Inventor · disambiguated record
Adrian Boyle
Also filed as: BOYLE ADRIAN · BOYLE ADRIAN A
19 granted patents·7 pending applications·557 citations·filing 1999–2018
95Inventor score
Top patents by PatentIndex Score
26 records- 0194US7776720B2Program-controlled dicing of a substrate using a pulsed laserELECTRO SCIENT IND INC·Filed 2003·Granted Aug 17, 2010·149 cites·49 claims
- 0291US10163213B23D point cloudsCATHX RES LTD·Filed 2015·Granted Dec 25, 2018·14 cites·10 claims
- 0391US10158793B2Processing survey data of an underwater sceneCATHX RES LTD·Filed 2013·Granted Dec 18, 2018·11 cites·15 claims
- 0491US10116842B2Gathering range and dimensional information for underwater surveysCATHX RES LTD·Filed 2013·Granted Oct 30, 2018·10 cites·17 claims
- 0591US10116841B2Relation to underwater imaging for underwater surveysCATHX RES LTD·Filed 2013·Granted Oct 30, 2018·12 cites·20 claims
- 0690US6841482B2Laser machining of semiconductor materialsXSIL TECHNOLOGY LTD·Filed 2001·Granted Jan 11, 2005·53 cites·12 claims
- 0788US6586707B2Control of laser machiningXSIL TECHNOLOGY LTD·Filed 2001·Granted Jul 1, 2003·69 cites·29 claims
- 0887US6781093B2Circuit singulation system and methodXSIL TECHNOLOGY LTD·Filed 2002·Granted Aug 24, 2004·45 cites·25 claims
- 0986US7887712B2Laser machining system and methodELECTRO SCIENT IND INC·Filed 2002·Granted Feb 15, 2011·60 cites·53 claims
- 1083US10930013B2Method and system for calibrating imaging systemCATHX OCEAN LTD·Filed 2018·Granted Feb 23, 2021·6 cites·14 claims
- 1179US7989320B2Die bondingELECTRO SCIENT IND INC·Filed 2004·Granted Aug 2, 2011·35 cites·21 claims
- 1274US6671397B1Measurement system having a camera with a lens and a separate sensorM V RES LTD·Filed 1999·Granted Dec 30, 2003·53 cites·7 claims
- 1372US6697154B2Microvia inspection systemMV RES LTD·Filed 2001·Granted Feb 24, 2004·19 cites·21 claims
- 1463US10943321B2Method and system for processing image dataCATHX RES LTD·Filed 2016·Granted Mar 9, 2021·2 cites·27 claims
- 1562US6983066B2Machine visionMV RES LTD·Filed 2002·Granted Jan 3, 2006·6 cites·16 claims
- 1662US6697151B2Material inspectionMV RES LTD·Filed 2001·Granted Feb 24, 2004·10 cites·27 claims
- 1755US9352417B2Increasing die strength by etching during or after dicingELECTRO SCIENT IND INC·Filed 2013·Granted May 31, 2016·0 cites·14 claims
- 1855US8551792B2Dicing a semiconductor waferBOYLE ADRIAN·Filed 2009·Granted Oct 8, 2013·3 cites·24 claims
- 1948US2011029124A1Program controlled dicing of a substrate using a pulsed laser beamELECTRO SCIENT IND INC·Filed 2010·Application pending·0 cites
- 2045US2012264238A1Program controlled dicing of a substrate using a pulsed laser beamBOYLE ADRIAN·Filed 2012·Application pending·0 cites
- 2140US2011177674A1Processing of multilayer semiconductor wafersELECTRO SCIENT IND INC·Filed 2009·Application pending·0 cites
- 2237US2009191690A1Increasing Die Strength by Etching During or After DicingXSIL TECHNOLOGY LTD·Filed 2005·Application pending·0 cites
- 2335US2017048494A1Underwater surveysCATHX RES LTD·Filed 2015·Application pending·0 cites
- 2433US2006249480A1Laser machining using an active assist gasBOYLE ADRIAN·Filed 2004·Application pending·0 cites
- 2529US2006163209A1Laser machiningBOYLE ADRIAN·Filed 2003·Application pending·0 cites
- 2628US8048774B2Methods and systems for laser machining a substrateELECTRO SCIENT IND INC·Filed 2002·Granted Nov 1, 2011·0 cites·18 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →