Inventor · disambiguated record
Takahiro Hattori
Also filed as: HATTORI TAKAHIRO
23 granted patents·7 pending applications·120 citations·filing 1988–2022
94Inventor score
Top patents by PatentIndex Score
30 records- 0189US8922080B2Bus bar, motor, and process for producing theseNAKAGAWA AIRI·Filed 2011·Granted Dec 30, 2014·26 cites·14 claims
- 0287US7985702B2Woven fabric for airbagTOYO BOSEKI·Filed 2008·Granted Jul 26, 2011·9 cites·6 claims
- 0385US9668358B2Cu ballSENJU METAL INDUSTRY CO·Filed 2012·Granted May 30, 2017·7 cites·13 claims
- 0482US7994076B2Fabric for airbagTOYO BOSEKI·Filed 2008·Granted Aug 9, 2011·8 cites·7 claims
- 0580US7830051B2Resolver, manufacturing method thereof, and motor using the resolverNIDEC CORP·Filed 2008·Granted Nov 9, 2010·10 cites·13 claims
- 0674US10717157B2Solder material, solder paste, solder preform, solder joint and method of managing the solder materialSENJU METAL INDUSTRY CO·Filed 2014·Granted Jul 21, 2020·1 cites·12 claims
- 0774US10322472B2Cu core ball, solder paste, formed solder, Cu core column, and solder jointSENJU METAL INDUSTRY CO·Filed 2014·Granted Jun 18, 2019·3 cites·5 claims
- 0874US9662730B2Bump electrode, board which has bump electrodes, and method for manufacturing the boardSENJU METAL INDUSTRY CO·Filed 2014·Granted May 30, 2017·3 cites·2 claims
- 0972US6525126B1Method for producing reinforced thermoplastic resin composition and melt-kneading apparatusCHISSO CORP·Filed 2000·Granted Feb 25, 2003·18 cites·7 claims
- 1068US10381319B2Core material, semiconductor package, and forming method of bump electrodeSENJU METAL INDUSTRY CO·Filed 2017·Granted Aug 13, 2019·1 cites·20 claims
- 1160US2011097955A1Woven fabric for airbagTOYO BOSEKI·Filed 2010·Application pending·0 cites
- 1259US2011097956A1Fabric for AirbagTOYO BOSEKI·Filed 2010·Application pending·0 cites
- 1355US11478869B2Method for forming bump electrode substrateSENJU METAL INDUSTRY CO·Filed 2021·Granted Oct 25, 2022·0 cites·10 claims
- 1454US2010069599A1Oxetane-containing resin, as well as an adhesive and a resist agent using the sameTOYO BOSEKI·Filed 2007·Application pending·0 cites
- 1553US10610979B2Flux composition for solder applicationsSENJU METAL INDUSTRY CO·Filed 2018·Granted Apr 7, 2020·0 cites·2 claims
- 1653US6194523B1Adhesive resin composition and adhesive filmTOYO BOSEKI·Filed 1998·Granted Feb 27, 2001·14 cites·8 claims
- 1751US12246469B2Building material manufacturing apparatusNICHIHA KK·Filed 2022·Granted Mar 11, 2025·0 cites·14 claims
- 1850US9418578B2Signboard deviceHATTORI TAKAHIRO·Filed 2014·Granted Aug 16, 2016·0 cites·4 claims
- 1948US11465244B2Solder alloy, solder ball, chip solder, solder paste and solder jointSENJU METAL INDUSTRY CO·Filed 2016·Granted Oct 11, 2022·0 cites·7 claims
- 2047US8541321B2Copolymerized polyether polyamide resinHAGIWARA HIROAKI·Filed 2008·Granted Sep 24, 2013·1 cites·9 claims
- 2145US2020061757A1Solder material, solder paste, formed solder and solder jointSENJU METAL INDUSTRY CO·Filed 2018·Application pending·0 cites
- 2243US10773345B2Solder alloy, solder ball, chip solder, solder paste, and solder jointSENJU METAL INDUSTRY CO·Filed 2017·Granted Sep 15, 2020·0 cites·8 claims
- 2342US2015336216A1Cu BALLSENJU METAL INDUSTRY CO·Filed 2013·Application pending·0 cites
- 2442US2007229956A1Light reflective sheetCHISSO PETROCHEMICAL CORP·Filed 2007·Application pending·0 cites
- 2539US6676870B1Process for the preparation of fiber-filled thermoplastic resin compositionCHISSO CORP·Filed 1998·Granted Jan 13, 2004·7 cites·6 claims
- 2638US6596668B2Heat-sensitive recording materialCHISSO CORP·Filed 2001·Granted Jul 22, 2003·0 cites·4 claims
- 2736US2002015272A1Switch device and overcurrent controlling methodNEC CORP·Filed 2001·Application pending·0 cites
- 2835US4922595ATurret head unitKIRA MACHINERY CO LTD·Filed 1988·Granted May 8, 1990·9 cites·9 claims
- 2932US5705952AOperational amplifier circuitNEC CORP·Filed 1996·Granted Jan 6, 1998·3 cites·3 claims
- 3029US5977900AD/A converterNEC CORP·Filed 1997·Granted Nov 2, 1999·0 cites·7 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →