Inventor · disambiguated record
Feng-Ku Wang
Also filed as: WANG FENG · WANG FENG-KU
33 granted patents·16 pending applications·386 citations·filing 1998–2022
97Inventor score
Top patents by PatentIndex Score
49 records- 0197US9740253B2Electronic apparatusINVENTEC PUDONG TECH CORP·Filed 2016·Granted Aug 22, 2017·35 cites·7 claims
- 0294US7339787B2Heat sink module for dissipating heat from a heat source on a motherboardINVENTEC CORP·Filed 2006·Granted Mar 4, 2008·32 cites·8 claims
- 0394US6373700B1Heat sink modular structure inside an electronic productINVENTEC CORP·Filed 2001·Granted Apr 16, 2002·91 cites·5 claims
- 0492US7405937B1Heat sink module for dual heat sourcesINVENTEC CORP·Filed 2007·Granted Jul 29, 2008·34 cites·11 claims
- 0592US7388747B2Heat plate fixing structureINVENTEC CORP·Filed 2006·Granted Jun 17, 2008·28 cites·10 claims
- 0691US9557785B2Computer device with heat-dissipation channelsINVENTEC PUDONG TECH CORP·Filed 2015·Granted Jan 31, 2017·9 cites·7 claims
- 0789US8542486B2Electronic apparatus with improved heat dissipationLIN WEI-YI·Filed 2011·Granted Sep 24, 2013·18 cites·9 claims
- 0885US7436673B2Heat sink fixing assemblyINVENTEC CORP·Filed 2006·Granted Oct 14, 2008·14 cites·14 claims
- 0984US7558062B2Heat-dissipating module and electronic apparatusINVENTEC CORP·Filed 2007·Granted Jul 7, 2009·17 cites·18 claims
- 1083US8482916B2Mobile computing apparatusWANG FENG-KU·Filed 2011·Granted Jul 9, 2013·8 cites·18 claims
- 1183US7946336B2Heat sink structureINVENTEC CORP·Filed 2008·Granted May 24, 2011·12 cites·7 claims
- 1280US8635616B2Virtualization processing method and apparatuses, and computer systemHUAWEI TECH CO LTD·Filed 2012·Granted Jan 21, 2014·5 cites·19 claims
- 1378US8897012B2Electronic device and heat dissipation module thereofINVENTEC PUDONG TECH CORP·Filed 2012·Granted Nov 25, 2014·2 cites·20 claims
- 1477US8641271B2Method for testing heat pipesWANG FENG-KU·Filed 2010·Granted Feb 4, 2014·4 cites·6 claims
- 1577US7564686B2Heat-dissipating moduleINVENTEC CORP·Filed 2007·Granted Jul 21, 2009·7 cites·8 claims
- 1676US8340922B2Method for estimating fan lifeWANG FENG-KU·Filed 2010·Granted Dec 25, 2012·5 cites·22 claims
- 1773US9234803B2Method and device for detecting winding temperature, method and device for thermal protection of a motorCHENG AIMING·Filed 2012·Granted Jan 12, 2016·6 cites·7 claims
- 1873US7589969B2Folding protective cover for heat-conductive mediumINVENTEC CORP·Filed 2006·Granted Sep 15, 2009·6 cites·9 claims
- 1972US9029696B2Electronic deviceINVENTEC PUDONG TECH CORP·Filed 2013·Granted May 12, 2015·3 cites·22 claims
- 2072US7463484B2Heatsink apparatusINVENTEC CORP·Filed 2007·Granted Dec 9, 2008·5 cites·13 claims
- 2171US7457119B2Heatsink moduleINVENTEC CORP·Filed 2007·Granted Nov 25, 2008·5 cites·9 claims
- 2270US7826227B2Heat dissipation deviceINVENTEC CORP·Filed 2008·Granted Nov 2, 2010·5 cites·6 claims
- 2368US8363400B2Circuit module and electronic device using the sameINVENTEC CORP·Filed 2010·Granted Jan 29, 2013·2 cites·14 claims
- 2465US7940528B2Electronic device and heat sink thereofINVENTEC CORP·Filed 2009·Granted May 10, 2011·3 cites·10 claims
- 2562US9131626B2Electronic device including a jet flow generatorINVENTEC PUDONG TECH CORP·Filed 2012·Granted Sep 8, 2015·1 cites·14 claims
- 2660US8078438B2Method for simulating thermal resistance value of thermal test dieWANG FENG-KU·Filed 2008·Granted Dec 13, 2011·2 cites·6 claims
- 2758US7954541B2Heat dissipation moduleINVENTEC CORP·Filed 2008·Granted Jun 7, 2011·2 cites·12 claims
- 2854US7757627B2Automatic coating deviceINVENTEC CORP·Filed 2006·Granted Jul 20, 2010·0 cites·4 claims
- 2952US2010014247A1Anti-turbulent casingINVENTEC CORP·Filed 2009·Application pending·0 cites
- 3051US9119323B2Electronic deviceINVENTEC PUDONG TECH CORP·Filed 2013·Granted Aug 25, 2015·0 cites·22 claims
- 3150US8363676B2Methods and apparatuses for adding/detecting an adaptive and extendable sequence indexALCATEL LUCENT·Filed 2008·Granted Jan 29, 2013·0 cites·30 claims
- 3248US5873407AWindblown-type heat-dissipating device for computer mother boardINVENTEC CORP·Filed 1998·Granted Feb 23, 1999·25 cites·7 claims
- 3346US12219235B2Electronic device and camera moduleHONOR DEVICE CO LTD·Filed 2022·Granted Feb 4, 2025·0 cites·20 claims
- 3445US2009201646A1Retaining deviceINVENTEC CORP·Filed 2008·Application pending·0 cites
- 3545US2009034193A1Heat-dissipating moduleINVENTEC CORP·Filed 2007·Application pending·0 cites
- 3645US2009034196A1Heat-dissipating moduleINVENTEC CORP·Filed 2007·Application pending·0 cites
- 3745US2009201639A1Chassis of portable electronic apparatusINVENTEC CORP·Filed 2008·Application pending·0 cites
- 3844US2009211737A1Heatsink module having fin assembly structure corresponding to heat pipeINVENTEC CORP·Filed 2008·Application pending·0 cites
- 3943US2009321055A1Loop heat pipeINVENTEC CORP·Filed 2009·Application pending·0 cites
- 4042US2015138102A1Inputting mode switching method and system utilizing the sameINVENTEC CORP·Filed 2014·Application pending·0 cites
- 4142US2014085825A1Electronic device and heat conduction element thereofCORP INVENTEC PUDONG TECHNOLOGY·Filed 2013·Application pending·0 cites
- 4241US2007235177A1Heat conducting medium protection deviceWANG FENG-KU·Filed 2006·Application pending·0 cites
- 4341US2008216997A1Heat plate construction and attachment for dismounting heat plateINVENTEC CORP·Filed 2007·Application pending·0 cites
- 4440US2018129468A1Wireless expanding system and wireless expanding methodINVENTEC PUDONG TECH CORP·Filed 2017·Application pending·0 cites
- 4537US8388221B2Method for detecting performances of heat dissipation modulesWANG FENG-KU·Filed 2010·Granted Mar 5, 2013·0 cites·7 claims
- 4637US2012127662A1Electronic apparatus and keyboard supporting module thereofSUN KUANG-CHUNG·Filed 2010·Application pending·0 cites
- 4736US2015346793A1Selective assembling type computing deviceINVENTEC PUDONG TECH CORP·Filed 2015·Application pending·0 cites
- 4834US2018270159A1Flow controlHEWLETT PACKARD ENTPR DEV LP·Filed 2015·Application pending·0 cites
- 4933US2012125570A1Heat dissipating deviceWANG FENG-KU·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →