Inventor · disambiguated record
Cheng-Hsiung Tsai
Also filed as: TSAI CHENG-HSIUNG · TSAI CHENG-HSIUNG MATT · TSAI CHENG-HSIUNG MATTHEW
109 granted patents·16 pending applications·4,501 citations·filing 1999–2025
99Inventor score
Files withAPPLIED MATERIALS INC58TAIWAN SEMICONDUCTOR MFG CO LTD41TAIWAN SEMICONDUCTOR MFG18TSAI CHENG-HSIUNG2ALPHA & OMEGA SEMICONDUCTOR INT LP1
Top patents by PatentIndex Score
125 records- 0199US9576814B2Method of spacer patterning to form a target integrated circuit patternTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Feb 21, 2017·3.1k cites·20 claims
- 0299US9153478B2Spacer etching process for integrated circuit designTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Oct 6, 2015·118 cites·20 claims
- 0398USD1040304SDeposition ring for physical vapor deposition chamberAPPLIED MATERIALS INC·Filed 2021·Granted Aug 27, 2024·19 cites·1 claims
- 0498US11569124B2Interconnect structure having an etch stop layer over conductive linesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jan 31, 2023·4 cites·20 claims
- 0597US12046551B2Interconnect structure having a barrier layer along the sidewall of self-aligned via structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jul 23, 2024·2 cites·20 claims
- 0697US9773676B2Lithography using high selectivity spacers for pitch reductionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Sep 26, 2017·17 cites·19 claims
- 0797US9177797B2Lithography using high selectivity spacers for pitch reductionTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Nov 3, 2015·28 cites·20 claims
- 0897US9123776B2Self-aligned double spacer patterning processTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Sep 1, 2015·26 cites·20 claims
- 0997US7480129B2Detachable electrostatic chuck for supporting a substrate in a process chamberAPPLIED MATERIALS INC·Filed 2005·Granted Jan 20, 2009·87 cites·31 claims
- 1096US11631639B2Method of fabricating self-aligned via structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Apr 18, 2023·2 cites·20 claims
- 1196USD888903SDeposition ring for physical vapor deposition chamberAPPLIED MATERIALS INC·Filed 2018·Granted Jun 30, 2020·70 cites·1 claims
- 1296US8390980B2Electrostatic chuck assemblySANSONI STEVEN V·Filed 2009·Granted Mar 5, 2013·187 cites·8 claims
- 1395US6506291B2Substrate support with multilevel heat transfer mechanismAPPLIED MATERIALS INC·Filed 2001·Granted Jan 14, 2003·287 cites·24 claims
- 1494USD933725SDeposition ring for a substrate processing chamberAPPLIED MATERIALS INC·Filed 2019·Granted Oct 19, 2021·52 cites·1 claims
- 1594USD893441SBase plate for a processing chamber substrate supportAPPLIED MATERIALS INC·Filed 2019·Granted Aug 18, 2020·68 cites·1 claims
- 1694USD891382SProcess shield for a substrate processing chamberAPPLIED MATERIALS INC·Filed 2019·Granted Jul 28, 2020·55 cites·1 claims
- 1794US10014175B2Lithography using high selectivity spacers for pitch reductionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jul 3, 2018·7 cites·20 claims
- 1894US9431297B2Method of forming an interconnect structure for a semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Aug 30, 2016·15 cites·20 claims
- 1994US8518836B1Semiconductor patterningTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted Aug 27, 2013·15 cites·20 claims
- 2093US12014906B2High temperature detachable very high frequency (VHF) electrostatic chuck (ESC) for PVD chamberAPPLIED MATERIALS INC·Filed 2021·Granted Jun 18, 2024·2 cites·20 claims
- 2193US10851453B2Methods and apparatus for shutter disk assembly detectionAPPLIED MATERIALS INC·Filed 2018·Granted Dec 1, 2020·11 cites·20 claims
- 2293US10312139B2Interconnect structure having an etch stop layer over conductive linesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jun 4, 2019·6 cites·20 claims
- 2393US9911646B2Self-aligned double spacer patterning processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Mar 6, 2018·6 cites·20 claims
