Inventor · disambiguated record
Toshinori Ogashiwa
Also filed as: OGASHIWA TOSHINORI
23 granted patents·3 pending applications·163 citations·filing 1990–2021
94Inventor score
Files withTANAKA PRECIOUS METAL IND12OGASHIWA TOSHINORI6TANAKA ELECTRONICS IND5MATSUSHITA ELECTRIC INDUSTRIAL CO LTD1MIYAIRI MASAYUKI1
Top patents by PatentIndex Score
26 records- 0181US5514912AMethod for connecting semiconductor material and semiconductor device used in connecting methodTANAKA ELECTRONICS IND·Filed 1994·Granted May 7, 1996·33 cites·24 claims
- 0280US7789287B2Method of bondingTANAKA PRECIOUS METAL IND·Filed 2007·Granted Sep 7, 2010·10 cites·18 claims
- 0378US8505804B2Metal paste for sealing, hermetic sealing method for piezoelectric element, and piezoelectric deviceOGASHIWA TOSHINORI·Filed 2008·Granted Aug 13, 2013·8 cites·3 claims
- 0470US5550407ASemiconductor device having an aluminum alloy wiring lineTANAKA ELECTRONICS IND·Filed 1994·Granted Aug 27, 1996·23 cites·17 claims
- 0570US5384090AFine wire for forming bump electrodes using a wire bonderTANAKA ELECTRONICS IND·Filed 1992·Granted Jan 24, 1995·20 cites·28 claims
- 0668US5366692AAlloy connecting materials for semiconductorsTANAKA ELECTRONICS IND·Filed 1990·Granted Nov 22, 1994·21 cites·6 claims
- 0762US6187114B1Solder material and electronic part using the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1997·Granted Feb 13, 2001·33 cites·26 claims
- 0858US12000019B2Gold powder, production method for gold powder, and gold pasteTANAKA PRECIOUS METAL IND·Filed 2020·Granted Jun 4, 2024·0 cites·14 claims
- 0951US2024321705A1Interposer substrate and method for producing device using the interposer substrateTANAKA PRECIOUS METAL IND·Filed 2021·Application pending·0 cites
- 1049US12157170B2Conductive bonding material, bonding member including the conductive bonding material, and bonding methodTANAKA PRECIOUS METAL IND·Filed 2020·Granted Dec 3, 2024·0 cites·9 claims
- 1149US8962471B2Bump, method for forming the bump, and method for mounting substrate having the bump thereonOGASHIWA TOSHINORI·Filed 2013·Granted Feb 24, 2015·0 cites·20 claims
- 1249US8558433B2Metal paste for sealing, hermetic sealing method for piezoelectric element, and piezoelectric deviceOGASHIWA TOSHINORI·Filed 2012·Granted Oct 15, 2013·0 cites·4 claims
- 1347US10366963B2Noble metal paste for bonding of semiconductor elementTANAKA PRECIOUS METAL IND·Filed 2016·Granted Jul 30, 2019·0 cites·11 claims
- 1447US9561952B2Hermetic-sealing package member, production method therefor, and hermetically-sealed package production method using this hermetic-sealing package memberTANAKA PRECIOUS METAL IND·Filed 2014·Granted Feb 7, 2017·0 cites·17 claims
- 1544US8492894B2Bump, method for forming the bump, and method for mounting substrate having the bump thereonOGASHIWA TOSHINORI·Filed 2010·Granted Jul 23, 2013·0 cites·3 claims
- 1641US2015014399A1Conductive paste for die bonding, and die bonding method with the conductive pasteTANAKA PRECIOUS METAL IND·Filed 2013·Application pending·0 cites
- 1740US2016272488A1Through electrode and method for producing multilayer substrate using through electrodeTANAKA PRECIOUS METAL IND·Filed 2014·Application pending·0 cites
- 1839US10870151B2Structure and method for sealing through-hole, and transfer substrate for sealing through-holeTANAKA PRECIOUS METAL IND·Filed 2018·Granted Dec 22, 2020·0 cites·12 claims
- 1939US9539671B2Precious metal paste for bonding semiconductor elementMIYAIRI MASAYUKI·Filed 2011·Granted Jan 10, 2017·0 cites·11 claims
- 2039US9065418B2Resonator electrode material excellent in aging property, piezoelectric resonator using the same material, and sputtering target made of the same materialOGASHIWA TOSHINORI·Filed 2010·Granted Jun 23, 2015·0 cites·18 claims
- 2138US11626334B2Through-hole sealing structureTANAKA PRECIOUS METAL IND·Filed 2017·Granted Apr 11, 2023·0 cites·20 claims
- 2238US10256113B2Transfer substrate for forming metal wiring and method for forming metal wiring with the transfer substrateTANAKA PRECIOUS METAL IND·Filed 2012·Granted Apr 9, 2019·0 cites·9 claims
- 2338US6160224ASolder material and electronic part using the sameTANAKA DENKI KOGYO KABUSHIKI K·Filed 1998·Granted Dec 12, 2000·12 cites·10 claims
- 2436US8912088B2Transfer substrate for forming metal wiring and method for forming metal wiring using said transfer substrateOGASHIWA TOSHINORI·Filed 2011·Granted Dec 16, 2014·0 cites·12 claims
- 2535US10125015B2Package production method and package produced by the methodTANAKA PRECIOUS METAL IND·Filed 2015·Granted Nov 13, 2018·0 cites·17 claims
- 2634US5514334AFine lead alloy wire for forming bump electrodesTANAKA ELECTRONICS IND·Filed 1994·Granted May 7, 1996·3 cites·14 claims
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