Inventor · disambiguated record
Chen-Hsiang Lao
Also filed as: LAO CHEN-HSIANG
8 granted patents·4 pending applications·20 citations·filing 2019–2025
81Inventor score
Technology areasH10W
Files withTAIWAN SEMICONDUCTOR MFG CO LTD12
Top patents by PatentIndex Score
12 records- 0196US11810833B2Package structure and method and equipment for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Nov 7, 2023·3 cites·20 claims
- 0295US11062971B2Package structure and method and equipment for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jul 13, 2021·12 cites·20 claims
- 0391US11302600B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Apr 12, 2022·5 cites·19 claims
- 0484US2025069980A1Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0581US12170237B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 17, 2024·0 cites·20 claims
- 0681US2025323121A1Semiconductor package and manufacturing method thereoTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0779US12412805B2Semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Sep 9, 2025·0 cites·12 claims
- 0879US12021006B2Package structure and method and equipment for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jun 25, 2024·0 cites·20 claims
- 0978US2025357258A1Electronic apparatus, semiconductor package module and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1076US11715675B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Aug 1, 2023·0 cites·20 claims
- 1167US11996342B2Semiconductor package comprising heat dissipation platesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted May 28, 2024·0 cites·20 claims
- 1263US2023075909A1Electronic apparatus, semiconductor package module and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →