Inventor · disambiguated record
Hualiang Shi
Also filed as: SHI HUALIANG
3 granted patents·2 pending applications·12 citations·filing 2013–2023
57Inventor score
Top patents by PatentIndex Score
5 records- 0182US8970051B2Solution to deal with die warpage during 3D die-to-die stackingSHI HUALIANG·Filed 2013·Granted Mar 3, 2015·12 cites·18 claims
- 0262US2023288647A1Optical fiber ferrule and optical fiber connectorHUAWEI TECH CO LTD·Filed 2023·Application pending·0 cites
- 0354US11619786B2Optical fiber ferrule and optical fiber connectorHUAWEI TECH CO LTD·Filed 2020·Granted Apr 4, 2023·0 cites·18 claims
- 0437US9698108B1Structures to mitigate contamination on a back side of a semiconductor substrateINTEL CORP·Filed 2015·Granted Jul 4, 2017·0 cites·24 claims
- 0535US2015001736A1Die connections using different underfill types for different regionsSHI HUALIANG·Filed 2013·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →