Inventor · disambiguated record
David F. Cheffings
Also filed as: CHEFFINGS DAVID F
9 granted patents·227 citations·filing 1992–2000
90Inventor score
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9 records- 0190US5378641AElectrically conductive substrate interconnect continuity region and method of forming same with an angled implantMICRON SEMICONDUCTOR INC·Filed 1993·Granted Jan 3, 1995·82 cites·2 claims
- 0279US5387550AMethod for making a fillet for integrated circuit metal plugMICRON TECHNOLOGY INC·Filed 1992·Granted Feb 7, 1995·62 cites·12 claims
- 0373US5994182AMethod of reducing outdiffusion from a doped three-dimensional polysilicon film into substrate by using angled implantsMICRON TECHNOLOGY INC·Filed 1996·Granted Nov 30, 1999·25 cites·9 claims
- 0455US5976960AMethod of forming an electrically conductive substrate interconnect continuity region with an angled implantMICRON TECHNOLOGY INC·Filed 1998·Granted Nov 2, 1999·16 cites·11 claims
- 0554US5858845AElectrically conductive substrate interconnect continuity region and method of forming same with an angled implantMICRON TECHNOLOGY INC·Filed 1997·Granted Jan 12, 1999·16 cites·6 claims
- 0652US6159790AMethod of controlling outdiffusion in doped three-dimensional film by using angled implantsMICRON TECHNOLOGY INC·Filed 1999·Granted Dec 12, 2000·9 cites·41 claims
- 0748US6211545B1Device fabricated by a method of controlling outdiffusion from a doped three-dimensional filmMICRON TECHNOLOGY INC·Filed 1999·Granted Apr 3, 2001·7 cites·16 claims
- 0847US6440825B1Method of controlling outdiffusion in a doped three-dimensional filmMICRON TECHNOLOGY INC·Filed 2000·Granted Aug 27, 2002·2 cites·17 claims
- 0943US6320235B1Apparatus having low resistance angled implant regionsMICRON TECHNOLOGY INC·Filed 1999·Granted Nov 20, 2001·8 cites·39 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →