Inventor · disambiguated record
Dave Emory
Also filed as: EMORY DAVE
6 granted patents·3 pending applications·263 citations·filing 2001–2017
86Inventor score
Technology areasH10W
Top patents by PatentIndex Score
9 records- 0197US6853076B2Copper-containing C4 ball-limiting metallurgy stack for enhanced reliability of packaged structures and method of making sameINTEL CORP·Filed 2001·Granted Feb 8, 2005·203 cites·7 claims
- 0288US7196001B2Copper-containing C4 ball-limiting metallurgy stack for enhanced reliability of packaged structures and method of making sameINTEL CORP·Filed 2004·Granted Mar 27, 2007·34 cites·7 claims
- 0372US8952550B2Copper-containing C4 ball-limiting metallurgy stack for enhanced reliability of packaged structures and method of making sameDATTA MADHAV·Filed 2010·Granted Feb 10, 2015·2 cites·3 claims
- 0470US10037956B2Copper-containing C4 ball-limiting metallurgy stack for enhanced reliability of packaged structures and method of making sameINTEL CORP·Filed 2015·Granted Jul 31, 2018·1 cites·7 claims
- 0569US7250678B2Copper-containing C4 ball-limiting metallurgy stack for enhanced reliability of packaged structures and method of making sameINTEL CORP·Filed 2004·Granted Jul 31, 2007·10 cites·1 claims
- 0663US6740427B2Thermo-mechanically robust C4 ball-limiting metallurgy to prevent failure due to die-package interaction and method of making sameINTEL CORP·Filed 2001·Granted May 25, 2004·13 cites·25 claims
- 0757US2017141062A1Copper-containing c4 ball-limiting metallurgy stack for enhanced reliability of packaged structures and method of making sameINTEL CORP·Filed 2017·Application pending·0 cites
- 0848US2006148233A1Copper-containing C4 ball-limiting metallurgy stack for enhanced reliability of packaged structures and method of making sameDATTA MADHAV·Filed 2006·Application pending·0 cites
- 0935US2003060041A1Dual-stack, ball-limiting metallurgy and method of making sameINTEL CORP·Filed 2001·Application pending·0 cites
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