Inventor · disambiguated record
Hao-Chun Liu
Also filed as: LIU HAO · Liu hao chun
17 granted patents·6 pending applications·13 citations·filing 2011–2025
89Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD20LIU HAO1TAIWAN SEMICONDUCTOR MANUFACATURING CO LTD1UNIV CALIFORNIA1
Top patents by PatentIndex Score
23 records- 0195US11855028B2Hybrid micro-bump integration with redistribution layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 26, 2023·3 cites·20 claims
- 0294US11901323B2Semiconductor packages having conductive pillars with inclined surfacesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Feb 13, 2024·2 cites·20 claims
- 0383US2025364461A1Semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0482US12272664B2Semiconductor packages having conductive pillars with inclined surfacesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Apr 8, 2025·0 cites·20 claims
- 0580US12463150B2Bonding structures in semiconductor packaged device and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Nov 4, 2025·0 cites·19 claims
- 0679US12476211B2Semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Nov 18, 2025·0 cites·20 claims
- 0778US2025201750A1Semiconductor packages having conductive pillars with inclined surfacesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0878US2024379605A1Hybrid micro-bump integration with redistribution layerTAIWAN SEMICONDUCTOR MANUFACATURING CO LTD·Filed 2024·Application pending·0 cites
- 0977US12412857B2Hybrid micro-bump integration with redistribution layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Sep 9, 2025·0 cites·20 claims
- 1076US2025343194A1Integrated circuit, semiconductor package, and manufacturing method of semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1175US2024379428A1Semiconductor structure with pull-in planarization layer and method forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1271US12113055B2Stress reduction apparatus and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Oct 8, 2024·0 cites·20 claims
- 1371US11990428B2Bonding structures in semiconductor packaged device and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted May 21, 2024·0 cites·20 claims
- 1470US8500493B2Electrical connector with improved metal shellLIU HAO·Filed 2011·Granted Aug 6, 2013·7 cites·12 claims
- 1569US10692848B2Stress reduction apparatus and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jun 23, 2020·1 cites·20 claims
- 1668US12021048B2Semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jun 25, 2024·0 cites·20 claims
- 1768US11398444B2Semiconductor packages having conductive pillars with inclined surfaces and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 26, 2022·0 cites·20 claims
- 1866US2022384259A1Semiconductor Structure with Pull-in Planarization Layer and Method Forming the SameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 1965US12431452B2Semiconductor package including corner bumps coaxially offset from the pads and non-corner bumps coaxially aligned with the padsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Sep 30, 2025·0 cites·20 claims
- 2064US11244940B2Stress reduction apparatus and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Feb 8, 2022·0 cites·20 claims
- 2158US12174016B2Chip-scale frequency-comb assisted coherent lidar ranging with sub-micrometer precisionUNIV CALIFORNIA·Filed 2019·Granted Dec 24, 2024·0 cites·15 claims
- 2251US12051622B2Passivation layer and planarization layer and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 30, 2024·0 cites·20 claims
- 2347US11393771B2Bonding structures in semiconductor packaged device and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jul 19, 2022·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →