Inventor · disambiguated record
Jerry Ihor Tustaniwskyj
Also filed as: TUSTANIWSKYJ J · TUSTANIWSKYJ JERRY I · TUSTANIWSKYJ JERRY IHOR
53 granted patents·5 pending applications·1,333 citations·filing 1977–2025
99Inventor score
Top patents by PatentIndex Score
58 records- 0194US4698728ALeak tolerant liquid cooling systemUNISYS CORP·Filed 1986·Granted Oct 6, 1987·91 cites·8 claims
- 0290US5821505ATemperature control system for an electronic device which achieves a quick response by interposing a heater between the device and a heat sinkUNISYS CORP·Filed 1997·Granted Oct 13, 1998·112 cites·16 claims
- 0390US5019943AHigh density chip stack having a zigzag-shaped face which accommodates connections between chipsUNISYS CORP·Filed 1990·Granted May 28, 1991·159 cites·17 claims
- 0488US9010188B2System and method for accelerating a deviceTUSTANIWSKYJ JERRY IHOR·Filed 2011·Granted Apr 21, 2015·9 cites·26 claims
- 0588US6774661B1Initial contact method of preventing an integrated circuit chip from being thermally destroyed, in a tester, due to a defective pressed jointUNISYS CORP·Filed 2003·Granted Aug 10, 2004·37 cites·15 claims
- 0685US9500701B2Alignment mechanismTUSTANIWSKYJ JERRY IHOR·Filed 2011·Granted Nov 22, 2016·6 cites·22 claims
- 0785US4893499AMethod and apparatus for detecting leaks in IC packages by sensing package deflectionsUNISYS CORP·Filed 1988·Granted Jan 16, 1990·44 cites·7 claims
- 0885US4879629ALiquid cooled multi-chip integrated circuit module incorporating a seamless compliant member for leakproof operationUNISYS CORP·Filed 1988·Granted Nov 7, 1989·70 cites·8 claims
- 0985US4721996ASpring loaded module for cooling integrated circuit packages directly with a liquidUNISYS CORP·Filed 1986·Granted Jan 26, 1988·68 cites·10 claims
- 1084US12140625B2Alignment mechanismDELTA DESIGN INC·Filed 2023·Granted Nov 12, 2024·0 cites·20 claims
- 1184US11039528B2Assembly and sub-assembly for thermal control of electronic devicesDELTA DESIGN INC·Filed 2019·Granted Jun 15, 2021·7 cites·18 claims
- 1283US5844208ATemperature control system for an electronic device in which device temperature is estimated from heater temperature and heat sink temperatureUNISYS CORP·Filed 1997·Granted Dec 1, 1998·68 cites·14 claims
- 1382US10770317B2Leak tolerant liquid cooling system employing improved air purging mechanismDELTA DESIGN INC·Filed 2016·Granted Sep 8, 2020·3 cites·21 claims
- 1481US6042388AElectromechanical module having a thin springy plate for establishing pressed electrical connectionsUNISYS CORP·Filed 1999·Granted Mar 28, 2000·51 cites·15 claims
- 1580US9733151B2System and method for accelerating a deviceDELTA DESIGN INC·Filed 2015·Granted Aug 15, 2017·2 cites·20 claims
- 1679US5918665AMethod of thermal coupling an electronic device to a heat exchange member while said electronic device is being testedUNISYS CORP·Filed 1998·Granted Jul 6, 1999·47 cites·5 claims
- 1778US6914446B1Chip tester having a heat-exchanger with an extendable period of operationUNISYS CORP·Filed 2003·Granted Jul 5, 2005·20 cites·15 claims
- 1878US6074219AElectromechanical subassembly including a carrier with springy contacts that exert large and small contact forcesUNISYS CORP·Filed 1998·Granted Jun 13, 2000·38 cites·15 claims
- 1977US7199597B2Dual feedback control system for maintaining the temperature of an IC-chip near a set-pointDELTA DESIGN INC·Filed 2004·Granted Apr 3, 2007·19 cites·16 claims
- 2073US6809543B1Abrupt power change method of preventing an integrated circuit chip from being thermally destroyed, in a tester, due to a defective pressed jointUNISYS CORP·Filed 2003·Granted Oct 26, 2004·16 cites·17 claims
- 2172US11879910B2Socket side thermal systemDELTA DESIGN INC·Filed 2020·Granted Jan 23, 2024·0 cites·17 claims
- 2272US6522156B2Planar subassembly for testing IC chips having faces with pressed electrical contacts that carry all power and signals for the chipsUNISYS CORP·Filed 2000·Granted Feb 18, 2003·19 cites·9 claims
- 2371US6307388B1Electromechanical apparatus for testing IC chips using first and second sets of substrates which are pressed togetherUNISYS CORP·Filed 2000·Granted Oct 23, 2001·17 cites·12 claims
- 2470US11802908B2Alignment mechanismDELTA DESIGN INC·Filed 2020·Granted Oct 31, 2023·0 cites·28 claims
- 2570US7004243B1Method of extending the operational period of a heat-exchanger in a chip testerUNISYS CORP·Filed 2003·Granted Feb 28, 2006·23 cites·13 claims
- 2669US7373967B1Mechanical assembly, for regulating the temperature of an IC-Chip, having a gimbaled heat-exchanger with coiled springy conduitsDELTA DESIGN INC·Filed 2004·Granted May 20, 2008·15 cites·14 claims
- 2769US6325662B1Apparatus for testing IC chips using a sliding springy mechanism which exerts a nearly constant force apparatusUNISYS CORP·Filed 2000·Granted Dec 4, 2001·14 cites·12 claims
- 2868US6412551B1System for regulating the temperature of IC-chips with a fluid which is heated and cooled as a function of the fluid temperatures to and from heat exchangers for the IC-chipsUNISYS CORP·Filed 2000·Granted Jul 2, 2002·19 cites·11 claims
- 2968US6362944B1System for regulating the temperature of IC-chips with a fluid whose temperature is controlled quickly by a slow response cooler and a fast response heaterUNISYS CORP·Filed 2000·Granted Mar 26, 2002·19 cites·11 claims
- 3068US6307391B1Pivoting springy mechanism that opens and closes pressed electrical contacts with a force which is nearly constant over a range of closed positionsUNISYS CORP·Filed 2000·Granted Oct 23, 2001·14 cites·13 claims
- 3167US6995980B2Temperature control system which sprays liquid coolant droplets against an IC-module and directs radiation against the IC-moduleUNISYS CORP·Filed 2003·Granted Feb 7, 2006·12 cites·13 claims
- 3267US2025334628A1Apparatuses and methods for testing electronic devicesDELTA DESIGN INC·Filed 2025·Application pending·0 cites
- 3366US5579205AElectromechanical module with post-solder attachable/removable heat sink frame and low profileUNISYS CORP·Filed 1995·Granted Nov 26, 1996·37 cites·15 claims
- 3465US5307239AElectromechanical module with small footprint and post-solder attachable/removable heat sink frameUNISYS CORP·Filed 1992·Granted Apr 26, 1994·38 cites·12 claims
- 3563US6116331AMechanical assembly for regulating the temperature of an electronic device which incorporates a single leaf spring for self-alignment plus a low initial contact force and a low profileUNISYS CORP·Filed 1998·Granted Sep 12, 2000·29 cites·14 claims
- 3663US4809134ALow stress liquid cooling assemblyUNISYS CORP·Filed 1988·Granted Feb 28, 1989·31 cites·12 claims
- 3761US5441195AMethod of stretching solder jointsUNISYS CORP·Filed 1994·Granted Aug 15, 1995·22 cites·19 claims
- 3860US10782316B2Socket side thermal systemDELTA DESIGN INC·Filed 2017·Granted Sep 22, 2020·0 cites·12 claims
- 3959US6822465B1Method of regulating the temperature of integrated circuit modules, using a heat exchanger with a face of a solid malleable metal and a release agentUNISYS CORP·Filed 2002·Granted Nov 23, 2004·8 cites·8 claims
- 4058US12000884B2Integrated circuit testing device with coupled control of thermal systemDELTA DESIGN INC·Filed 2021·Granted Jun 4, 2024·0 cites·20 claims
- 4158US6108208ATesting assembly having a pressed joint with a single layer of thermal conductor which is reused to sequentially test multiple circuit modulesUNISYS CORP·Filed 1997·Granted Aug 22, 2000·23 cites·7 claims
- 4256US6179047B1Mechanical assembly for regulating the temperature of an electronic device which incorporates at least two leaf springs for self-alignment plus a low initial contact force and a low profileUNISYS CORP·Filed 1998·Granted Jan 30, 2001·20 cites·14 claims
- 4355US8628240B2Temperature measurement using a diode with saturation current cancellationTUSTANIWSKYJ JERRY IHOR·Filed 2009·Granted Jan 14, 2014·2 cites·34 claims
- 4455US2017067960A1Alignment mechanismDELTA DESIGN INC·Filed 2016·Application pending·0 cites
- 4552US11774486B2Temperature control system including contactor assemblyDELTA DESIGN INC·Filed 2022·Granted Oct 3, 2023·0 cites·22 claims
- 4652US6658736B1Method of fabricating a heat exchanger, for regulating the temperature of multiple integrated circuit modules, having a face of a solid malleable metal coated with a release agentUNISYS CORP·Filed 2002·Granted Dec 9, 2003·5 cites·17 claims
- 4751US4807019ACavity-up-cavity-down multichip integrated circuit packageUNISYS CORP·Filed 1988·Granted Feb 21, 1989·17 cites·17 claims
- 4850US6243944B1Residue-free method of assembling and disassembling a pressed joint with low thermal resistanceUNISYS CORP·Filed 1997·Granted Jun 12, 2001·16 cites·10 claims
- 4950US6196299B1Mechanical assembly for regulating the temperature of an electronic device which incorporates a heat exchanger that contacts an entire planar face on the device except for its cornersUNISYS CORP·Filed 1998·Granted Mar 6, 2001·17 cites·16 claims
- 5050US5967798AIntegrated circuit module having springy contacts of at least two different types for reduced stressUNISYS CORP·Filed 1998·Granted Oct 19, 1999·16 cites·12 claims
Showing the top 50 of 58 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →