Inventor · disambiguated record
Shengquan Ou
Also filed as: OU SHENGQUAN · OU SHENGQUAN E
7 granted patents·3 pending applications·16 citations·filing 2007–2024
78Inventor score
Top patents by PatentIndex Score
10 records- 0188US10700051B2Multi-chip packagingINTEL CORP·Filed 2018·Granted Jun 30, 2020·4 cites·24 claims
- 0283US12476235B2Multi-chip packagingINTEL CORP·Filed 2023·Granted Nov 18, 2025·0 cites·20 claims
- 0382US8970051B2Solution to deal with die warpage during 3D die-to-die stackingSHI HUALIANG·Filed 2013·Granted Mar 3, 2015·12 cites·18 claims
- 0476US12199085B2Multi-chip packagingINTEL CORP·Filed 2022·Granted Jan 14, 2025·0 cites·23 claims
- 0575US11817444B2Multi-chip packagingINTEL CORP·Filed 2022·Granted Nov 14, 2023·0 cites·20 claims
- 0671US11348911B2Multi-chip packagingINTEL CORP·Filed 2020·Granted May 31, 2022·0 cites·20 claims
- 0759US2025079262A1Methods and apparatus for multi-zone temperature control of jet impingement cooling of integrated circuit packagesINTEL CORP·Filed 2024·Application pending·0 cites
- 0841US2009020869A1Interconnect jointXUE QING·Filed 2007·Application pending·0 cites
- 0937US9698108B1Structures to mitigate contamination on a back side of a semiconductor substrateINTEL CORP·Filed 2015·Granted Jul 4, 2017·0 cites·24 claims
- 1035US2015001736A1Die connections using different underfill types for different regionsSHI HUALIANG·Filed 2013·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →