Inventor · disambiguated record
Jae Gwon Jang
Also filed as: JANG JAE-GWON
15 granted patents·7 pending applications·37 citations·filing 2011–2023
89Inventor score
Top patents by PatentIndex Score
22 records- 0196US11404346B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Aug 2, 2022·7 cites·20 claims
- 0288US10074799B2Magneto-resistive chip package including shielding structureJANG JAE GWON·Filed 2016·Granted Sep 11, 2018·7 cites·19 claims
- 0385US9893020B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Feb 13, 2018·5 cites·10 claims
- 0484US9224699B2Method of manufacturing semiconductor package having magnetic shield unitJANG JAE-GWON·Filed 2014·Granted Dec 29, 2015·7 cites·20 claims
- 0581US11328970B2Methods of fabricating semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted May 10, 2022·1 cites·17 claims
- 0677US9024448B2Lower semiconductor molding die, semiconductor package, and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted May 5, 2015·4 cites·15 claims
- 0777US8884446B2Semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Nov 11, 2014·4 cites·19 claims
- 0876US9627327B2Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Apr 18, 2017·2 cites·13 claims
- 0970US12046526B2Methods of fabricating semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jul 23, 2024·0 cites·16 claims
- 1069US12009277B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jun 11, 2024·0 cites·20 claims
- 1169US11715645B2Method for fabricating semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Aug 1, 2023·0 cites·20 claims
- 1261US11322368B2Method for fabricating semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted May 3, 2022·0 cites·20 claims
- 1356US2024170413A1Semiconductor package with marking patternsSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1453US10923650B2Magneto-resistive chip package including shielding structureSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Feb 16, 2021·0 cites·20 claims
- 1551US11121064B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Sep 14, 2021·0 cites·20 claims
- 1651US8951835B2Method of fabricating a package substrateSAMSUNG ELECTRO MECH·Filed 2013·Granted Feb 10, 2015·0 cites·12 claims
- 1751US2023068587A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 1843US2014103523A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2013·Application pending·0 cites
- 1943US2011248408A1Package substrate and fabricating method thereofUNIV SUNGKYUNKWAN FOUND·Filed 2011·Application pending·0 cites
- 2036US2017294407A1Passive element package and semiconductor module comprising the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Application pending·0 cites
- 2133US2016064365A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2015·Application pending·0 cites
- 2233US2015357298A1Semiconductor chip, semiconductor package having the same and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2015·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →