Inventor · disambiguated record
Takafumi Konno
Also filed as: KONNO TAKAFUMI
18 granted patents·5 pending applications·297 citations·filing 1997–2020
95Inventor score
Top patents by PatentIndex Score
23 records- 0194US11674083B2Thermoplastic liquid crystal polymer and film of sameKURARAY CO·Filed 2019·Granted Jun 13, 2023·12 cites·14 claims
- 0294US9538646B2Thermoplastic liquid crystal polymer film, and laminate and circuit board using sameKURARAY CO·Filed 2014·Granted Jan 3, 2017·25 cites·14 claims
- 0392US6232650B1Semiconductor device having a chip mounted on a flexible substrate with separated insulation layers to prevent short-circuitingHITACHI LTD·Filed 1998·Granted May 15, 2001·94 cites·9 claims
- 0480US6551862B2Semiconductor device and method of manufacturing the sameHITACHI LTD·Filed 2001·Granted Apr 22, 2003·37 cites·11 claims
- 0575US6764878B2Method of manufacturing a resin encapsulated semiconductor device to provide a vent hole in a base substrateRENESAS TECH CORP·Filed 2002·Granted Jul 20, 2004·13 cites·8 claims
- 0674US8466540B2Semiconductor device and manufacturing method thereforTANAKA SHIGEKI·Filed 2010·Granted Jun 18, 2013·5 cites·12 claims
- 0770US6590275B2Ball grid array type semiconductor package having a flexible substrateHITACHI LTD·Filed 2002·Granted Jul 8, 2003·10 cites·15 claims
- 0868US6437428B1Ball grid array type semiconductor package having a flexible substrateHITACHI HOKKAI SEMICONDUCTOR·Filed 2000·Granted Aug 20, 2002·9 cites·2 claims
- 0967US6265762B1Lead frame and semiconductor device using the lead frame and method of manufacturing the sameHITACHI LTD·Filed 1997·Granted Jul 24, 2001·41 cites·18 claims
- 1065US6396142B1Semiconductor deviceHITACHI LTD·Filed 1999·Granted May 28, 2002·21 cites·23 claims
- 1160US6887739B2Method of manufacturing semiconductor package including forming a resin sealing memberHITACHI HOKKAI SEMICONDUCTOR·Filed 2003·Granted May 3, 2005·5 cites·9 claims
- 1257US6803258B2Semiconductor deviceRENESAS TECH CORP·Filed 2002·Granted Oct 12, 2004·5 cites·8 claims
- 1357US6476466B2Ball grid array type semiconductor package having a flexible substrateHITACHI HOKKAI SEMICONDUCTOR·Filed 2002·Granted Nov 5, 2002·4 cites·1 claims
- 1457US6448111B1Method of manufacturing a semiconductor deviceHITACHI HOKKAI SEMICONDUCTOR·Filed 2000·Granted Sep 10, 2002·4 cites·7 claims
- 1554US6909179B2Lead frame and semiconductor device using the lead frame and method of manufacturing the sameHITACHI HOKKAI SEMICONDUCTOR·Filed 2001·Granted Jun 21, 2005·8 cites·18 claims
- 1650US6759279B2Method of manufacturing semiconductor device having resin sealing bodyRENESAS TECH CORP·Filed 2002·Granted Jul 6, 2004·2 cites·6 claims
- 1749US6673655B2Method of making semiconductor device having improved heat radiation plate arrangementHITACHI LTD·Filed 2002·Granted Jan 6, 2004·2 cites·7 claims
- 1848US11429646B2Non-transitory computer-readable storage medium storing information presentation program, information presentation device, and information presentation method of controlling to display information regarding trouble shootingFUJITSU LTD·Filed 2020·Granted Aug 30, 2022·0 cites·9 claims
- 1947US2015017413A1Thermoplastic liquid crystal polymer film and method for producing sameKONNO TAKAFUMI·Filed 2014·Application pending·0 cites
- 2041US2004126932A1Semiconductor deviceFiled 2003·Application pending·0 cites
- 2140US2002192871A1Semiconductor deviceFiled 2002·Application pending·0 cites
- 2239US2004262752A1Semiconductor deviceFiled 2004·Application pending·0 cites
- 2335US2001015489A1Semiconductor device and its manufacturing methodFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →