Inventor · disambiguated record
Alexander William Simpson
Also filed as: SIMPSON ALEXANDER · SIMPSON ALEXANDER W · SIMPSON ALEXANDER WILLIAM
26 granted patents·4 pending applications·369 citations·filing 1999–2022
96Inventor score
Files withALLISON WILLIAM C8INFINEON TECHNOLOGIES AG6IBM5NEXPLANAR CORP5CABOT MICROELECTRONICS CORP3
Top patents by PatentIndex Score
30 records- 0197US9211628B2Polishing pad with concentric or approximately concentric polygon groove patternALLISON WILLIAM C·Filed 2011·Granted Dec 15, 2015·21 cites·19 claims
- 0297US9067297B2Polishing pad with foundation layer and polishing surface layerALLISON WILLIAM C·Filed 2011·Granted Jun 30, 2015·31 cites·82 claims
- 0394US6570256B2Carbon-graded layer for improved adhesion of low-k dielectrics to silicon substratesIBM·Filed 2001·Granted May 27, 2003·85 cites·11 claims
- 0492US7582127B2Polishing composition for a tungsten-containing substrateCABOT MICROELECTRONICS CORP·Filed 2007·Granted Sep 1, 2009·21 cites·13 claims
- 0591US9649742B2Polishing pad having polishing surface with continuous protrusionsNEXPLANAR CORP·Filed 2013·Granted May 16, 2017·13 cites·22 claims
- 0688US8439994B2Method of fabricating a polishing pad with an end-point detection region for eddy current end-point detectionALLISON WILLIAM C·Filed 2010·Granted May 14, 2013·8 cites·24 claims
- 0788US6740539B2Carbon-graded layer for improved adhesion of low-k dielectrics to silicon substratesIBM·Filed 2003·Granted May 25, 2004·37 cites·11 claims
- 0883US6485355B1Method to increase removal rate of oxide using fixed-abrasiveIBM·Filed 2001·Granted Nov 26, 2002·31 cites·33 claims
- 0982US10160092B2Polishing pad having polishing surface with continuous protrusions having tapered sidewallsNEXPLANAR CORP·Filed 2013·Granted Dec 25, 2018·5 cites·37 claims
- 1080US6569769B1Slurry-less chemical-mechanical polishingIBM·Filed 2000·Granted May 27, 2003·22 cites·22 claims
- 1179US8628384B2Polishing pad for eddy current end-point detectionALLISON WILLIAM C·Filed 2010·Granted Jan 14, 2014·3 cites·11 claims
- 1279US6841480B2Polyelectrolyte dispensing polishing pad, production thereof and method of polishing a substrateINFINEON TECHNOLOGIES AG·Filed 2002·Granted Jan 11, 2005·20 cites·75 claims
- 1375US7247567B2Method of polishing a tungsten-containing substrateCABOT MICROELECTRONICS CORP·Filed 2004·Granted Jul 24, 2007·18 cites·20 claims
- 1474US7011574B2Polyelectrolyte dispensing polishing padINFINEON TECHNOLOGIES AG·Filed 2004·Granted Mar 14, 2006·13 cites·20 claims
- 1569US9597769B2Polishing pad with polishing surface layer having an aperture or opening above a transparent foundation layerLEFEVRE PAUL ANDRE·Filed 2012·Granted Mar 21, 2017·2 cites·59 claims
- 1666US8657653B2Homogeneous polishing pad for eddy current end-point detectionALLISON WILLIAM C·Filed 2010·Granted Feb 25, 2014·1 cites·12 claims
- 1763US6294470B1Slurry-less chemical-mechanical polishingIBM·Filed 1999·Granted Sep 25, 2001·25 cites·17 claims
- 1862US9028302B2Polishing pad for eddy current end-point detectionALLISON WILLIAM C·Filed 2013·Granted May 12, 2015·0 cites·10 claims
- 1962US6350692B1Increased polish removal rate of dielectric layers using fixed abrasive padsINFINEON TECHNOLOGIES AG·Filed 2000·Granted Feb 26, 2002·8 cites·27 claims
- 2061US9931728B2Polishing pad with foundation layer and polishing surface layerNEXPLANAR CORP·Filed 2015·Granted Apr 3, 2018·0 cites·23 claims
- 2161US2025033162A1Microreplicated polishing pad including fluorinated polymer window3M INNOVATIVE PROPERTIES COMPANY·Filed 2022·Application pending·0 cites
- 2259US2015273656A1Polishing pad with foundation layer and polishing surface layerALLISON WILLIAM C·Filed 2015·Application pending·0 cites
- 2358US9597777B2Homogeneous polishing pad for eddy current end-point detectionNEXPLANAR CORP·Filed 2014·Granted Mar 21, 2017·0 cites·6 claims
- 2458US2016023322A1Polishing pad with concentric or approximately concentric polygon groove patternALLISON WILLIAM C·Filed 2015·Application pending·0 cites
- 2552US10293459B2Polishing pad having polishing surface with continuous protrusionsNEXPLANAR CORP·Filed 2017·Granted May 21, 2019·0 cites·23 claims
- 2651US2007266641A1Method of polishing a tungsten-containing substrateCABOT MICROELECTRONICS CORP·Filed 2007·Application pending·0 cites
- 2744US6899597B2Chemical mechanical polishing (CMP) process using fixed abrasive padsINFINEON TECHNOLOGIES AG·Filed 2003·Granted May 31, 2005·2 cites·19 claims
- 2838US6932674B2Method of determining the endpoint of a planarization processINFINEON TECHNOLOGIES AKTIENTG·Filed 2003·Granted Aug 23, 2005·3 cites·34 claims
- 2935US6893968B2Defect-minimizing, topology-independent planarization of process surfaces in semiconductor devicesINFINEON TECHNOLOGIES AG·Filed 2002·Granted May 17, 2005·0 cites·19 claims
- 3034US6827635B2Method of planarizing substratesINFINEON TECHNOLOGIES AG·Filed 2003·Granted Dec 7, 2004·0 cites·35 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →