Inventor · disambiguated record
Tsan-Hua Tung
Also filed as: TUNG TSAN-HUA
7 granted patents·1 pending application·1,026 citations·filing 2011–2018
83Inventor score
Top patents by PatentIndex Score
8 records- 0198US9000584B2Packaged semiconductor device with a molding compound and a method of forming the sameLIN JING-CHENG·Filed 2011·Granted Apr 7, 2015·1k cites·20 claims
- 0283US9312148B2Method of packaging a semiconductor deviceTAIWAN SEMICONDUCTOR MFG·Filed 2015·Granted Apr 12, 2016·3 cites·20 claims
- 0374US9673098B2Methods of packaging semiconductor devices and structures thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jun 6, 2017·1 cites·20 claims
- 0469US9117682B2Methods of packaging semiconductor devices and structures thereofLIN JING-CHENG·Filed 2011·Granted Aug 25, 2015·1 cites·18 claims
- 0564US10964594B2Methods of packaging semiconductor devices including placing semiconductor devices into die cavesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Mar 30, 2021·0 cites·18 claims
- 0660US10163711B2Methods of packaging semiconductor devices including placing semiconductor devices into die cavesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 25, 2018·0 cites·19 claims
- 0756US9406581B2Methods of packaging semiconductor devices and structures thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Aug 2, 2016·0 cites·19 claims
- 0827US2012153520A1New-type chitosan-based hybrid macromolecule and a method for producing or using the macromoleculeLIU DEAN-MO·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →