Inventor · disambiguated record
Ashay Chitnis
Also filed as: CHITNIS ASHAY
22 granted patents·2 pending applications·480 citations·filing 2006–2018
96Inventor score
Top patents by PatentIndex Score
24 records- 0198US7982363B2Bulk acoustic device and method for fabricatingCREE INC·Filed 2007·Granted Jul 19, 2011·99 cites·39 claims
- 0297US8021904B2Ohmic contacts to nitrogen polarity GaNCREE INC·Filed 2008·Granted Sep 20, 2011·60 cites·28 claims
- 0396US9159888B2Wafer level phosphor coating method and devices fabricated utilizing methodCHITNIS ASHAY·Filed 2007·Granted Oct 13, 2015·60 cites·58 claims
- 0495US9024349B2Wafer level phosphor coating method and devices fabricated utilizing methodCHITNIS ASHAY·Filed 2007·Granted May 5, 2015·64 cites·24 claims
- 0593USD582865SLED chipCREE INC·Filed 2007·Granted Dec 16, 2008·49 cites·1 claims
- 0690US9496349B2P-doping of group-III-nitride buffer layer structure on a heterosubstrateAZURSPACE SOLAR POWER GMBH·Filed 2015·Granted Nov 15, 2016·6 cites·21 claims
- 0790USD593968SLED chipCREE INC·Filed 2008·Granted Jun 9, 2009·36 cites·1 claims
- 0890USD582866SLED chipCREE INC·Filed 2007·Granted Dec 16, 2008·37 cites·1 claims
- 0987US9634191B2Wire bond free wafer level LEDKELLER BERND·Filed 2007·Granted Apr 25, 2017·14 cites·30 claims
- 1079US8877524B2Emission tuning methods and devices fabricated utilizing methodsCHITNIS ASHAY·Filed 2009·Granted Nov 4, 2014·8 cites·20 claims
- 1178USD602450SLED chipCREE INC·Filed 2008·Granted Oct 20, 2009·19 cites·1 claims
- 1277US8878219B2Flip-chip phosphor coating method and devices fabricated utilizing methodCHITNIS ASHAY·Filed 2008·Granted Nov 4, 2014·6 cites·28 claims
- 1369US10199360B2Wire bond free wafer level LEDCREE INC·Filed 2017·Granted Feb 5, 2019·1 cites·20 claims
- 1469US9368428B2Dielectric wafer level bonding with conductive feed-throughs for electrical connection and thermal managementCHITNIS ASHAY·Filed 2007·Granted Jun 14, 2016·4 cites·46 claims
- 1563US9196799B2LED chips having fluorescent substrates with microholes and methods for fabricatingCHITNIS ASHAY·Filed 2008·Granted Nov 24, 2015·2 cites·28 claims
- 1662USD583338SLED chipCREE INC·Filed 2007·Granted Dec 23, 2008·10 cites·1 claims
- 1760US10211296B2P-doping of group-III-nitride buffer layer structure on a heterosubstrateAZURSPACE SOLAR POWER GMBH·Filed 2018·Granted Feb 19, 2019·0 cites·13 claims
- 1859US10026814B2P-doping of group-III-nitride buffer layer structure on a heterosubstrateAZURSPACE SOLAR POWER GMBH·Filed 2017·Granted Jul 17, 2018·0 cites·15 claims
- 1957US9786744B2P-doping of group-III-nitride buffer layer structure on a heterosubstrateAZURSPACE SOLAR POWER GMBH·Filed 2016·Granted Oct 10, 2017·0 cites·22 claims
- 2053US2015008457A1Flip-chip phosphor coating method and devices fabricated utilizing methodCREE INC·Filed 2014·Application pending·0 cites
- 2148USD616839SLED chipCREE INC·Filed 2008·Granted Jun 1, 2010·5 cites·1 claims
- 2245US8617997B2Selective wet etching of gold-tin based solderCHITNIS ASHAY·Filed 2007·Granted Dec 31, 2013·0 cites·21 claims
- 2343US2010224890A1Light emitting diode chip with electrical insulation elementCREE INC·Filed 2006·Application pending·0 cites
- 2442US10873002B2Permanent wafer bonding using metal alloy preform discsCHITNIS ASHAY·Filed 2006·Granted Dec 22, 2020·0 cites·15 claims
Join the waitlist — get patent alerts
Get an alert when Ashay Chitnis files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →