Inventor · disambiguated record
Katsuhiko Hotta
Also filed as: HOTTA KATSUHIKO
48 granted patents·8 pending applications·322 citations·filing 2000–2024
98Inventor score
Files withRENESAS ELECTRONICS CORP21RENESAS TECH CORP19HOTTA KATSUHIKO6HITACHI LTD2HITACHI ULSI SYS CO LTD2
Top patents by PatentIndex Score
56 records- 0197US11062938B2Semiconductor device and a method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2020·Granted Jul 13, 2021·3 cites·9 claims
- 0295US9391022B2Semiconductor device and a method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2015·Granted Jul 12, 2016·8 cites·15 claims
- 0395US8704373B2Semiconductor device and a method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2013·Granted Apr 22, 2014·12 cites·16 claims
- 0494US10141257B2Semiconductor device and a method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2017·Granted Nov 27, 2018·6 cites·7 claims
- 0594US7629251B2Semiconductor device and a method of manufacturing the sameRENESAS TECH CORP·Filed 2008·Granted Dec 8, 2009·16 cites·32 claims
- 0694US7557034B2Semiconductor device and a method of manufacturing the sameRENESAS TECH CORP·Filed 2008·Granted Jul 7, 2009·17 cites·10 claims
- 0793US7932606B2Semiconductor device and a method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2008·Granted Apr 26, 2011·14 cites·19 claims
- 0893US7208391B2Method of manufacturing a semiconductor integrated circuit device that includes forming an isolation trench around active regions and filling the trench with two insulating filmsRENESAS TECH CORP·Filed 2005·Granted Apr 24, 2007·19 cites·15 claims
- 0992US2025046653A1Semiconductor device and a method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 1091US7354855B2Semiconductor device and a method of manufacturing the sameRENESAS TECH CORP·Filed 2006·Granted Apr 8, 2008·12 cites·13 claims
- 1191US7074691B2Method of manufacturing a semiconductor integrated circuit device that includes forming dummy patterns in an isolation region prior to filling with insulating materialHITACHI ULSI SYSTEMS C O LTD·Filed 2005·Granted Jul 11, 2006·20 cites·12 claims
- 1289US11600522B2Semiconductor device and a method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2021·Granted Mar 7, 2023·1 cites·11 claims
- 1387US6693008B1Method of manufacturing a semiconductor integrated circuit device and a semiconductor integrated circuit deviceRENESAS TECH CORP·Filed 2000·Granted Feb 17, 2004·29 cites·9 claims
- 1486US7602040B2Semiconductor device and a method of manufacturing the sameRENESAS TECH CORP·Filed 2008·Granted Oct 13, 2009·11 cites·9 claims
- 1585US12154823B2Semiconductor device and a method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2023·Granted Nov 26, 2024·0 cites·12 claims
- 1684US8581415B2Semiconductor device and a method of manufacturing the sameHOTTA KATSUHIKO·Filed 2012·Granted Nov 12, 2013·3 cites·16 claims
- 1784US6838771B2Semiconductor device having conductor layers stacked on a substrateRENESAS TECH CORP·Filed 2003·Granted Jan 4, 2005·24 cites·20 claims
- 1883US7705462B2Semiconductor device and a method of manufacturing the sameRENESAS TECH CORP·Filed 2009·Granted Apr 27, 2010·8 cites·10 claims
- 1983US7615848B2Semiconductor device and a method of manufacturing the sameRENESAS TECH CORP·Filed 2008·Granted Nov 10, 2009·8 cites·17 claims
- 2081US7968966B2Semiconductor device with fuse and a method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2009·Granted Jun 28, 2011·7 cites·18 claims
- 2180US8513808B2Semiconductor device having trench-isolated element formation regionHOTTA KATSUHIKO·Filed 2011·Granted Aug 20, 2013·6 cites·13 claims
- 2280US7400046B2Semiconductor device with guard rings that are formed in each of the plural wiring layersRENESAS TECH CORP·Filed 2007·Granted Jul 15, 2008·6 cites·22 claims
- 2379US8373270B2Semiconductor integrated circuit device and method of manufacturing sameRENESAS ELECTRONICS CORP·Filed 2010·Granted Feb 12, 2013·4 cites·18 claims
- 2479US7303986B2Semiconductor device and a method of manufacturing the sameRENESAS TECH CORP·Filed 2006·Granted Dec 4, 2007·6 cites·22 claims
- 2578US7060589B2Method for manufacturing a semiconductor integrated circuit device that includes covering the bottom of an isolation trench with spin-on glass and etching back the spin-on glass to a predetermined depthHITACHI ULSI SYS CO LTD·Filed 2005·Granted Jun 13, 2006·4 cites·13 claims
- 2676US8269309B2Semiconductor device with a fuse formed by a damascene technique and a method of manufacturing the sameHOTTA KATSUHIKO·Filed 2011·Granted Sep 18, 2012·3 cites·4 claims
- 2776US7718269B2Semiconductor manufacturing method for inter-layer insulating filmRENESAS TECH CORP·Filed 2006·Granted May 18, 2010·6 cites·10 claims
- 2875US10796953B2Semiconductor device and a method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2020·Granted Oct 6, 2020·0 cites·9 claims
- 2973US6833331B2Method of manufacturing semiconductor integrated circuit device having insulating film formed from liquid substance containing polymer of silicon, oxygen, and hydrogenHITACHI LTD·Filed 2002·Granted Dec 21, 2004·13 cites·10 claims
- 3072US8518821B2Semiconductor device and a method of manufacturing the sameHOTTA KATSUHIKO·Filed 2012·Granted Aug 27, 2013·1 cites·8 claims
- 3172US8487412B2Semiconductor device and a method of manufacturing the sameHOTTA KATSUHIKO·Filed 2011·Granted Jul 16, 2013·1 cites·19 claims
- 3271US7772700B2Semiconductor deviceRENESAS TECH CORP·Filed 2005·Granted Aug 10, 2010·3 cites·14 claims
- 3371US7247525B2Method for manufacturing a semiconductor deviceRENESAS TECH CORP·Filed 2005·Granted Jul 24, 2007·3 cites·7 claims
- 3470US10600683B2Semiconductor device and a method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2018·Granted Mar 24, 2020·0 cites·9 claims
- 3570US7419901B2Semiconductor device and a method of manufacturing the sameRENESAS TECH CORP·Filed 2006·Granted Sep 2, 2008·3 cites·5 claims
- 3669US6509277B1Method of manufacturing semiconductor integrated circuit device having insulatro film formed from liquid containing polymer of silicon, oxygen, and hydrogenHITACHI LTD·Filed 2000·Granted Jan 21, 2003·10 cites·26 claims
- 3767US6967407B2Semiconductor device and method of manufacturing the semiconductor deviceRENESAS TECH CORP·Filed 2001·Granted Nov 22, 2005·14 cites·14 claims
- 3866US7189637B2Method of manufacturing a semiconductor device having a multi-layered wiring structureHITACHI ULSI SYS CO LTD·Filed 2003·Granted Mar 13, 2007·9 cites·29 claims
- 3965US8686538B2Semiconductor device with a fuse formed by a damascene technique and a method of manufacturing the sameHOTTA KATSUHIKO·Filed 2012·Granted Apr 1, 2014·1 cites·8 claims
- 4064US7372154B2Semiconductor deviceRENESAS TECH CORP·Filed 2004·Granted May 13, 2008·7 cites·4 claims
- 4162US9899316B2Semiconductor device and a method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2016·Granted Feb 20, 2018·0 cites·10 claims
- 4262US9761487B2Manufacturing method of semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2016·Granted Sep 12, 2017·1 cites·15 claims
- 4362US9048200B2Semiconductor integrated circuit device and method of manufacturing sameHOMMA TAKURO·Filed 2012·Granted Jun 2, 2015·1 cites·18 claims
- 4461US2014199831A1Semiconductor device and a method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2014·Application pending·0 cites
- 4556US8350311B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2010·Granted Jan 8, 2013·1 cites·18 claims
- 4655US9443817B2Method of manufacturing semiconductor device and semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2015·Granted Sep 13, 2016·1 cites·16 claims
- 4751US9536821B2Semiconductor integrated circuit device having protective split at peripheral area of bonding pad and method of manufacturing sameRENESAS ELECTRONICS CORP·Filed 2015·Granted Jan 3, 2017·0 cites·14 claims
- 4851US7986041B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2010·Granted Jul 26, 2011·0 cites·8 claims
- 4949US2007222043A1Semiconductor device and a method of manufacturing the sameRENESAS TECH CORP·Filed 2007·Application pending·0 cites
- 5045US2010193958A1Semiconductor Device and a Method of Manufacturing the SameRENESAS TECH CORP·Filed 2010·Application pending·0 cites
Showing the top 50 of 56 patent records by PatentIndex Score.
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