- 2493US9818585B2In situ plasma clean for removal of residue from pedestal surface without breaking vacuumAPPLIED MATERIALS INC·Filed 2014·Granted Nov 14, 2017·9 cites·20 claims
- 2593US9136106B2Method for integrated circuit patterningTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Sep 15, 2015·11 cites·20 claims
- 2692US11676862B2Semiconductor device structure and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jun 13, 2023·2 cites·20 claims
- 2792US9888528B2Substrate support with multiple heating zonesAPPLIED MATERIALS INC·Filed 2015·Granted Feb 6, 2018·11 cites·16 claims
- 2892US9685368B2Interconnect structure having an etch stop layer over conductive linesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jun 20, 2017·6 cites·20 claims
- 2992US8971009B2Electrostatic chuck with temperature controlAPPLIED MATERIALS INC·Filed 2012·Granted Mar 3, 2015·13 cites·20 claims
- 3092US8900989B2Method of fabricating an air gap using a damascene process and structure of sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Dec 2, 2014·11 cites·20 claims
- 3191US11251118B2Self-aligned via structures with barrier layersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Feb 15, 2022·4 cites·20 claims
- 3291US10892180B2Lift pin assemblyAPPLIED MATERIALS INC·Filed 2014·Granted Jan 12, 2021·16 cites·15 claims
- 3391US9099400B2Semiconductor device manufacturing methodsTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Aug 4, 2015·9 cites·20 claims
- 3491US7907384B2Detachable electrostatic chuck for supporting a substrate in a process chamberAPPLIED MATERIALS INC·Filed 2008·Granted Mar 15, 2011·13 cites·25 claims
- 3590USD947914SBase plate for a processing chamber substrate supportAPPLIED MATERIALS INC·Filed 2020·Granted Apr 5, 2022·14 cites·1 claims
- 3690US9230911B2Interconnect structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jan 5, 2016·9 cites·20 claims
- 3789US9490205B2Integrated circuit interconnects and methods of making sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Nov 8, 2016·6 cites·20 claims
- 3889US7697260B2Detachable electrostatic chuckAPPLIED MATERIALS INC·Filed 2004·Granted Apr 13, 2010·35 cites·19 claims
- 3988US12444676B2Self-aligned via for interconnect structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Oct 14, 2025·0 cites·20 claims
- 4088US9865437B2High conductance process kitAPPLIED MATERIALS INC·Filed 2014·Granted Jan 9, 2018·8 cites·11 claims
- 4188US6563686B2Pedestal assembly with enhanced thermal conductivityAPPLIED MATERIALS INC·Filed 2001·Granted May 13, 2003·41 cites·34 claims
- 4287US11887878B2Detachable biasable electrostatic chuck for high temperature applicationsAPPLIED MATERIALS INC·Filed 2020·Granted Jan 30, 2024·2 cites·19 claims
- 4387USD960216SBase plate for a processing chamber substrate supportAPPLIED MATERIALS INC·Filed 2022·Granted Aug 9, 2022·10 cites·1 claims
- 4487US9129906B2Self-aligned double spacer patterning processTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Sep 8, 2015·6 cites·20 claims
- 4587US2024242947A1Process kit having tall deposition ring for pvd chamberAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 4687US2025357206A1Semiconductor device structure and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4786US12165920B2Semiconductor structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 10, 2024·1 cites·20 claims
- 4886US9627256B2Integrated circuit interconnects and methods of making sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Apr 18, 2017·8 cites·20 claims
- 4985US11251028B2Pre-clean chamber with integrated shutter garageAPPLIED MATERIALS INC·Filed 2019·Granted Feb 15, 2022·4 cites·17 claims
- 5084US11830910B2Semiconductor structure having air gaps and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Nov 28, 2023·1 cites·20 claims
Showing the top 50 of 125 patent records by PatentIndex Score.
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