Inventor · disambiguated record
Aldona Jagminiene
Also filed as: JAGMINIENE ALDONA
9 granted patents·4 pending applications·86 citations·filing 2006–2023
86Inventor score
Files withLAM RES CORP9VALSTYBINIS MOKSLINIU TYRIMU INSTITUTAS FIZINIU IR TECH MOKSLU CENTRAS3VALSTYBINIS MOKSLINIU TYRIMU INSTITUTAS FIZINIU IR TECH MOSKLU CENTRAS1
Top patents by PatentIndex Score
13 records- 0192US9469902B2Electroless deposition of continuous platinum layerLAM RES CORP·Filed 2014·Granted Oct 18, 2016·13 cites·26 claims
- 0292US7306662B2Plating solution for electroless deposition of copperLAM RES CORP·Filed 2006·Granted Dec 11, 2007·22 cites·20 claims
- 0392US7297190B1Plating solutions for electroless deposition of copperLAM RES CORP·Filed 2006·Granted Nov 20, 2007·36 cites·25 claims
- 0488US7794530B2Electroless deposition of cobalt alloysLAM RES CORP·Filed 2006·Granted Sep 14, 2010·10 cites·13 claims
- 0573US9428836B2Electroless deposition of continuous cobalt layer using complexed Ti3+ metal ions as reducing agentsLAM RES CORP·Filed 2014·Granted Aug 30, 2016·3 cites·20 claims
- 0663US9499913B2Electroless deposition of continuous platinum layer using complexed Co2+ metal ion reducing agentLAM RES CORP·Filed 2014·Granted Nov 22, 2016·1 cites·20 claims
- 0763US2025075330A1Plating solution for high rate electroless deposition of copperVALSTYBINIS MOKSLINIU TYRIMU INSTITUTAS FIZINIU IR TECH MOSKLU CENTRAS·Filed 2023·Application pending·0 cites
- 0860US10982328B2Method for formation of electro-conductive traces on polymeric article surfaceVALSTYBINIS MOKSLINIU TYRIMU INSTITUTAS FIZINIU IR TECH MOKSLU CENTRAS·Filed 2017·Granted Apr 20, 2021·1 cites·11 claims
- 0959US12336114B2Method for selective metallisation of inorganic dielectrics or semiconductorsVALSTYBINIS MOKSLINIU TYRIMU INSTITUTAS FIZINIU IR TECH MOKSLU CENTRAS·Filed 2023·Granted Jun 17, 2025·0 cites·21 claims
- 1059US7988774B2Electroless deposition of cobalt alloysLAM RES CORP·Filed 2010·Granted Aug 2, 2011·0 cites·17 claims
- 1154US2015307994A1ELECTROLESS DEPOSITION OF CONTINUOUS NICKEL LAYER USING COMPLEXED Ti3+ METAL IONS AS REDUCING AGENTSLAM RES CORP·Filed 2014·Application pending·0 cites
- 1247US2022064801A1Method for electroless nickel deposition onto copper without activation with palladiumVALSTYBINIS MOKSLINIU TYRIMU INSTITUTAS FIZINIU IR TECH MOKSLU CENTRAS·Filed 2020·Application pending·0 cites
- 1342US2015307995A1ELECTROLESS DEPOSITION OF CONTINUOUS PALLADIUM LAYER USING COMPLEXED Co2+ METAL IONS OR Ti3+ METAL IONS AS REDUCING AGENTSLAM RES CORP·Filed 2014·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →