Inventor · disambiguated record
George Bokisa
Also filed as: BOKISA GEORGE · BOKISA GEORGE S · BOKISA SR GEORGE S
22 granted patents·3 pending applications·753 citations·filing 1986–2021
96Inventor score
Top patents by PatentIndex Score
25 records- 0193US6720499B2Tin whisker-free printed circuit boardATOTECH DEUTSCHLAND GMBH·Filed 2001·Granted Apr 13, 2004·54 cites·29 claims
- 0293US6676823B1High speed acid copper platingTASKEM INC·Filed 2002·Granted Jan 13, 2004·37 cites·26 claims
- 0392US7195702B2Tin alloy electroplating systemTASKEM INC·Filed 2003·Granted Mar 27, 2007·40 cites·30 claims
- 0492US6506314B1Adhesion of polymeric materials to metal surfacesATOTECH DEUTSCHLAND GMBH·Filed 2000·Granted Jan 14, 2003·99 cites·78 claims
- 0592US6361823B1Process for whisker-free aqueous electroless tin platingATOTECH DEUTSCHLAND GMBH·Filed 1999·Granted Mar 26, 2002·90 cites·26 claims
- 0690US4662999APlating bath and method for electroplating tin and/or leadROHCO INC MCGEAN·Filed 1986·Granted May 5, 1987·50 cites·35 claims
- 0788US6086779ACopper etching compositions and method for etching copperROHCO INC MCGEAN·Filed 1999·Granted Jul 11, 2000·71 cites·31 claims
- 0887US6602440B2Method of producing copper surfaces for improved bonding, compositions used therein and articles made therefromATOTECH DEUTSCHLAND GMBH·Filed 2001·Granted Aug 5, 2003·32 cites·17 claims
- 0987US6284309B1Method of producing copper surfaces for improved bonding, compositions used therein and articles made therefromATOTECH DEUTSCHLAND GMBH·Filed 1997·Granted Sep 4, 2001·54 cites·16 claims
- 1086US5554211AAqueous electroless plating solutionsROHCO INC MCGEAN·Filed 1995·Granted Sep 10, 1996·66 cites·24 claims
- 1183US4885064AAdditive composition, plating bath and method for electroplating tin and/or leadROHCO INC MCGEAN·Filed 1989·Granted Dec 5, 1989·35 cites·29 claims
- 1281US5698087APlating bath and method for electroplating tin and/or leadROHCO INC MCGEAN·Filed 1992·Granted Dec 16, 1997·29 cites·25 claims
- 1380US6063172AAqueous immersion plating bath and method for platingROHCO INC MCGEAN·Filed 1998·Granted May 16, 2000·48 cites·34 claims
- 1464US5928790AMultilayer circuit boards and processes of making the sameROHCO INC MCGEAN·Filed 1996·Granted Jul 27, 1999·26 cites·44 claims
- 1563US5411595APost-etch, printed circuit board cleaning processROHCO INC MCGEAN·Filed 1993·Granted May 2, 1995·16 cites·14 claims
- 1661US11047064B2Apparatus and method to maintaining trivalent chromium bath platingCOVENTYA INC·Filed 2018·Granted Jun 29, 2021·0 cites·13 claims
- 1761US6579591B2Method of producing copper surfaces for improved bonding, compositions used therein and articles made therefromATOTECH DEUTSCHLAND GMBH·Filed 2001·Granted Jun 17, 2003·6 cites·20 claims
- 1859US12410525B2Multilayer corrosion systemMACDERMID INC·Filed 2021·Granted Sep 9, 2025·0 cites·11 claims
- 1959US10167564B2Apparatus and methods of maintaining trivalent chromium bath plating efficiencyCOVENTYA INC·Filed 2014·Granted Jan 1, 2019·0 cites·20 claims
- 2055US11555252B2Satin copper bath and method of depositing a satin copper layerCOVENTYA INC·Filed 2019·Granted Jan 17, 2023·0 cites·16 claims
- 2149US2006096867A1Tin alloy electroplating systemBOKISA GEORGE·Filed 2004·Application pending·0 cites
- 2245US2005173254A1Nickel cobalt boron ternary alloysFiled 2004·Application pending·0 cites
- 2345US2005173255A1Electroplated quaternary alloysFiled 2004·Application pending·0 cites
- 2443US10062918B2Flow battery electrolyte compositions containing a chelating agent and a metal plating enhancerPRIMUS POWER CORP·Filed 2016·Granted Aug 28, 2018·0 cites·9 claims
- 2537US11913131B2Ternary zinc-nickel-iron alloys and alkaline electrolytes or plating such alloysCOVENTYA INC·Filed 2017·Granted Feb 27, 2024·0 cites·13 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →