Inventor · disambiguated record
Krishna R. Tunga
Also filed as: TUNGA KRISHNA · TUNGA KRISHNA R
44 granted patents·3 pending applications·45 citations·filing 2011–2021
96Inventor score
Top patents by PatentIndex Score
47 records- 0192US10090271B1Metal pad modificationIBM·Filed 2017·Granted Oct 2, 2018·6 cites·16 claims
- 0289US9754905B1Final passivation for wafer level warpage and ULK stress reductionIBM·Filed 2016·Granted Sep 5, 2017·6 cites·6 claims
- 0388US10424527B2Electronic package with tapered pedestalIBM·Filed 2017·Granted Sep 24, 2019·5 cites·20 claims
- 0487US11282773B2Enlarged conductive pad structures for enhanced chip bond assembly yieldIBM·Filed 2020·Granted Mar 22, 2022·2 cites·13 claims
- 0587US10916154B2Language learning and speech enhancement through natural language processingIBM·Filed 2017·Granted Feb 9, 2021·3 cites·18 claims
- 0682US11302651B2Laminated stiffener to control the warpage of electronic chip carriersIBM·Filed 2019·Granted Apr 12, 2022·2 cites·19 claims
- 0782US9947598B1Determining crackstop strength of integrated circuit assembly at the wafer levelIBM·Filed 2017·Granted Apr 17, 2018·3 cites·20 claims
- 0880US10426400B2Optimized individual sleep patternsIBM·Filed 2017·Granted Oct 1, 2019·2 cites·13 claims
- 0980US10276534B2Reduction of solder interconnect stressIBM·Filed 2017·Granted Apr 30, 2019·2 cites·14 claims
- 1075US10756031B1Decoupling capacitor stiffenerIBM·Filed 2019·Granted Aug 25, 2020·2 cites·18 claims
- 1175US10373925B2Metal pad modificationIBM·Filed 2018·Granted Aug 6, 2019·1 cites·4 claims
- 1273US10665524B2Electronic package cover having underside ribIBM·Filed 2017·Granted May 26, 2020·1 cites·16 claims
- 1371US10325830B1Multipart lid for a semiconductor package with multiple componentsIBM·Filed 2017·Granted Jun 18, 2019·1 cites·17 claims
- 1470US9842810B1Tiled-stress-alleviating pad structureGLOBALFOUNDRIES INC·Filed 2016·Granted Dec 12, 2017·1 cites·12 claims
- 1569US11210968B2Behavior-based interactive educational sessionsIBM·Filed 2018·Granted Dec 28, 2021·2 cites·17 claims
- 1669US9865557B1Reduction of solder interconnect stressIBM·Filed 2016·Granted Jan 9, 2018·1 cites·9 claims
- 1769US8592970B2Multichip electronic packages and methods of manufactureSIKKA KAMAL K·Filed 2011·Granted Nov 26, 2013·3 cites·24 claims
- 1867US10541211B2Control warpage in a semiconductor chip packageIBM·Filed 2017·Granted Jan 21, 2020·1 cites·20 claims
- 1966US11744981B2Internet of things (IoT) real-time response to defined symptomsIBM·Filed 2021·Granted Sep 5, 2023·0 cites·20 claims
- 2066US2019357843A1Optimized individual sleep patternsIBM·Filed 2019·Application pending·0 cites
- 2165US9563732B1In-plane copper imbalance for warpage predictionIBM·Filed 2016·Granted Feb 7, 2017·1 cites·16 claims
- 2264US11302205B2Language learning and speech enhancement through natural language processingIBM·Filed 2020·Granted Apr 12, 2022·0 cites·18 claims
- 2363US11756911B2Metal pad modificationIBM·Filed 2019·Granted Sep 12, 2023·0 cites·3 claims
- 2463US10593639B2Metal pad modificationIBM·Filed 2019·Granted Mar 17, 2020·0 cites·1 claims
- 2560US10636746B2Method of forming an electronic packageIBM·Filed 2018·Granted Apr 28, 2020·0 cites·12 claims
- 2659US10622275B2Electronic package cover having underside ribIBM·Filed 2017·Granted Apr 14, 2020·0 cites·10 claims
- 2759US10420502B2Optimized individual sleep patternsIBM·Filed 2017·Granted Sep 24, 2019·0 cites·12 claims
- 2858US11545444B2Mitigating cooldown peeling stress during chip package assemblyIBM·Filed 2020·Granted Jan 3, 2023·0 cites·20 claims
- 2958US10777482B2Multipart lid for a semiconductor package with multiple componentsELPIS TECH INC·Filed 2019·Granted Sep 15, 2020·0 cites·20 claims
- 3057US10276535B2Method of fabricating contacts of an electronic package structure to reduce solder interconnect stressIBM·Filed 2017·Granted Apr 30, 2019·0 cites·8 claims
- 3156US11784160B2Asymmetric die bondingIBM·Filed 2020·Granted Oct 10, 2023·0 cites·20 claims
- 3256US11185658B2Internet of things (IOT) real-time response to defined symptomsIBM·Filed 2018·Granted Nov 30, 2021·0 cites·20 claims
- 3356US9837333B1Electronic package cover having underside ribIBM·Filed 2016·Granted Dec 5, 2017·0 cites·10 claims
- 3455US11239183B2Mitigating thermal-mechanical strain and warpage of an organic laminate substrateIBM·Filed 2020·Granted Feb 1, 2022·0 cites·18 claims
- 3555US10096557B2Tiled-stress-alleviating pad structureGLOBALFOUNDRIES INC·Filed 2017·Granted Oct 9, 2018·0 cites·10 claims
- 3654US8860206B2Multichip electronic packages and methods of manufactureIBM·Filed 2013·Granted Oct 14, 2014·0 cites·20 claims
- 3753US10622319B2Final passivation for wafer level warpage and ULK stress reductionIBM·Filed 2017·Granted Apr 14, 2020·0 cites·7 claims
- 3853US10249548B2Test cell for laminate and methodIBM·Filed 2017·Granted Apr 2, 2019·0 cites·20 claims
- 3949US10381276B2Test cell for laminate and methodIBM·Filed 2015·Granted Aug 13, 2019·0 cites·11 claims
- 4048US10950573B2Lead-free column interconnectIBM·Filed 2019·Granted Mar 16, 2021·0 cites·9 claims
- 4147US10985129B2Mitigating cracking within integrated circuit (IC) device carrierIBM·Filed 2019·Granted Apr 20, 2021·0 cites·20 claims
- 4245US10832987B2Managing thermal warpage of a laminateIBM·Filed 2018·Granted Nov 10, 2020·0 cites·16 claims
- 4345US10108753B2Laminate substrate thermal warpage prediction for designing a laminate substrateIBM·Filed 2016·Granted Oct 23, 2018·0 cites·20 claims
- 4444US10770385B2Connected plane stiffener within integrated circuit chip carrierIBM·Filed 2018·Granted Sep 8, 2020·0 cites·8 claims
- 4544US9105500B2Non-hermetic sealed multi-chip module packageBODENWEBER PAUL F·Filed 2012·Granted Aug 11, 2015·0 cites·14 claims
- 4643US2020160228A1Cognitive computing device for predicting an optimal strategy in competitive circumstancesIBM·Filed 2018·Application pending·0 cites
- 4737US2020051447A1Cognitive tool for teaching generlization of objects to a personIBM·Filed 2018·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →