Inventor · disambiguated record
Madhav Datta
Also filed as: DATTA MADHAV
49 granted patents·10 pending applications·3,224 citations·filing 1990–2017
99Inventor score
Top patents by PatentIndex Score
59 records- 0199US6224690B1Flip-Chip interconnections using lead-free soldersIBM·Filed 1996·Granted May 1, 2001·191 cites·12 claims
- 0299US5567300AElectrochemical metal removal technique for planarization of surfacesIBM·Filed 1994·Granted Oct 22, 1996·370 cites·22 claims
- 0398US5462638ASelective etching of TiW for C4 fabricationIBM·Filed 1994·Granted Oct 31, 1995·82 cites·19 claims
- 0498US5217586AElectrochemical tool for uniform metal removal during electropolishingIBM·Filed 1992·Granted Jun 8, 1993·255 cites·20 claims
- 0597US6853076B2Copper-containing C4 ball-limiting metallurgy stack for enhanced reliability of packaged structures and method of making sameINTEL CORP·Filed 2001·Granted Feb 8, 2005·203 cites·7 claims
- 0697US5937320ABarrier layers for electroplated SnPb eutectic solder jointsIBM·Filed 1998·Granted Aug 10, 1999·297 cites·18 claims
- 0797US5543032AElectroetching method and apparatusIBM·Filed 1995·Granted Aug 6, 1996·162 cites·8 claims
- 0895US7836597B2Method of fabricating high surface to volume ratio structures and their integration in microheat exchangers for liquid cooling systemCOOLIGY INC·Filed 2006·Granted Nov 23, 2010·97 cites·16 claims
- 0995US6103096AApparatus and method for the electrochemical etching of a waferIBM·Filed 1997·Granted Aug 15, 2000·219 cites·30 claims
- 1095US5486282AElectroetching process for seed layer removal in electrochemical fabrication of wafersIBM·Filed 1994·Granted Jan 23, 1996·88 cites·5 claims
- 1193US6696758B2Interconnect structures and a method of electroless introduction of interconnect structuresINTEL CORP·Filed 2002·Granted Feb 24, 2004·57 cites·14 claims
- 1291US6977224B2Method of electroless introduction of interconnect structuresINTEL CORP·Filed 2000·Granted Dec 20, 2005·50 cites·26 claims
- 1391US5558957AMethod for making a thin flexible primary battery for microelectronics applicationsIBM·Filed 1994·Granted Sep 24, 1996·108 cites·29 claims
- 1489US6917106B2Selective ball-limiting metallurgy etching processes for fabrication of electroplated tin bumpsINTEL CORP·Filed 2004·Granted Jul 12, 2005·46 cites·7 claims
- 1588US7196001B2Copper-containing C4 ball-limiting metallurgy stack for enhanced reliability of packaged structures and method of making sameINTEL CORP·Filed 2004·Granted Mar 27, 2007·34 cites·7 claims
- 1688US5268072AEtching processes for avoiding edge stress in semiconductor chip solder bumpsIBM·Filed 1992·Granted Dec 7, 1993·119 cites·14 claims
- 1788US5066370AApparatus, electrochemical process, and electrolyte for microfinishing stainless steel print bandsIBM·Filed 1990·Granted Nov 19, 1991·56 cites·29 claims
- 1887US5865984AElectrochemical etching apparatus and method for spirally etching a workpieceIBM·Filed 1997·Granted Feb 2, 1999·60 cites·32 claims
- 1985US8254422B2Microheat exchanger for laser diode coolingDATTA MADHAV·Filed 2009·Granted Aug 28, 2012·14 cites·27 claims
- 2085US5567304AElimination of island formation and contact resistance problems during electroetching of blanket or patterned thin metallic layers on insulating substrateIBM·Filed 1995·Granted Oct 22, 1996·54 cites·22 claims
- 2185US5284554AElectrochemical micromachining tool and process for through-mask patterning of thin metallic films supported by non-conducting or poorly conducting surfacesIBM·Filed 1992·Granted Feb 8, 1994·57 cites·31 claims
- 2284US6703069B1Under bump metallurgy for lead-tin bump over copper padINTEL CORP·Filed 2002·Granted Mar 9, 2004·33 cites·6 claims
- 2381US5536388AVertical electroetch tool nozzle and methodIBM·Filed 1995·Granted Jul 16, 1996·42 cites·13 claims
- 2480US6750133B2Selective ball-limiting metallurgy etching processes for fabrication of electroplated tin bumpsINTEL CORP·Filed 2002·Granted Jun 15, 2004·24 cites·23 claims
- 2577US5614076ATool and method for electroetchingIBM·Filed 1996·Granted Mar 25, 1997·33 cites·23 claims
- 2676US6878465B2Under bump metallurgy for Lead-Tin bump over copper padINTEL CORP·Filed 2003·Granted Apr 12, 2005·19 cites·9 claims
- 2775US5800726ASelective chemical etching in microelectronics fabricationIBM·Filed 1995·Granted Sep 1, 1998·45 cites·11 claims
- 2873US5152878AMethod for electrochemical cleaning of metal residue on molybdenum masksIBM·Filed 1991·Granted Oct 6, 1992·29 cites·19 claims
- 2972US8952550B2Copper-containing C4 ball-limiting metallurgy stack for enhanced reliability of packaged structures and method of making sameDATTA MADHAV·Filed 2010·Granted Feb 10, 2015·2 cites·3 claims
- 3070US10037956B2Copper-containing C4 ball-limiting metallurgy stack for enhanced reliability of packaged structures and method of making sameINTEL CORP·Filed 2015·Granted Jul 31, 2018·1 cites·7 claims
- 3170US6030728AHigh performance lithium polymer electrolyte batteryIBM·Filed 1997·Granted Feb 29, 2000·43 cites·23 claims
- 3269US7250678B2Copper-containing C4 ball-limiting metallurgy stack for enhanced reliability of packaged structures and method of making sameINTEL CORP·Filed 2004·Granted Jul 31, 2007·10 cites·1 claims
- 3369US5531874AElectroetching tool using localized application of channelized flow of electrolyteIBM·Filed 1994·Granted Jul 2, 1996·29 cites·14 claims
- 3468US5989751AHigh energy density, flexible lithium primary batteriesIBM·Filed 1997·Granted Nov 23, 1999·39 cites·20 claims
- 3568US5105537AMethod for making a detachable electrical contactIBM·Filed 1990·Granted Apr 21, 1992·25 cites·5 claims
- 3667US8299604B2Bonded metal and ceramic plates for thermal management of optical and electronic devicesDATTA MADHAV·Filed 2009·Granted Oct 30, 2012·3 cites·5 claims
- 3767US5796168AMetallic interconnect pad, and integrated circuit structure using same, with reduced undercutIBM·Filed 1996·Granted Aug 18, 1998·30 cites·8 claims
- 3865US5476575AFabrication of moly masks by electroetchingIBM·Filed 1994·Granted Dec 19, 1995·19 cites·24 claims
- 3964US5456788AMethod and apparatus for contactless real-time in-situ monitoring of a chemical etching processIBM·Filed 1995·Granted Oct 10, 1995·25 cites·10 claims
- 4063US6740427B2Thermo-mechanically robust C4 ball-limiting metallurgy to prevent failure due to die-package interaction and method of making sameINTEL CORP·Filed 2001·Granted May 25, 2004·13 cites·25 claims
- 4159US6656750B1Method for testing chips on flat solder bumpsIBM·Filed 1999·Granted Dec 2, 2003·17 cites·7 claims
- 4257US5759437AEtching of Ti-W for C4 reworkIBM·Filed 1996·Granted Jun 2, 1998·20 cites·17 claims
- 4357US2017141062A1Copper-containing c4 ball-limiting metallurgy stack for enhanced reliability of packaged structures and method of making sameINTEL CORP·Filed 2017·Application pending·0 cites
- 4456US5445705AMethod and apparatus for contactless real-time in-situ monitoring of a chemical etching processIBM·Filed 1994·Granted Aug 29, 1995·22 cites·10 claims
- 4555US5190463AHigh performance metal cone contactIBM·Filed 1991·Granted Mar 2, 1993·15 cites·9 claims
- 4654US5939223ALithium polymer electrolyte battery for sub-ambient temperature applicationsIBM·Filed 1997·Granted Aug 17, 1999·22 cites·21 claims
- 4754US5620611AMethod to improve uniformity and reduce excess undercuts during chemical etching in the manufacture of solder padsIBM·Filed 1996·Granted Apr 15, 1997·16 cites·8 claims
- 4851US6238589B1Methods for monitoring components in the TiW etching bath used in the fabrication of C4sIBM·Filed 1998·Granted May 29, 2001·14 cites·24 claims
- 4948US2006148233A1Copper-containing C4 ball-limiting metallurgy stack for enhanced reliability of packaged structures and method of making sameDATTA MADHAV·Filed 2006·Application pending·0 cites
- 5045US2011073292A1Fabrication of high surface area, high aspect ratio mini-channels and their application in liquid cooling systemsDATTA MADHAV·Filed 2009·Application pending·0 cites
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