forming integrated assembliesLODESTAR LICENSING GROUP LLC·Filed 2023·Granted Apr 15, 2025·0 cites·21 claims
- 0582US10002840B1Semiconductor devices having discretely located passivation material, and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2017·Granted Jun 19, 2018·3 cites·27 claims
- 0682US2025240962A1Integrated assemblies and methods of forming integrated assembliesLODESTAR LICENSING GROUP LLC·Filed 2025·Application pending·0 cites
- 0779US2025379103A1Microelectronic devices including slot structuresMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 0877US12063783B2Memory arrays and methods used in forming a memory array comprising strings of memory cellsLODESTAR LICENSING GROUP LLC·Filed 2023·Granted Aug 13, 2024·0 cites·2 claims
- 0977US11800717B2Microelectronic devices including isolation structures protruding into upper pillar portions, and related methods and systemsMICRON TECHNOLOGY INC·Filed 2022·Granted Oct 24, 2023·0 cites·20 claims
- 1077US11706924B2Integrated assemblies and methods of forming integrated assembliesMICRON TECHNOLOGY INC·Filed 2022·Granted Jul 18, 2023·0 cites·10 claims
- 1175US12069856B2Methods of forming electronic devices using materials removable at different temperaturesMICRON TECHNOLOGY INC·Filed 2022·Granted Aug 20, 2024·0 cites·20 claims
- 1275US11205654B2Memory arrays and methods used in forming a memory array comprising strings of memory cellsMICRON TECHNOLOGY INC·Filed 2019·Granted Dec 21, 2021·2 cites·25 claims
- 1372US11329064B2Integrated assemblies and methods of forming integrated assembliesMICRON TECHNOLOGY INC·Filed 2020·Granted May 10, 2022·0 cites·22 claims
- 1472US11322516B2Microelectronic devices including isolation structures protruding into upper pillar portions, and related methods and systemsMICRON TECHNOLOGY INC·Filed 2020·Granted May 3, 2022·0 cites·25 claims
- 1571US12205900B2Electronic devices comprising a compressive dielectric material, and related systems and methodsMICRON TECHNOLOGY INC·Filed 2022·Granted Jan 21, 2025·0 cites·20 claims
- 1671US11626423B2Memory arrays and methods used in forming a memory array comprising strings of memory cellsMICRON TECHNOLOGY INC·Filed 2021·Granted Apr 11, 2023·0 cites·8 claims
- 1768US11700729B2Memory arrays and methods used in forming a memory array comprising strings of memory cellsMICRON TECHNOLOGY INC·Filed 2021·Granted Jul 11, 2023·0 cites·20 claims
- 1868US10790251B2Methods for enhancing adhesion of three-dimensional structures to substratesMICRON TECHNOLOGY INC·Filed 2018·Granted Sep 29, 2020·1 cites·19 claims
- 1965US2025157935A1Electronic devices comprising a compressive dielectric materialMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 2064US12406886B2Microelectronic devices including slot structures, and related electronic systems and methods of forming the microelectronic devicesMICRON TECHNOLOGY INC·Filed 2022·Granted Sep 2, 2025·0 cites·25 claims
- 2164US11075219B2Memory arrays and methods used in forming a memory array comprising strings of memory cellsMICRON TECHNOLOGY INC·Filed 2019·Granted Jul 27, 2021·0 cites·20 claims
- 2263US11476268B2Methods of forming electronic devices using materials removable at different temperaturesMICRON TECHNOLOGY INC·Filed 2020·Granted Oct 18, 2022·0 cites·28 claims
- 2363US11276658B2Devices with three-dimensional structures and support elements to increase adhesion to substratesMICRON TECHNOLOGY INC·Filed 2020·Granted Mar 15, 2022·0 cites·19 claims
- 2462US11402426B2Inductive testing probe apparatus for testing semiconductor die and related systems and methodsMICRON TECHNOLOGY INC·Filed 2020·Granted Aug 2, 2022·0 cites·20 claims
- 2558US10896886B2Semiconductor devices having discretely located passivation material, and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2019·Granted Jan 19, 2021·0 cites·27 claims
- 2657US7820545B2Methods of forming conductive interconnectsMICRON TECHNOLOGY INC·Filed 2008·Granted Oct 26, 2010·0 cites·19 claims
- 2757US2024071819A1Stress mitigation for three-dimensional metal contactsMICRON TECHNOLOGY INC·Filed 2023·Application pending·0 cites
- 2856US11094684B2Edge cut debond using a temporary filler material with no adhesive properties and edge cut debond using an engineered carrier to enable topographyMICRON TECHNOLOGY INC·Filed 2019·Granted Aug 17, 2021·0 cites·20 claims
- 2956US10262961B2Semiconductor devices having discretely located passivation material, and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2018·Granted Apr 16, 2019·0 cites·27 claims
- 3055US11302712B2Integrated circuitry, memory arrays comprising strings of memory cells, methods used in forming integrated circuitry, and methods used in forming a memory array comprising strings of memory cellsMICRON TECHNOLOGY INC·Filed 2020·Granted Apr 12, 2022·0 cites·35 claims
- 3154US10852344B2Inductive testing probe apparatus for testing semiconductor die and related systems and methodsMICRON TECHNOLOGY INC·Filed 2017·Granted Dec 1, 2020·0 cites·30 claims
- 3254US2024071932A1Memory Circuitry And Method Used In Forming Memory CircuitryMICRON TECHNOLOGY INC·Filed 2022·Application pending·0 cites
- 3352US10403618B2Edge cut debond using a temporary filler material with no adhesive properties and edge cut debond using an engineered carrier to enable topographyMICRON TECHNOLOGY INC·Filed 2017·Granted Sep 3, 2019·0 cites·17 claims
- 3451US7358170B2Methods of forming conductive interconnects, and methods of depositing nickelMICRON TECHNOLOGY INC·Filed 2005·Granted Apr 15, 2008·0 cites·27 claims
- 3549US6933231B1Methods of forming conductive interconnects, and methods of depositing nickelMICRON TECHNOLOGY INC·Filed 2004·Granted Aug 23, 2005·1 cites·19 claims
- 3649US2024047346A1Memory Circuitry And Method Used In Forming Memory CircuitryMICRON TECHNOLOGY INC·Filed 2022·Application pending·0 cites
- 3746US8062969B2Methods of selectively growing nickel-containing materialsTIWARI CHANDRA·Filed 2010·Granted Nov 22, 2011·0 cites·10 claims
- 3843US2006263528A1Electroless metal deposition methodsTIWARI CHANDRA·Filed 2006·Application pending·0 cites
- 3942US2007045120A1Methods and apparatus for filling features in microfeature workpiecesMICRON TECHNOLOGY INC·Filed 2005·Application pending·0 cites
- 4038US2005194255A1Self-activated electroless metal depositionFiled 2004·Application pending·0 cites
- 4136US2006035016A1Electroless metal deposition methodsTIWARI CHANDRA·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →