Inventor · disambiguated record
Donald C. Abbott
Also filed as: ABBOTT DONALD · ABBOTT DONALD C · ABBOTT DONALD CHARLES
83 granted patents·16 pending applications·2,335 citations·filing 1991–2020
99Inventor score
Files withTEXAS INSTRUMENTS INC83ABBOTT DONALD C8SIMMONS-MATTHEWS MARGARET R2ABBOTT DONALD CHARLES1ZUNIGA-ORTIZ EDGAR R1
Top patents by PatentIndex Score
99 records- 0198US6683380B2Integrated circuit with bonding layer over active circuitryTEXAS INSTRUMENTS INC·Filed 2002·Granted Jan 27, 2004·274 cites·11 claims
- 0297US6337445B1Composite connection structure and method of manufacturingTEXAS INSTRUMENTS INC·Filed 1999·Granted Jan 8, 2002·173 cites·24 claims
- 0396US7851928B2Semiconductor device having substrate with differentially plated copper and selective solderTEXAS INSTRUMENTS INC·Filed 2008·Granted Dec 14, 2010·64 cites·20 claims
- 0496US7504716B2Structure and method of molded QFN device suitable for miniaturization, multiple rows and stackingTEXAS INSTRUMENTS INC·Filed 2005·Granted Mar 17, 2009·42 cites·20 claims
- 0596US6194777B1Leadframes with selective palladium platingTEXAS INSTRUMENTS INC·Filed 1998·Granted Feb 27, 2001·244 cites·2 claims
- 0696US6144100AIntegrated circuit with bonding layer over active circuitryTEXAS INSTRUMENTS INC·Filed 1997·Granted Nov 7, 2000·256 cites·17 claims
- 0795US5633528ALead frame structure for IC devices with strengthened encapsulation adhesionTEXAS INSTRUMENTS INC·Filed 1995·Granted May 27, 1997·207 cites·11 claims
- 0894US8587099B1Leadframe having selective planishingABBOTT DONALD C·Filed 2012·Granted Nov 19, 2013·13 cites·7 claims
- 0991US9165873B1Semiconductor package having etched foil capacitor integrated into leadframeTEXAS INSTRUMENTS INC·Filed 2014·Granted Oct 20, 2015·10 cites·14 claims
- 1091US9059185B2Copper leadframe finish for copper wire bondingTEXAS INSTRUMENTS INC·Filed 2013·Granted Jun 16, 2015·12 cites·7 claims
- 1190US8044495B2Metallic leadframes having laser-treated surfaces for improved adhesion to polymeric compoundsTEXAS INSTRUMENTS INC·Filed 2009·Granted Oct 25, 2011·15 cites·15 claims
- 1290US6376901B1Palladium-spot leadframes for solder plated semiconductor devices and method of fabricationTEXAS INSTRUMENTS INC·Filed 2000·Granted Apr 23, 2002·56 cites·16 claims
- 1390US6365974B1Flex circuit substrate for an integrated circuit packageTEXAS INSTRUMENTS INC·Filed 2000·Granted Apr 2, 2002·73 cites·9 claims
- 1489US7192809B2Low cost method to produce high volume lead framesTEXAS INSTRUMENTS INC·Filed 2005·Granted Mar 20, 2007·15 cites·20 claims
- 1588US8158460B2Method of forming metallic leadframes having laser-treated surfaces for improved adhesion to polymeric compoundsABBOTT DONALD C·Filed 2011·Granted Apr 17, 2012·8 cites·10 claims
- 1688US6583500B1Thin tin preplated semiconductor leadframesTEXAS INSTRUMENTS INC·Filed 2002·Granted Jun 24, 2003·53 cites·16 claims
- 1786US8227295B2IC die having TSV and wafer level underfill and stacked IC devices comprising a workpiece solder connected to the TSVSIMMONS-MATTHEWS MARGARET R·Filed 2009·Granted Jul 24, 2012·17 cites·11 claims
- 1885US6828660B2Semiconductor device with double nickel-plated leadframeTEXAS INSTRUMENTS INC·Filed 2003·Granted Dec 7, 2004·37 cites·13 claims
- 1984US8242614B2Thermally improved semiconductor QFN/SON packageABBOTT DONALD C·Filed 2010·Granted Aug 14, 2012·6 cites·9 claims
- 2083US7788800B2Method for fabricating a leadframeTEXAS INSTRUMENTS INC·Filed 2007·Granted Sep 7, 2010·9 cites·9 claims
- 2183US7368807B2Low cost method to produce high volume lead framesTEXAS INSTRUMENTS INC·Filed 2007·Granted May 6, 2008·9 cites·18 claims
- 2282US6953986B2Leadframes for high adhesion semiconductor devices and method of fabricationTEXAS INSTRUMENTS INC·Filed 2000·Granted Oct 11, 2005·26 cites·1 claims
- 2382US6713852B2Semiconductor leadframes plated with thick nickel, minimum palladium, and pure tinTEXAS INSTRUMENTS INC·Filed 2002·Granted Mar 30, 2004·28 cites·15 claims
- 2481US9006038B2Selective leadframe planishingTEXAS INSTRUMENTS INC·Filed 2013·Granted Apr 14, 2015·3 cites·4 claims
- 2581US8963300B2Semiconductor device with selective planished leadframeTEXAS INSTRUMENTS INC·Filed 2013·Granted Feb 24, 2015·3 cites·7 claims
- 2681US8697496B1Method of manufacture integrated circuit packageTEXAS INSTRUMENTS INC·Filed 2012·Granted Apr 15, 2014·7 cites·15 claims
- 2781US8138026B2Low cost lead-free preplated leadframe having improved adhesion and solderabilityABBOTT DONALD C·Filed 2010·Granted Mar 20, 2012·4 cites·2 claims
- 2881US7268415B2Semiconductor device having post-mold nickel/palladium/gold plated leadsTEXAS INSTRUMENTS INC·Filed 2004·Granted Sep 11, 2007·27 cites·13 claims
- 2981US6915566B2Method of fabricating flexible circuits for integrated circuit interconnectionsTEXAS INSTRUMENTS INC·Filed 2000·Granted Jul 12, 2005·35 cites·1 claims
- 3080US7368328B2Semiconductor device having post-mold nickel/palladium/gold plated leadsTEXAS INSTRUMENTS INC·Filed 2007·Granted May 6, 2008·8 cites·10 claims
- 3180US5384155ASilver spot/palladium plate lead frame finishTEXAS INSTRUMENTS INC·Filed 1992·Granted Jan 24, 1995·51 cites·8 claims
- 3279US7535104B2Structure and method for bond pads of copper-metallized integrated circuitsTEXAS INSTRUMENTS INC·Filed 2007·Granted May 19, 2009·7 cites·14 claims
- 3379US7411303B2Semiconductor assembly having substrate with electroplated contact padsTEXAS INSTRUMENTS INC·Filed 2007·Granted Aug 12, 2008·7 cites·16 claims
- 3479US6545344B2Semiconductor leadframes plated with lead-free solder and minimum palladiumTEXAS INSTRUMENTS INC·Filed 2001·Granted Apr 8, 2003·26 cites·22 claims
- 3579US5352633ASemiconductor lead frame lead stabilizationTEXAS INSTRUMENTS INC·Filed 1992·Granted Oct 4, 1994·49 cites·10 claims
- 3678US9373572B2Semiconductor package having etched foil capacitor integrated into leadframeTEXAS INSTRUMENTS INC·Filed 2015·Granted Jun 21, 2016·2 cites·20 claims
- 3777US5561320ASilver spot/palladium plate lead frame finishTEXAS INSTRUMENTS INC·Filed 1994·Granted Oct 1, 1996·43 cites·6 claims
- 3875US7608916B2Aluminum leadframes for semiconductor QFN/SON devicesTEXAS INSTRUMENTS INC·Filed 2006·Granted Oct 27, 2009·5 cites·11 claims
- 3975US7245006B2Palladium-spot leadframes for high adhesion semiconductor devices and method of fabricationTEXAS INSTRUMENTS INC·Filed 2005·Granted Jul 17, 2007·5 cites·16 claims
- 4075US7179738B2Semiconductor assembly having substrate with electroplated contact padsTEXAS INSTRUMENTS INC·Filed 2004·Granted Feb 20, 2007·20 cites·10 claims
- 4174US7413974B2Copper-metallized integrated circuits having electroless thick copper bond padsTEXAS INSTRUMENTS INC·Filed 2005·Granted Aug 19, 2008·5 cites·9 claims
- 4273US7309909B2Leadframes for improved moisture reliability of semiconductor devicesTEXAS INSTRUMENTS INC·Filed 2005·Granted Dec 18, 2007·4 cites·12 claims
- 4373US7148085B2Gold spot plated leadframes for semiconductor devices and method of fabricationTEXAS INSTRUMENTS INC·Filed 2003·Granted Dec 12, 2006·17 cites·6 claims
- 4473US6706561B2Method for fabricating preplated nickel/palladium and tin leadframesTEXAS INSTRUMENTS INC·Filed 2002·Granted Mar 16, 2004·17 cites·9 claims
- 4572US7928574B2Semiconductor package having buss-less substrateTEXAS INSTRUMENTS INC·Filed 2008·Granted Apr 19, 2011·4 cites·10 claims
- 4672US7863103B2Thermally improved semiconductor QFN/SON packageTEXAS INSTRUMENTS INC·Filed 2008·Granted Jan 4, 2011·4 cites·11 claims
- 4771US11230783B2Method and system for electroplating a MEMS deviceTEXAS INSTRUMENTS INC·Filed 2020·Granted Jan 25, 2022·0 cites·12 claims
- 4871US5429992ALead frame structure for IC devices with strengthened encapsulation adhesionTEXAS INSTRUMENTS INC·Filed 1994·Granted Jul 4, 1995·37 cites·7 claims
- 4970US9972506B2Selective planishing method for making a semiconductor deviceTEXAS INSTRUMENTS INC·Filed 2015·Granted May 15, 2018·1 cites·21 claims
- 5069US6245448B1Lead frame with reduced corrosionTEXAS INSTRUMENTS INC·Filed 1994·Granted Jun 12, 2001·38 cites·44 claims
Showing the top 50 of 99 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →