Inventor · disambiguated record
Yuri S. Uritsky
Also filed as: URITSKY YURI · URITSKY YURI S
14 granted patents·1 pending application·535 citations·filing 1992–2012
94Inventor score
Files withAPPLIED MATERIALS INC15
Top patents by PatentIndex Score
15 records- 0194US7601648B2Method for fabricating an integrated gate dielectric layer for field effect transistorsAPPLIED MATERIALS INC·Filed 2006·Granted Oct 13, 2009·89 cites·18 claims
- 0293US5497007AMethod for automatically establishing a wafer coordinate systemAPPLIED MATERIALS INC·Filed 1995·Granted Mar 5, 1996·92 cites·20 claims
- 0384US5381004AParticle analysis of notched wafersAPPLIED MATERIALS INC·Filed 1993·Granted Jan 10, 1995·79 cites·21 claims
- 0481US7963153B2Non-destructive ambient dynamic mode AFM amplitude versus distance curve acquisitionAPPLIED MATERIALS INC·Filed 2007·Granted Jun 21, 2011·8 cites·19 claims
- 0581US5267017AMethod of particle analysis on a mirror waferAPPLIED MATERIALS INC·Filed 1992·Granted Nov 30, 1993·48 cites·18 claims
- 0680US5985680AMethod and apparatus for transforming a substrate coordinate system into a wafer analysis tool coordinate systemAPPLIED MATERIALS INC·Filed 1997·Granted Nov 16, 1999·60 cites·18 claims
- 0774US6122562AMethod and apparatus for selectively marking a semiconductor waferAPPLIED MATERIALS INC·Filed 1997·Granted Sep 19, 2000·43 cites·54 claims
- 0874US5422724AMultiple-scan method for wafer particle analysisAPPLIED MATERIALS INC·Filed 1993·Granted Jun 6, 1995·56 cites·11 claims
- 0971US7509844B2Atomic force microscope technique for minimal tip damageAPPLIED MATERIALS INC·Filed 2006·Granted Mar 31, 2009·5 cites·6 claims
- 1062US6051845AMethod and apparatus for selectively marking a semiconductor waferAPPLIED MATERIALS INC·Filed 1998·Granted Apr 18, 2000·28 cites·10 claims
- 1151US5870187AMethod for aligning semiconductor wafer surface scans and identifying added and removed particles resulting from wafer handling or processingAPPLIED MATERIALS INC·Filed 1997·Granted Feb 9, 1999·16 cites·8 claims
- 1249US8569692B1Measurement system with thickness calculation and method of operation thereofAPPLIED MATERIALS INC·Filed 2012·Granted Oct 29, 2013·0 cites·20 claims
- 1341US5474640AApparatus for marking a substrate using ionized gasAPPLIED MATERIALS INC·Filed 1993·Granted Dec 12, 1995·9 cites·15 claims
- 1440US2010203391A1Mesoporous carbon material for energy storageAPPLIED MATERIALS INC·Filed 2010·Application pending·0 cites
- 1532US5628870AMethod for marking a substrate using ionized gasAPPLIED MATERIALS INC·Filed 1995·Granted May 13, 1997·2 cites·21 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →