Inventor · disambiguated record
Soo Hyun Lyoo
Also filed as: LYOO SOO H · LYOO SOO HYUN
9 granted patents·8 pending applications·11 citations·filing 2005–2016
80Inventor score
Top patents by PatentIndex Score
17 records- 0181US10147533B2InductorSAMSUNG ELECTRO MECH·Filed 2016·Granted Dec 4, 2018·2 cites·20 claims
- 0266US8093172B2Glass composition, dielectric composition and multilayer ceramic capacitor embedded low temperature co-fired ceramic substrate using the sameCHOO HO SUNG·Filed 2008·Granted Jan 10, 2012·3 cites·9 claims
- 0364US7994084B2Dielectric composition and multilayer ceramic capacitor embedded low temperature co-fired ceramic substrate using the sameSAMSUNG ELECTRO MECH·Filed 2008·Granted Aug 9, 2011·4 cites·12 claims
- 0463US7675756B2Thin film-capacitor-embedded printed circuit board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2006·Granted Mar 9, 2010·2 cites·12 claims
- 0559US7998561B2Ceramic laminate and method of manufacturing ceramic sintered bodySAMSUNG ELECTRO MECH·Filed 2009·Granted Aug 16, 2011·0 cites·8 claims
- 0655US10468183B2Inductor and manufacturing method of the sameSAMSUNG ELECTRO MECH·Filed 2016·Granted Nov 5, 2019·0 cites·19 claims
- 0754US7886436B2Thin film capacitor-embedded printed circuit board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2009·Granted Feb 15, 2011·0 cites·11 claims
- 0852US7871482B2Method of manufacturing multilayer ceramic substrateSAMSUNG ELECTRO MECH·Filed 2009·Granted Jan 18, 2011·0 cites·12 claims
- 0949US2009107616A1Manufacturing method of multi-layer ceramic substrateSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 1049US2009117290A1Method of manufacturing non-shrinkage ceramic substrateSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 1149US2009214881A1Low temperature co-fired ceramic substrate having diffusion barrier layer and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
- 1248US2009133806A1Method of manufacturing dielectric sheet and multilayer ceramic substrateSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 1347US2009114433A1Multi-layered ceramic board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 1446US8147633B2Ceramic laminate and method of manufacturing ceramic sintered bodyLYOO SOO HYUN·Filed 2011·Granted Apr 3, 2012·0 cites·10 claims
- 1543US2009130473A1Carrier film for forming ceramic green sheet and method of fabricating ceramic green sheetCHO BEOM JOON·Filed 2008·Application pending·0 cites
- 1640US2009133805A1Method of manufacturing multilayer ceramic substrateSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 1739US2007004165A1Embedded thin layer capacitor, layered structure, and fabrication method of the sameSAMSUNG ELECTRO MECH·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →