Inventor · disambiguated record
Yukiharu Takeuchi
Also filed as: TAKEUCHI YUKIHARU
28 granted patents·2 pending applications·635 citations·filing 1989–2016
97Inventor score
Files withSHINKO ELECTRIC IND CO23TAKAYANAGI HIDENORI2TOYODA GOSEI KK2GOMYO TOSHIO1TAKEUCHI YUKIHARU1
Top patents by PatentIndex Score
30 records- 0197US7279771B2Wiring board mounting a capacitorSHINKO ELECTRIC IND CO·Filed 2005·Granted Oct 9, 2007·86 cites·5 claims
- 0296US7723838B2Package structure having semiconductor device embedded within wiring boardSHINKO ELECTRIC IND CO·Filed 2005·Granted May 25, 2010·87 cites·7 claims
- 0393US7791206B2Semiconductor device and method of manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2005·Granted Sep 7, 2010·42 cites·2 claims
- 0492US7843059B2Electronic parts packaging structureSHINKO ELECTRIC IND CO·Filed 2006·Granted Nov 30, 2010·28 cites·5 claims
- 0591US10006565B2Fuel supply apparatusTOYODA GOSEI KK·Filed 2016·Granted Jun 26, 2018·13 cites·3 claims
- 0691US9490221B2Semiconductor device having multiple magnetic shield membersSHINKO ELECTRIC IND CO·Filed 2015·Granted Nov 8, 2016·8 cites·20 claims
- 0788US8729680B2Semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2012·Granted May 20, 2014·11 cites·4 claims
- 0883US8373997B2Semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2010·Granted Feb 12, 2013·7 cites·9 claims
- 0982US6093476AWiring substrate having viasSHINKO ELECTRIC IND CO·Filed 1998·Granted Jul 25, 2000·69 cites·10 claims
- 1078US7816177B2Semiconductor device and method of manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2009·Granted Oct 19, 2010·5 cites·6 claims
- 1176US6194668B1Multi-layer circuit boardSHINKO ELECTRIC IND CO·Filed 1998·Granted Feb 27, 2001·49 cites·3 claims
- 1272US7788061B2Substrate and mask aligning apparatusSHINKO ELECTRIC IND CO·Filed 2008·Granted Aug 31, 2010·3 cites·12 claims
- 1370US8191568B2Fuel tank for motor vehicleTAKEUCHI YUKIHARU·Filed 2009·Granted Jun 5, 2012·4 cites·12 claims
- 1469US5983950AHose structure and method of manufacturing the sameTOYODA GOSEI KK·Filed 1997·Granted Nov 16, 1999·33 cites·13 claims
- 1567US6271478B1Multi-layer circuit boardSHINKO ELECTRIC IND CO·Filed 1998·Granted Aug 7, 2001·35 cites·2 claims
- 1667US5497030ALead frame and resin-molded-type semiconductor deviceSHINKO ELECTRIC IND CO·Filed 1994·Granted Mar 5, 1996·36 cites·10 claims
- 1766US5997999ASintered body for manufacturing ceramic substrateSHINKO ELECTRIC IND CO·Filed 1997·Granted Dec 7, 1999·32 cites·10 claims
- 1866US5229213AAluminum nitride circuit boardSHINKO ELECTRIC IND CO·Filed 1989·Granted Jul 20, 1993·30 cites·1 claims
- 1951US8525355B2Semiconductor device, electronic apparatus and semiconductor device fabricating methodTAKAYANAGI HIDENORI·Filed 2007·Granted Sep 3, 2013·2 cites·3 claims
- 2051US5919546APorous ceramic impregnated wiring bodySHINKO ELECTRIC IND CO·Filed 1997·Granted Jul 6, 1999·16 cites·10 claims
- 2149US8053677B2Electronic apparatus and method of manufacturing the same, and wiring substrate and method of manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2008·Granted Nov 8, 2011·0 cites·11 claims
- 2249US6221749B1Semiconductor device and production thereofSHINKO ELECTRIC IND CO·Filed 1999·Granted Apr 24, 2001·15 cites·20 claims
- 2345US5744224ABoard for mounting semiconductor chipSHINKO ELECTRIC IND CO·Filed 1995·Granted Apr 28, 1998·12 cites·22 claims
- 2444US8853841B2Lead frame which includes terminal portion having through groove covered by lid portion, semiconductor package, and manufacturing method of the sameSHINKO ELECTRIC IND CO·Filed 2013·Granted Oct 7, 2014·0 cites·10 claims
- 2541US5733640AFired body for manufacturing a substrateSHINKO ELECTRIC IND CO·Filed 1995·Granted Mar 31, 1998·9 cites·10 claims
- 2638US8402644B2Method of manufacturing an electronic parts packaging structureGOMYO TOSHIO·Filed 2010·Granted Mar 26, 2013·0 cites·5 claims
- 2736US2012133056A1Semiconductor device, electronic apparatus and semiconductor device fabricating methodTAKAYANAGI HIDENORI·Filed 2012·Application pending·0 cites
- 2835US2001005051A1Semiconductor package and semiconductor deviceFiled 2000·Application pending·0 cites
- 2932US6534846B1Lead frame for semiconductor device and semiconductor device using sameSHINKO ELECTRIC IND CO·Filed 1999·Granted Mar 18, 2003·2 cites·6 claims
- 3031US6429517B1Semiconductor device and fabrication method thereofSHINKO ELECTRIC IND CO·Filed 1999·Granted Aug 6, 2002·1 cites·13 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →