Inventor · disambiguated record
Hui Yu Lee
Also filed as: LEE HUI · LEE HUI YU
71 granted patents·19 pending applications·165 citations·filing 2007–2025
98Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD73TAIWAN SEMICONDUCTOR MFG11LEE HUI YU2ADVANCED SEMICONDUCTOR ENG1CHANG SHIH-CHENG1
Top patents by PatentIndex Score
90 records- 0196US9335624B2Multi-patterning system and method using pre-coloring or locked patternsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted May 10, 2016·17 cites·19 claims
- 0296US8701055B1Macro cell based process design kit for advanced applicationsTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted Apr 15, 2014·44 cites·20 claims
- 0395US11658157B2Integrated circuit including a first semiconductor wafer and a second semiconductor wafer, semiconductor device including a first semiconductor wafer and a second semiconductor wafer and method of manufacturing sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted May 23, 2023·2 cites·20 claims
- 0495US11609374B2Directionally tunable optical reflectorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Mar 21, 2023·2 cites·20 claims
- 0593US10535635B2Second semiconductor wafer attached to a first semiconductor wafer with a through hole connected to an inductorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jan 14, 2020·6 cites·20 claims
- 0690US8621409B2System and method for reducing layout-dependent effectsLEE HUI YU·Filed 2012·Granted Dec 31, 2013·18 cites·20 claims
- 0789US11088084B2Electromagnetic shielding metal-insulator-metal capacitor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 10, 2021·2 cites·20 claims
- 0888US11043473B2Integrated circuit including a first semiconductor wafer and a second semiconductor wafer, semiconductor device including a first semiconductor wafer and a second semiconductor wafer and method of manufacturing sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jun 22, 2021·3 cites·20 claims
- 0986US12085769B2Integrated circuit device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Sep 10, 2024·1 cites·20 claims
- 1086US9390218B2Integrated circuit design system with color-coded component loading estimate displayTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Jul 12, 2016·9 cites·20 claims
- 1186US2025347862A1Method of making semiconductor device including optical through via and method of usingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1285US12271029B2Directionally tunable optical reflectorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Apr 8, 2025·0 cites·20 claims
- 1384US9219039B2Interposer and semiconductor package with noise suppression featuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Dec 22, 2015·5 cites·11 claims
- 1484US2024413052A1Heat Dissipation StructuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1583US12154842B2Heat dissipation structures for three-dimensional system on integrated chip structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Nov 26, 2024·0 cites·20 claims
- 1683US11094608B2Heat dissipation structure including stacked chips surrounded by thermal interface material ringsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 17, 2021·2 cites·20 claims
- 1782US12062641B2Integrated circuit including a first semiconductor wafer and a second semiconductor wafer, semiconductor device including a first semiconductor wafer and a second semiconductor wafer and method of manufacturing sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Aug 13, 2024·0 cites·20 claims
- 1882US11540357B2Photonic heaterTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Dec 27, 2022·1 cites·20 claims
- 1982US10665550B2Electromagnetic shielding metal-insulator-metal capacitor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted May 26, 2020·2 cites·20 claims
- 2082US10638543B2Photonic heaterTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 28, 2020·1 cites·20 claims
- 2182US8850374B2Method of reducing parasitic mismatchTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted Sep 30, 2014·10 cites·20 claims
- 2281US11994713B2Directionally tunable optical reflectorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted May 28, 2024·0 cites·20 claims
- 2381US9367654B2Variation modelingTAIWAN SEMICONDUCTOR MFG·Filed 2015·Granted Jun 14, 2016·3 cites·20 claims
- 2481US2025093765A1Methods for making semiconductor-based integrated circuitsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2581US2025216605A1Directionally tunable optical reflectorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2680US12197123B2Methods for making semiconductor-based integrated circuitsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jan 14, 2025·0 cites·20 claims
- 2780US12181722B2Structures and process flow for integrated photonic-electric ic package by using polymer waveguideTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 31, 2024·0 cites·20 claims
- 2880US10971485B2Solenoid inductors within a multi-chip packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Apr 6, 2021·3 cites·20 claims
- 2980US9748228B2Structure and method for cooling three-dimensional integrated circuitsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Aug 29, 2017·3 cites·22 claims
- 3080US2025130379A1Structures and process flow for integrated photonic-electric ic package by using polymer waveguideTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3180US2025364358A1Device level thermal dissipationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3279US12230603B2Method of fabricating a semiconductor chip having strength adjustment pattern in bonding layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 18, 2025·0 cites·20 claims
- 3379US12167509B2Photonic heaterTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 10, 2024·0 cites·20 claims
- 3479US12068269B2Method and system for verifying integrated circuit stack having photonic deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Aug 20, 2024·0 cites·20 claims
- 3579US10467375B2Methods and systems to estimate power network noiseTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Nov 5, 2019·3 cites·20 claims
- 3679US2024355769A1Method and system for verifying integrated circuit stackTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3778US10192833B2Interposer and semiconductor package with noise suppression featuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jan 29, 2019·2 cites·19 claims
- 3877US10910365B2Structure and method for cooling three-dimensional integrated circuitsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Feb 2, 2021·1 cites·20 claims
- 3977US9773089B2Integrated circuit design method and system with color-coded componentsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Sep 26, 2017·2 cites·20 claims
- 4077US8856701B1Method of radio-frequency and microwave device generationTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Oct 7, 2014·4 cites·15 claims
- 4176US2024345425A1Semiconductor device manufacturing methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4275US11749584B2Heat dissipation structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Sep 5, 2023·0 cites·20 claims
- 4375US9269485B2Method of creating spiral inductor having high Q valueCHANG SHIH-CHENG·Filed 2011·Granted Feb 23, 2016·5 cites·4 claims
- 4475US8966426B1Partitioning method and system for 3D ICTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Feb 24, 2015·3 cites·20 claims
- 4575US2024361546A1Integrated circuit device manufacturing methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4674US2023384537A1Method of making semiconductor device including optical through via and method of usingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 4773US11532613B2Structure and method for cooling three-dimensional integrated circuitsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 20, 2022·0 cites·20 claims
- 4873US2024395728A1Semiconductor devices and methods of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4972US11754794B2Semiconductor device including optical through via and method of makingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Sep 12, 2023·0 cites·20 claims
- 5072US11545298B2Method of forming entangled inductor structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jan 3, 2023·0 cites·20 claims
Showing the top 50 of 90 patent records by PatentIndex Score.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →