Inventor · disambiguated record
Terutaka Mori
Also filed as: MORI TERUTAKA
11 granted patents·5 pending applications·187 citations·filing 1998–2010
92Inventor score
Top patents by PatentIndex Score
16 records- 0189US6305230B1Connector and probing systemHITACHI LTD·Filed 1998·Granted Oct 23, 2001·79 cites·14 claims
- 0280US7351597B2Fabrication method of semiconductor integrated circuit deviceRENESAS TECH CORP·Filed 2007·Granted Apr 1, 2008·10 cites·9 claims
- 0379US7219422B2Fabrication method of semiconductor integrated circuit deviceRENESAS TECH CORP·Filed 2004·Granted May 22, 2007·21 cites·8 claims
- 0479US6455335B1Semiconductor device and manufacturing method thereof including a probe test step and a burn-in test stepHITACHI LTD·Filed 2000·Granted Sep 24, 2002·17 cites·10 claims
- 0577US6566150B2Semiconductor device and manufacturing method thereof including a probe test step and a burn-in test stepHITACHI LTD·Filed 2002·Granted May 20, 2003·15 cites·1 claims
- 0676US6759258B2Connection device and test systemRENESAS TECH CORP·Filed 2001·Granted Jul 6, 2004·14 cites·17 claims
- 0764US7541202B2Connection device and test systemRENESAS TECH CORP·Filed 2007·Granted Jun 2, 2009·1 cites·10 claims
- 0854US7285430B2Connection device and test systemHITACHI LTD·Filed 2004·Granted Oct 23, 2007·3 cites·8 claims
- 0953US6197603B1Semiconductor device and manufacturing method thereof including a probe test step and a burn-in test stepHITACHI LTD·Filed 1998·Granted Mar 6, 2001·12 cites·4 claims
- 1052US2009209053A1Connection device and test systemKASUKABE SUSUMU·Filed 2009·Application pending·0 cites
- 1150US7198962B2Semiconductor device and manufacturing method thereof including a probe test step and a burn-in test stepHITACHI LTD·Filed 2003·Granted Apr 3, 2007·3 cites·5 claims
- 1248US2006094162A1Thin film probe sheet and semiconductor chip inspection systemYABUSHITA AKIRA·Filed 2005·Application pending·0 cites
- 1346US2011014727A1Thin film probe sheet and semiconductor chip inspection systemYABUSHITA AKIRA·Filed 2010·Application pending·0 cites
- 1443US7390732B1Method for producing a semiconductor device with pyramidal bump electrodes bonded onto pad electrodes arranged on a semiconductor chipHITACHI LTD·Filed 1998·Granted Jun 24, 2008·12 cites·29 claims
- 1541US2006043593A1Connecting apparatus, semiconductor chip inspecting apparatus, and method for manufacturing semiconductor deviceMORI TERUTAKA·Filed 2005·Application pending·0 cites
- 1640US2008029763A1Transmission Circuit, Connecting Sheet, Probe Sheet, Probe Card, Semiconductor Inspection System and Method of Manufacturing Semiconductor DeviceKASUKABE SUSUMU·Filed 2007·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Terutaka Mori files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →