Inventor · disambiguated record
William J. Rudik
Also filed as: RUDIK WILLIAM · RUDIK WILLIAM J · RUDIK WILLIAM JOHN
34 granted patents·613 citations·filing 1984–2006
98Inventor score
Top patents by PatentIndex Score
34 records- 0197US5126192AFlame retardant, low dielectric constant microsphere filled laminateIBM·Filed 1990·Granted Jun 30, 1992·151 cites·13 claims
- 0288US6399896B1Circuit package having low modulus, conformal mounting padsIBM·Filed 2000·Granted Jun 4, 2002·51 cites·12 claims
- 0384US6074895AMethod of forming a flip chip assemblyIBM·Filed 1997·Granted Jun 13, 2000·63 cites·14 claims
- 0483US7547577B2Method of making circuitized substrate with solder paste connectionsENDICOTT INTERCONNECT TECH INC·Filed 2006·Granted Jun 16, 2009·13 cites·18 claims
- 0576US6834426B1Method of fabricating a laminate circuit structureIBM·Filed 2000·Granted Dec 28, 2004·18 cites·10 claims
- 0671US5981880AElectronic device packages having glass free non conductive layersIBM·Filed 1996·Granted Nov 9, 1999·33 cites·3 claims
- 0766US6739048B2Process of fabricating a circuitized structureIBM·Filed 2000·Granted May 25, 2004·12 cites·5 claims
- 0866US6306683B1Method of forming a flip chip assembly, and a flip chip assembly formed by the methodIBM·Filed 2000·Granted Oct 23, 2001·16 cites·42 claims
- 0963US6534848B1Electrical coupling of a stiffener to a chip carrierIBM·Filed 2000·Granted Mar 18, 2003·11 cites·19 claims
- 1062US6586352B1Method for reducing coefficient of thermal expansion in chip attach packagesIBM·Filed 2000·Granted Jul 1, 2003·10 cites·12 claims
- 1162US4855333AMultiple wire photosensitive adhesive for wire embedmentIBM·Filed 1987·Granted Aug 8, 1989·23 cites·25 claims
- 1261US6469256B1Structure for high speed printed wiring boards with multiple differential impedance-controlled layersIBM·Filed 2000·Granted Oct 22, 2002·10 cites·6 claims
- 1360US7615477B2Method of fabricating a BGA package having decreased adhesionIBM·Filed 2006·Granted Nov 10, 2009·1 cites·4 claims
- 1460US6841026B2Method for reducing coefficient of thermal expansion in chip attach packagesIBM·Filed 2002·Granted Jan 11, 2005·6 cites·18 claims
- 1559US7148566B2Method and structure for an organic package with improved BGA lifeIBM·Filed 2001·Granted Dec 12, 2006·7 cites·8 claims
- 1659US5719090ATechnique for forming resin-imprenated fiberglass sheets with improved resistance to pinholingIBM·Filed 1996·Granted Feb 17, 1998·17 cites·11 claims
- 1758US6348738B1Flip chip assemblyIBM·Filed 1999·Granted Feb 19, 2002·17 cites·7 claims
- 1857US6136733AMethod for reducing coefficient of thermal expansion in chip attach packagesIBM·Filed 1997·Granted Oct 24, 2000·15 cites·5 claims
- 1955US5858461ATechnique for forming resin-impregnated fiberglass sheets with improved resistance to pinholingIBM·Filed 1997·Granted Jan 12, 1999·14 cites·2 claims
- 2055US5780366ATechnique for forming resin-impregnated fiberglass sheets using multiple resinsIBM·Filed 1996·Granted Jul 14, 1998·14 cites·9 claims
- 2154US7259333B2Composite laminate circuit structureIBM·Filed 2004·Granted Aug 21, 2007·4 cites·20 claims
- 2254US6781064B1Printed circuit boards for electronic device packages having glass free non-conductive layers and method of forming sameIBM·Filed 1999·Granted Aug 24, 2004·16 cites·25 claims
- 2352US5919525ATechnique for forming resin-impregnated fiberglass sheets using multiple resinsINT BUSINESS MACJINES COPORATI·Filed 1997·Granted Jul 6, 1999·15 cites·8 claims
- 2451US6131279AIntegrated manufacturing packaging processIBM·Filed 1998·Granted Oct 17, 2000·14 cites·22 claims
- 2551US4544801ACircuit board including multiple wire photosensitive adhesiveIBM·Filed 1984·Granted Oct 1, 1985·15 cites·2 claims
- 2649US5871819ATechnique for forming resin-impregnated fiberglass sheets with improved resistance to pinholingIBM·Filed 1997·Granted Feb 16, 1999·11 cites·8 claims
- 2743US5955782AApparatus and process for improved die adhesion to organic chip carriersIBM·Filed 1997·Granted Sep 21, 1999·13 cites·14 claims
- 2842US6845557B2Method for producing an electronic package possessing controlled impedance characteristicsIBM·Filed 2002·Granted Jan 25, 2005·1 cites·5 claims
- 2942US6639638B1LCD cover optical structure and methodIBM·Filed 1999·Granted Oct 28, 2003·10 cites·12 claims
- 3042US6387830B1Method for reducing coefficient of thermal expansion in chip attach packagesIBM·Filed 1999·Granted May 14, 2002·9 cites·12 claims
- 3137US6699736B2Electrical coupling of a stiffener to a chip carrierIBM·Filed 2002·Granted Mar 2, 2004·0 cites·13 claims
- 3233US6096665ATechnique for forming resin-impregnated fiberglass sheets with improved resistance to pinholingIBM·Filed 1997·Granted Aug 1, 2000·2 cites·4 claims
- 3332US5866203ATechnique for forming resin-impregnated fiberglass sheets using multiple resinsIBM·Filed 1997·Granted Feb 2, 1999·1 cites·2 claims
- 3431US5874370ATechnique for forming resin-impregnated fiberglass sheets using multiple resinsIBM·Filed 1997·Granted Feb 23, 1999·0 cites·4 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →