Inventor · disambiguated record
Kian-Hock Lim
Also filed as: LIM KIAN HOCK
11 granted patents·2 pending applications·9 citations·filing 2009–2018
82Inventor score
Files withADVANPACK SOLUTIONS PTE LTD7CHEW HWEE-SENG JIMMY2LIM SHOA SIONG2CHEW HWEE SENG1CHEW JIMMY HWEE SENG1
Top patents by PatentIndex Score
13 records- 0177US8709874B2Manufacturing method for semiconductor device carrier and semiconductor package using the sameCHEW HWEE-SENG JIMMY·Filed 2011·Granted Apr 29, 2014·4 cites·28 claims
- 0275US9219027B2Semiconductor device carrier and semiconductor package using the sameADVANPACK SOLUTIONS PTE LTD·Filed 2014·Granted Dec 22, 2015·3 cites·21 claims
- 0367US8917521B2Etch-back type semiconductor package, substrate and manufacturing method thereofCHEW HWEE-SENG JIMMY·Filed 2011·Granted Dec 23, 2014·2 cites·23 claims
- 0453US9305868B2Manufacturing method of forming an etch-back type semiconductor package with locking anchoragesADVANPACK SOLUTIONS PTE LTD·Filed 2014·Granted Apr 5, 2016·0 cites·22 claims
- 0552US10763133B2Semiconductor structure and semiconductor package device using the sameADVANPACK SOLUTIONS PTE LTD·Filed 2018·Granted Sep 1, 2020·0 cites·10 claims
- 0651US9583449B2Semiconductor packageADVANPACK SOLUTIONS PTE LTD·Filed 2015·Granted Feb 28, 2017·0 cites·13 claims
- 0749US9847268B2Semiconductor package and manufacturing method thereofLIM SHOA SIONG·Filed 2009·Granted Dec 19, 2017·0 cites·29 claims
- 0848US2018108584A1Semiconductor SubstrateADVANPACK SOLUTIONS PTE LTD·Filed 2017·Application pending·0 cites
- 0947US9120169B2Method for device packagingCHEW HWEE SENG·Filed 2009·Granted Sep 1, 2015·0 cites·17 claims
- 1046US9059050B2Manufacturing methods of semiconductor substrate, package and deviceADVANPACK SOLUTIONS PTE LTD·Filed 2014·Granted Jun 16, 2015·0 cites·30 claims
- 1146US8664750B2Semiconductor substrate, package and deviceLIM SHOA SIONG·Filed 2009·Granted Mar 4, 2014·0 cites·37 claims
- 1243US2015287673A1Semiconductor packageADVANPACK SOLUTIONS PTE LTD·Filed 2015·Application pending·0 cites
- 1342US10109503B2Method of manufacturing semiconductor package deviceCHEW JIMMY HWEE SENG·Filed 2012·Granted Oct 23, 2018·0 cites·27 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →