Inventor · disambiguated record
Jicheng Yang
Also filed as: YANG JICHENG
21 granted patents·3 pending applications·670 citations·filing 1999–2021
96Inventor score
Files withMICRON TECHNOLOGY INC9INVENSENSE INC3AMKOR TECHNOLOGY INC2ANALOG DEVICES INC2YANG JICHENG2
Top patents by PatentIndex Score
24 records- 0195US6759307B1Method to prevent die attach adhesive contamination in stacked chipsMICRON TECHNOLOGY INC·Filed 2000·Granted Jul 6, 2004·90 cites·51 claims
- 0294US8577063B2Packages and methods for packaging MEMS microphone devicesYANG JICHENG·Filed 2011·Granted Nov 5, 2013·23 cites·21 claims
- 0394US6274930B1Multi-chip module with stacked diceMICRON TECHNOLOGY INC·Filed 2000·Granted Aug 14, 2001·84 cites·20 claims
- 0493US8853839B2Air-release features in cavity packagesANALOG DEVICES INC·Filed 2012·Granted Oct 7, 2014·66 cites·53 claims
- 0592US8447057B2Packages and methods for packaging MEMS microphone devicesGOIDA THOMAS·Filed 2011·Granted May 21, 2013·34 cites·25 claims
- 0692US6620648B2Multi-chip module with extensionMICRON TECHNOLOGY INC·Filed 2001·Granted Sep 16, 2003·62 cites·15 claims
- 0791US6207467B1Multi-chip module with stacked diceMICRON TECHNOLOGY INC·Filed 1999·Granted Mar 27, 2001·107 cites·20 claims
- 0889US7078264B2Stacked semiconductor dieMICRON TECHNOLOGY INC·Filed 2004·Granted Jul 18, 2006·43 cites·18 claims
- 0988US6807218B1Laser module and optical subassemblyAMKOR TECHNOLOGY INC·Filed 2002·Granted Oct 19, 2004·26 cites·29 claims
- 1086US7224070B2Plurality of semiconductor die in an assemblyMICRON TECHNOLOGY INC·Filed 2004·Granted May 29, 2007·34 cites·48 claims
- 1186US7145253B1Encapsulated sensor deviceAMKOR TECHNOLOGY INC·Filed 2004·Granted Dec 5, 2006·57 cites·17 claims
- 1284US8723308B2Packages and methods for packaging using a lid having multiple conductive layersYANG JICHENG·Filed 2011·Granted May 13, 2014·10 cites·20 claims
- 1383US11518883B2Curable silicone compositionsELKEM SILICONES SHANGHAI CO LTD·Filed 2017·Granted Dec 6, 2022·5 cites·48 claims
- 1480US9338559B2Microphone system with a stop memberINVENSENSE INC·Filed 2013·Granted May 10, 2016·6 cites·21 claims
- 1572US9142470B2Packages and methods for packagingANALOG DEVICES INC·Filed 2014·Granted Sep 22, 2015·3 cites·20 claims
- 1664US9258634B2Microphone system with offset aperturesINVENSENSE INC·Filed 2013·Granted Feb 9, 2016·1 cites·19 claims
- 1764US9002040B2Packages and methods for packaging MEMS microphone devicesINVENSENSE INC·Filed 2013·Granted Apr 7, 2015·1 cites·17 claims
- 1863US6580160B2Coupling spaced bond pads to a contactMICRON TECHNOLOGY INC·Filed 2002·Granted Jun 17, 2003·7 cites·5 claims
- 1962US8779535B2Packaged integrated device die between an external and internal housingGOIDA THOMAS M·Filed 2012·Granted Jul 15, 2014·2 cites·30 claims
- 2051US2021242543A1Battery pack with attached system moduleAPPLE INC·Filed 2021·Application pending·0 cites
- 2150US6909167B2Coupling spaced bond pads to a contactMICRON TECHNOLOGY INC·Filed 2004·Granted Jun 21, 2005·2 cites·8 claims
- 2245US6453547B1Coupling spaced bond pads to a contactMICRON TECHNOLOGY INC·Filed 1999·Granted Sep 24, 2002·7 cites·26 claims
- 2341US2004256708A1Multi-chip module with extensionFiled 2003·Application pending·0 cites
- 2430US2002047196A1Multi-chip module with extensionFiled 1999·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →