Inventor · disambiguated record
Hidenori Miyakawa
Also filed as: MIYAKAWA HIDENORI
25 granted patents·6 pending applications·153 citations·filing 2000–2018
95Inventor score
Files withPANASONIC CORP7MIYAKAWA HIDENORI4YAMAGUCHI ATSUSHI4KUWABARA RYO3MATSUSHITA ELECTRIC INDUSTRIAL CO LTD3
Top patents by PatentIndex Score
31 records- 0190US6780668B1Package of semiconductor device and method of manufacture thereofMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2000·Granted Aug 24, 2004·56 cites·29 claims
- 0285US7935892B2Electronic circuit device and method for manufacturing samePANASONIC CORP·Filed 2006·Granted May 3, 2011·14 cites·11 claims
- 0380US7785500B2Electrically conductive adhesivePANASONIC CORP·Filed 2006·Granted Aug 31, 2010·9 cites·7 claims
- 0476US8378472B2Mounting structure for semiconductor element with underfill resinPANASONIC CORP·Filed 2008·Granted Feb 19, 2013·7 cites·9 claims
- 0576US8293370B2Bonding material, bonded portion and circuit boardYAMAGUCHI ATSUSHI·Filed 2007·Granted Oct 23, 2012·3 cites·15 claims
- 0675US8138426B2Mounting structureMATSUNO KOSO·Filed 2008·Granted Mar 20, 2012·9 cites·14 claims
- 0774US6708401B2Method of manufacturing article having electronic circuitMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Mar 23, 2004·15 cites·11 claims
- 0873US7090482B2Semiconductor device package manufacturing method and semiconductor device package manufactured by the methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted Aug 15, 2006·17 cites·11 claims
- 0970US8450859B2Semiconductor device mounted structure and its manufacturing methodOHASHI NAOMICHI·Filed 2009·Granted May 28, 2013·5 cites·12 claims
- 1068US8679635B2Bonding material, bonded portion and circuit boardYAMAGUCHI ATSUSHI·Filed 2012·Granted Mar 25, 2014·1 cites·14 claims
- 1166US8410377B2Mounted structureYAMAGUCHI ATSUSHI·Filed 2008·Granted Apr 2, 2013·3 cites·4 claims
- 1265US8344268B2Electronic component packaging structure having two-layer moisture-proof coating and method for manufacturing the samePANASONIC CORP·Filed 2009·Granted Jan 1, 2013·4 cites·7 claims
- 1363US8697237B2Thermosetting resin composition, method of manufacturing the same and circuit boardPANASONIC CORP·Filed 2013·Granted Apr 15, 2014·0 cites·8 claims
- 1462US8540903B2Electrically conductive paste, and electrical and electronic device comprising the sameHIGUCHI TAKAYUKI·Filed 2008·Granted Sep 24, 2013·3 cites·6 claims
- 1559US2010147567A1Thermosetting Resin Composition, Method of Manufacturing the Same and Circuit BoardPANASONIC ELEC WORKS CO LTD·Filed 2007·Application pending·0 cites
- 1658US11293583B2Heat-insulation material, heat-insulation structure using same, and process for producing samePANASONIC IP MAN CO LTD·Filed 2018·Granted Apr 5, 2022·0 cites·2 claims
- 1758US8205327B2Method for manufacturing circuit board on which electronic component is mountedMIYAKAWA HIDENORI·Filed 2006·Granted Jun 26, 2012·2 cites·5 claims
- 1857US8217275B2Sealing material and mounting method using the sealing materialYAMAGUCHI ATSUSHI·Filed 2007·Granted Jul 10, 2012·2 cites·9 claims
- 1957US8182923B2Conductive paste and mounting structure using the sameOHASHI NAOMICHI·Filed 2009·Granted May 22, 2012·1 cites·17 claims
- 2056US9072204B2Electronic module and production method thereforKUWABARA RYO·Filed 2010·Granted Jun 30, 2015·1 cites·5 claims
- 2155US8179686B2Mounted structural body and method of manufacturing the sameSAKATANI SHIGEAKI·Filed 2008·Granted May 15, 2012·1 cites·12 claims
- 2253US10407604B2Heat-dissipating resin composition, and component and electronic device including the samePANASONIC IP MAN CO LTD·Filed 2015·Granted Sep 10, 2019·0 cites·16 claims
- 2352US8012379B2Electroconductive bonding material and electric/electronic device using the samePANASONIC CORP·Filed 2010·Granted Sep 6, 2011·0 cites·19 claims
- 2448US8482931B2Package structureKUWABARA RYO·Filed 2009·Granted Jul 9, 2013·0 cites·17 claims
- 2548US8345444B2Structure with electronic component mounted therein and method for manufacturing such structurePANASONIC CORP·Filed 2008·Granted Jan 1, 2013·0 cites·14 claims
- 2647US8481629B2Surface mount adhesive, mounting structure including the same, and method for producing mounting structureKUWABARA RYO·Filed 2009·Granted Jul 9, 2013·0 cites·9 claims
- 2745US2002122915A1Adhesive, process for the preparation thereof, and process for mounting componentsFiled 2001·Application pending·0 cites
- 2843US2009236036A1Heat curable resin composition, and mounting method and reparing process for circuit board using the heat curable compositionMIYAKAWA HIDENORI·Filed 2007·Application pending·0 cites
- 2943US2013344369A1Secondary battery unitMIYAKAWA HIDENORI·Filed 2012·Application pending·0 cites
- 3042US2009032293A1Electroconductive Bonding Material and Electric/Electronic Device Using the SameMIYAKAWA HIDENORI·Filed 2006·Application pending·0 cites
- 3141US2004078965A1Article with electronic circuit formed and method of manufacturing the sameFiled 2003·Application pending·0 cites
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