Inventor · disambiguated record
Atsushi Fujisawa
Also filed as: FUJISAWA ATSUSHI
30 granted patents·3 pending applications·359 citations·filing 1993–2015
97Inventor score
Files withSUMITOMO WIRING SYSTEMS6HITACHI HOKKAI SEMICONDUCTOR5FUJISAWA ATSUSHI4HITACHI LTD4RENESAS TECH CORP4
Top patents by PatentIndex Score
33 records- 0193US9006871B2Semiconductor device and method of manufacturing the sameFUJISAWA ATSUSHI·Filed 2010·Granted Apr 14, 2015·17 cites·13 claims
- 0292US6232650B1Semiconductor device having a chip mounted on a flexible substrate with separated insulation layers to prevent short-circuitingHITACHI LTD·Filed 1998·Granted May 15, 2001·94 cites·9 claims
- 0380US6551862B2Semiconductor device and method of manufacturing the sameHITACHI LTD·Filed 2001·Granted Apr 22, 2003·37 cites·11 claims
- 0478US8193024B2Manufacturing method for semiconductor devices and semiconductor deviceFUJISAWA ATSUSHI·Filed 2009·Granted Jun 5, 2012·8 cites·11 claims
- 0577US9087850B2Method for manufacturing semiconductor deviceFUJISAWA ATSUSHI·Filed 2010·Granted Jul 21, 2015·4 cites·9 claims
- 0675US9263274B2Method for manufacturing semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2015·Granted Feb 16, 2016·2 cites·12 claims
- 0775US6764878B2Method of manufacturing a resin encapsulated semiconductor device to provide a vent hole in a base substrateRENESAS TECH CORP·Filed 2002·Granted Jul 20, 2004·13 cites·8 claims
- 0874US8466540B2Semiconductor device and manufacturing method thereforTANAKA SHIGEKI·Filed 2010·Granted Jun 18, 2013·5 cites·12 claims
- 0974US8399302B2Method of manufacturing semiconductor deviceTANAKA SHIGEKI·Filed 2011·Granted Mar 19, 2013·4 cites·17 claims
- 1073US8609468B2Semiconductor device and method of manufacturing the sameFUJISAWA ATSUSHI·Filed 2012·Granted Dec 17, 2013·3 cites·15 claims
- 1170US8129621B2Wire harness fixing toolMIZUTANI TATSUHIKO·Filed 2008·Granted Mar 6, 2012·8 cites·6 claims
- 1270US6664521B1Line switch part snow melting deviceMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2000·Granted Dec 16, 2003·12 cites·11 claims
- 1370US6590275B2Ball grid array type semiconductor package having a flexible substrateHITACHI LTD·Filed 2002·Granted Jul 8, 2003·10 cites·15 claims
- 1468US6437428B1Ball grid array type semiconductor package having a flexible substrateHITACHI HOKKAI SEMICONDUCTOR·Filed 2000·Granted Aug 20, 2002·9 cites·2 claims
- 1567US7348659B2Semiconductor device and method of manufacturing thereofRENESAS TECH CORP·Filed 2004·Granted Mar 25, 2008·13 cites·2 claims
- 1667US6265762B1Lead frame and semiconductor device using the lead frame and method of manufacturing the sameHITACHI LTD·Filed 1997·Granted Jul 24, 2001·41 cites·18 claims
- 1766US6924548B2Semiconductor device and its manufacturing method with leads that have an inverted trapezoid-like sectionRENESAS NTHN JP SEMICONDUCTOR·Filed 2001·Granted Aug 2, 2005·20 cites·87 claims
- 1860US6887739B2Method of manufacturing semiconductor package including forming a resin sealing memberHITACHI HOKKAI SEMICONDUCTOR·Filed 2003·Granted May 3, 2005·5 cites·9 claims
- 1960US6156976AProtective construction for splice portionSUMITOMO WIRING SYSTEMS·Filed 1995·Granted Dec 5, 2000·16 cites·9 claims
- 2057US6476466B2Ball grid array type semiconductor package having a flexible substrateHITACHI HOKKAI SEMICONDUCTOR·Filed 2002·Granted Nov 5, 2002·4 cites·1 claims
- 2157US6448111B1Method of manufacturing a semiconductor deviceHITACHI HOKKAI SEMICONDUCTOR·Filed 2000·Granted Sep 10, 2002·4 cites·7 claims
- 2254US6909179B2Lead frame and semiconductor device using the lead frame and method of manufacturing the sameHITACHI HOKKAI SEMICONDUCTOR·Filed 2001·Granted Jun 21, 2005·8 cites·18 claims
- 2352US9184142B2Semiconductor device and manufacturing method of the sameRENESAS ELECTRONICS CORP·Filed 2013·Granted Nov 10, 2015·0 cites·4 claims
- 2452US2005032975A1Protective member for protecting electric wiresSUMITOMO WIRING SYSTEMS·Filed 2004·Application pending·0 cites
- 2550US7579674B2Semiconductor package configuration with improved lead portion arrangementRENESAS TECH CORP·Filed 2008·Granted Aug 25, 2009·0 cites·7 claims
- 2650US6759279B2Method of manufacturing semiconductor device having resin sealing bodyRENESAS TECH CORP·Filed 2002·Granted Jul 6, 2004·2 cites·6 claims
- 2747US9324644B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2015·Granted Apr 26, 2016·0 cites·8 claims
- 2845US5901441AProtective construction for splice portionSUMITOMO WIRING SYSTEMS·Filed 1997·Granted May 11, 1999·9 cites·1 claims
- 2936US2002039811A1A method of manufacturing a semiconductor deviceFiled 2001·Application pending·0 cites
- 3035US5432300AProtecting construction for end portion of shielded electric cableSUMITOMO WIRING SYSTEMS·Filed 1993·Granted Jul 11, 1995·8 cites·2 claims
- 3135US2001015489A1Semiconductor device and its manufacturing methodFiled 2001·Application pending·0 cites
- 3230US5757955AMethod for checking a connection of wires and control apparatusSUMITOMO WIRING SYSTEMS·Filed 1995·Granted May 26, 1998·2 cites·14 claims
- 3329US5716206AApparatus for heating a wire connection or connectorSUMITOMO WIRING SYSTEMS·Filed 1995·Granted Feb 10, 1998·1 cites·11 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →