Inventor · disambiguated record
Masao Sugiyama
Also filed as: SUGIYAMA MASAO
21 granted patents·2 pending applications·203 citations·filing 1992–2014
95Inventor score
Files withMITSUBISHI ELECTRIC CORP8RENESAS ELECTRONICS CORP3RENESAS TECH CORP2SHIN-KOBE ELECTRIC MACHINERY CO LTD2FUJITSU LTD1
Top patents by PatentIndex Score
23 records- 0189US8017464B2Semiconductor integrated circuit device and a method for manufacturing a semiconductor integrated circuit deviceRENESAS ELECTRONICS CORP·Filed 2009·Granted Sep 13, 2011·12 cites·24 claims
- 0283US6486558B2Semiconductor device having a dummy patternMITSUBISHI ELECTRIC CORP·Filed 2001·Granted Nov 26, 2002·36 cites·6 claims
- 0378US5635746ASemiconductor device comprising a salicide structureMITSUBISHI ELECTRIC CORP·Filed 1995·Granted Jun 3, 1997·35 cites·6 claims
- 0471US9962887B2Method of manufacturing fiber substrate and method of manufacturing resin rotatorSHIN KOBE ELECTRIC MACHINERY CO LTD·Filed 2014·Granted May 8, 2018·2 cites·20 claims
- 0570US6421932B2Method and apparatus for drying substrate platesHITACHI ELECTR ENG·Filed 2001·Granted Jul 23, 2002·12 cites·11 claims
- 0669US9925700B2Method and apparatus of manufacturing molding material, and method of manufacturing resin gearHITACHI CHEMICAL CO LTD·Filed 2013·Granted Mar 27, 2018·3 cites·12 claims
- 0765US7821076B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2009·Granted Oct 26, 2010·2 cites·4 claims
- 0864US8110878B2Semiconductor device having a plurality of shallow wellsMORINO NAOZUMI·Filed 2011·Granted Feb 7, 2012·2 cites·5 claims
- 0960US5956617AMethod of manufacturing a semiconductor device employing salicide technologyMITSUBISHI ELECTRIC CORP·Filed 1997·Granted Sep 21, 1999·17 cites·9 claims
- 1058US5600170AInterconnection structure of semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1995·Granted Feb 4, 1997·24 cites·3 claims
- 1157US6620666B2Method of manufacturing semiconductor device of dual-gate construction, and semiconductor device manufactured thereby including forming a region of over-lapping n-type and p-type impurities with lower resistanceMITSUBISHI ELECTRIC CORP·Filed 2001·Granted Sep 16, 2003·8 cites·2 claims
- 1252US6800428B2Wavelength-independent exposure pattern generation method and exposure pattern generation system for lithographyFUJITSU LTD·Filed 2002·Granted Oct 5, 2004·5 cites·18 claims
- 1350US6461946B2Method of manufacturing semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2001·Granted Oct 8, 2002·3 cites·12 claims
- 1449US7982271B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2010·Granted Jul 19, 2011·0 cites·4 claims
- 1549US6723614B2Semiconductor device comprising layered positional detection marks and manufacturing method thereofRENESAS TECH CORP·Filed 2001·Granted Apr 20, 2004·3 cites·2 claims
- 1647US2012061769A1Semiconductor integrated circuit device and a method for manufacturing a semiconductor integrated circuit deviceSUGIYAMA MASAO·Filed 2011·Application pending·0 cites
- 1746US6165878AMethod of manufacturing semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1998·Granted Dec 26, 2000·13 cites·18 claims
- 1843US2009179247A1Semiconductor deviceRENESAS TECH CORP·Filed 2009·Application pending·0 cites
- 1942US10265886B2Method of manufacturing molding material, molding die for use in the manufacturing method, and method of manufacturing resin rotatorSHIN KOBE ELECTRIC MACHINERY CO LTD·Filed 2013·Granted Apr 23, 2019·0 cites·13 claims
- 2038US6344697B2Semiconductor device comprising layered positional detection marks and manufacturing method thereofMITSUBISHI ELECTRIC CORP·Filed 1998·Granted Feb 5, 2002·6 cites·16 claims
- 2137US6545771B1Facsimile apparatus and information printing method of facsimile apparatusSHARP KK·Filed 1999·Granted Apr 8, 2003·6 cites·10 claims
- 2235US9376688B2Method of producing cyclamen with multi-petaled flowersTERAKAWA TERUHIKO·Filed 2010·Granted Jun 28, 2016·0 cites·4 claims
- 2335US5152138AExhaust system for sideway-mounted engineMAZDA MOTOR·Filed 1992·Granted Oct 6, 1992·14 cites·5 claims
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