Inventor · disambiguated record
Hyeong-Seok Choi
Also filed as: CHOI HYEONG S · CHOI HYEONG-SEOK
41 granted patents·15 pending applications·139 citations·filing 1995–2024
96Inventor score
Files withSAMSUNG ELECTRONICS CO LTD31SK HYNIX INC16HYNIX SEMICONDUCTOR INC3PARK CHANG JUN2CHOI HYEONG SEOK1
Top patents by PatentIndex Score
56 records- 0191US11764128B2Semiconductor chip including through electrode, and semiconductor package including the sameSK HYNIX INC·Filed 2021·Granted Sep 19, 2023·2 cites·20 claims
- 0284US9922965B2Manufacturing methods semiconductor packages including through mold connectorsSK HYNIX INC·Filed 2017·Granted Mar 20, 2018·3 cites·11 claims
- 0384US7795073B2Method for manufacturing stack package using through-electrodesHYNIX SEMICONDUCTOR INC·Filed 2008·Granted Sep 14, 2010·12 cites·18 claims
- 0483US7282833B2Stator assembly of drum motor, and head drum assembly of magnetic recording/reproducing apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Oct 16, 2007·6 cites·14 claims
- 0580US10050019B2Method of manufacturing wafer level package and wafer level package manufactured therebySK HYNIX INC·Filed 2017·Granted Aug 14, 2018·3 cites·7 claims
- 0679US6449118B1Magnetic recording/reproducing apparatusSAMSUNG ELECTRONICS CO LTD·Filed 1999·Granted Sep 10, 2002·34 cites·21 claims
- 0778US9847322B2Semiconductor packages including through mold ball connectors and methods of manufacturing the sameSK HYNIX INC·Filed 2017·Granted Dec 19, 2017·3 cites·14 claims
- 0878US9659910B1Manufacturing methods semiconductor packages including through mold connectorsSK HYNIX INC·Filed 2016·Granted May 23, 2017·2 cites·19 claims
- 0972US12322681B2Semiconductor chip including through electrode, and semiconductor package including the sameSK HYNIX INC·Filed 2023·Granted Jun 3, 2025·0 cites·18 claims
- 1072US8912659B2Stacked semiconductor package and method for manufacturing the sameSK HYNIX INC·Filed 2012·Granted Dec 16, 2014·2 cites·9 claims
- 1172US6736351B2Tape guide device for magnetic recording/reproducing apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted May 18, 2004·7 cites·10 claims
- 1269US6581867B2Reel braking apparatus for a tape recorderSAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted Jun 24, 2003·7 cites·21 claims
- 1369US5476579AProcess for generating chlorine dioxide and apparatus thereforFiled 1995·Granted Dec 19, 1995·32 cites·5 claims
- 1465US7048219B2Reel clutch of a tape recorderSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted May 23, 2006·5 cites·6 claims
- 1563US9837360B2Wafer level packages and electronics system including the sameSK HYNIX INC·Filed 2016·Granted Dec 5, 2017·1 cites·19 claims
- 1661US9368481B2Semiconductor devices and packages having through electrodesSK HYNIX INC·Filed 2015·Granted Jun 14, 2016·1 cites·16 claims
- 1758US7859102B2Multi-layer stacked wafer level semiconductor package moduleHYNIX SEMICONDUCTOR INC·Filed 2008·Granted Dec 28, 2010·1 cites·13 claims
- 1858US7032852B2Tape loading device for a tape recorderSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Apr 25, 2006·3 cites·19 claims
- 1956US9252139B2Stacked semiconductor package and method for manufacturing the sameSK HYNIX INC·Filed 2014·Granted Feb 2, 2016·0 cites·10 claims
- 2056US7428121B2Method of locking tape cassette housing of tape recorderSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Sep 23, 2008·0 cites·6 claims
- 2153US9059150B2Conductive bump, semiconductor chip and stacked semiconductor package using the sameSK HYNIX INC·Filed 2012·Granted Jun 16, 2015·0 cites·7 claims
- 2253US7035043B2Moving deck plate for camcorderSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Apr 25, 2006·1 cites·19 claims
- 2352US11417618B2Semiconductor device including redistribution layer and method for fabricating the sameSK HYNIX INC·Filed 2020·Granted Aug 16, 2022·0 cites·23 claims
- 2452US7191971B2Reel clutch of a tape recorderSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Mar 20, 2007·0 cites·21 claims
- 2552US7092201B2Tape deck mechanism with main cam gear moving sub-deck, pole base loading unit, brake unit and main sliding memeberSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Aug 15, 2006·2 cites·23 claims
- 2652US6487054B1Ground device of head drum apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2000·Granted Nov 26, 2002·2 cites·22 claims
- 2751US9312232B2Conductive bump, semiconductor chip and stacked semiconductor package using the sameSK HYNIX INC·Filed 2015·Granted Apr 12, 2016·0 cites·11 claims
- 2851US7377461B2Tape-end sensor and a magnetic recording and reproducing apparatus having the sameSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted May 27, 2008·0 cites·22 claims
- 2951US7140570B2Reel brake device having simple structure and a magnetic recording/reproducing apparatus having the sameSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Nov 28, 2006·0 cites·7 claims
- 3051US6369991B1Head drum apparatusSAMSUNG ELECTRONICS CO LTD·Filed 1999·Granted Apr 9, 2002·9 cites·17 claims
- 3151US2013078807A1Wafer level chip scale package having an enhanced heat exchange efficiency with an emf shield and a method for fabricating the sameSK HYNIX INC·Filed 2012·Application pending·0 cites
- 3250US7121492B2Reel cover of magnetic recording/reproducing apparatus, and a method of manufacturing thereofSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Oct 17, 2006·0 cites·14 claims
- 3350US2009184414A1Wafer level chip scale package having an enhanced heat exchange efficiency with an emf shield and a method for fabricating the samePARK CHANG JUN·Filed 2008·Application pending·0 cites
- 3449US8338921B2Wafer level chip scale package having an enhanced heat exchange efficiency with an EMF shield and a method for fabricating the samePARK CHANG JUN·Filed 2011·Granted Dec 25, 2012·0 cites·3 claims
- 3549US7270290B2Magnetic recording and reproducing apparatus and driving method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Sep 18, 2007·0 cites·16 claims
- 3649US7079351B2Magnetic tape guiding device for use with a tape transport system of a tape recorder and method for using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Jul 18, 2006·1 cites·18 claims
- 3748US7312948B2Cassette tape ejecting apparatus, and magnetic recording/reproducing apparatus having the sameSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Dec 25, 2007·0 cites·10 claims
- 3848US2011006412A1Semiconductor chip package and method for manufacturing thereof and stack package using the sameHYNIX SEMICONDUCTOR INC·Filed 2009·Application pending·0 cites
- 3947US7273190B2Magnetic recording and reproducing apparatus and method for braking a reel assemblySAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Sep 25, 2007·0 cites·6 claims
- 4046US7199968B2Locking device for tape cassette housing of tape recorderSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Apr 3, 2007·0 cites·16 claims
- 4145US2005280949A1Head-drum assembly for magnetic recording/reproducing apparatus, and a method of manufacturing a head-drum assemblySAMSUNG ELECTRONICS CO LTD·Filed 2005·Application pending·0 cites
- 4245US2004136111A1Tape guide device for magnetic recording/reproducing apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2003·Application pending·0 cites
- 4345US2006103985A1Head drum assembly and magnetic recording/reproducing apparatus having the sameSAMSUNG ELECTRONICS CO LTD·Filed 2005·Application pending·0 cites
- 4444US9842822B2Semiconductor packages with socket plug interconnection structuresSK HYNIX INC·Filed 2015·Granted Dec 12, 2017·0 cites·16 claims
- 4544US2006022009A1Pinch roller assembly of a magnetic recording/reproducing apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2005·Application pending·0 cites
- 4644US2005280924A1Noise prevention apparatus and magnetic recording and reproducing apparatus having the sameSAMSUNG ELECTRONICS CO LTD·Filed 2005·Application pending·0 cites
- 4744US2024347037A1Method and apparatus for synthesizing unified voice wave based on self-supervised learningSUPERTONE INC·Filed 2024·Application pending·0 cites
- 4844US2005280929A1Deck plate and magnetic recording/playing apparatus having the sameSAMSUNG ELECTRONICS CO LTD·Filed 2005·Application pending·0 cites
- 4943US10991598B2Methods of fabricating semiconductor packages including circuit patternsSK HYNIX INC·Filed 2019·Granted Apr 27, 2021·0 cites·13 claims
- 5043US2005280950A1Head drum assembly for magnetic recording/reproducing apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2005·Application pending·0 cites
Showing the top 50 of 56 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →