Inventor · disambiguated record
Wen-Kai Wan
Also filed as: WAN WEN-KAI
15 granted patents·2 pending applications·176 citations·filing 2003–2023
93Inventor score
Top patents by PatentIndex Score
17 records- 0191US7791070B2Semiconductor device fault detection system and methodTAIWAN SEMICONDUCTOR MFG·Filed 2005·Granted Sep 7, 2010·25 cites·20 claims
- 0289US7880303B2Stacked contact with low aspect ratioTAIWAN SEMICONDUCTOR MFG·Filed 2007·Granted Feb 1, 2011·16 cites·19 claims
- 0383US11587846B2Semiconductor device and method of forming the sameMEDIATEK INC·Filed 2020·Granted Feb 21, 2023·1 cites·20 claims
- 0483US7741714B2Bond pad structure with stress-buffering layer capping interconnection metal layerTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Jun 22, 2010·36 cites·32 claims
- 0573US12191226B2Method of manufacturing heat dissipation substrate with high thermal conductivity for semiconductor deviceMEDIATEK INC·Filed 2023·Granted Jan 7, 2025·0 cites·18 claims
- 0673US7291557B2Method for forming an interconnection structure for ic metallizationTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Nov 6, 2007·20 cites·16 claims
- 0773US6746900B1Method for forming a semiconductor device having high-K gate dielectric materialTAIWAN SEMICONDUCTOR MFG·Filed 2003·Granted Jun 8, 2004·17 cites·25 claims
- 0871US8053894B2Surface treatment of metal interconnect linesTAIWAN SEMICONDUCTOR MFG·Filed 2005·Granted Nov 8, 2011·3 cites·24 claims
- 0971US6831365B1Method and pattern for reducing interconnect failuresTAIWAN SEMICONDUCTOR MFG·Filed 2003·Granted Dec 14, 2004·18 cites·17 claims
- 1070US7042097B2Structure for reducing stress-induced voiding in an interconnect of integrated circuitsTAIWAN SEMICONDUCTOR MFG·Filed 2003·Granted May 9, 2006·14 cites·20 claims
- 1170US6955984B2Surface treatment of metal interconnect linesTAIWAN SEMICONDUCTOR MFG·Filed 2003·Granted Oct 18, 2005·12 cites·34 claims
- 1263US7271103B2Surface treated low-k dielectric as diffusion barrier for copper metallizationTAIWAN SEMICONDUCTOR MFG·Filed 2003·Granted Sep 18, 2007·8 cites·12 claims
- 1355US7777338B2Seal ring structure for integrated circuit chipsTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Aug 17, 2010·6 cites·50 claims
- 1447US8450200B2Method for stacked contact with low aspect ratioYU CHEN-HUA·Filed 2010·Granted May 28, 2013·0 cites·20 claims
- 1543US2006055002A1Methods for enhancing die saw and packaging reliabilityTAIWAN SEMICONDUCTOR MFG·Filed 2005·Application pending·0 cites
- 1641US10741469B2Thermal via arrangement for multi-channel semiconductor deviceMEDIATEK INC·Filed 2017·Granted Aug 11, 2020·0 cites·18 claims
- 1740US2006108696A1Structure for reducing stress-induced voiding in an interconnect of integrated circuitsYAO CHIH-HSIANG·Filed 2006·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →