Inventor · disambiguated record
Zuhair Bokharey
Also filed as: BOKHAREY ZUHAIR
10 granted patents·5 pending applications·24 citations·filing 2012–2021
82Inventor score
Top patents by PatentIndex Score
15 records- 0192US9385098B2Variable-size solder bump structures for integrated circuit packagingNVIDIA CORP·Filed 2012·Granted Jul 5, 2016·17 cites·15 claims
- 0271US9478482B2Offset integrated circuit packaging interconnectsNVIDIA CORP·Filed 2012·Granted Oct 25, 2016·3 cites·11 claims
- 0370US9716051B2Open solder mask and or dielectric to increase lid or ring thickness and contact area to improve package coplanarityNVIDIA CORP·Filed 2012·Granted Jul 25, 2017·2 cites·20 claims
- 0465US9368422B2Absorbing excess under-fill flow with a solder trenchNVIDIA CORP·Filed 2012·Granted Jun 14, 2016·2 cites·15 claims
- 0560US11495568B2IC package design and methodology to compensate for die-substrate CTE mismatch at reflow temperaturesNVIDIA CORP·Filed 2021·Granted Nov 8, 2022·0 cites·14 claims
- 0650US10219387B2Process for manufacturing a printed circuit board having high density microvias formed in a thick substrateNVIDIA CORP·Filed 2013·Granted Feb 26, 2019·0 cites·22 claims
- 0749US10943882B1IC package design and methodology to compensate for die-substrate CTE mismatch at reflow temperaturesNVIDIA CORP·Filed 2019·Granted Mar 9, 2021·0 cites·7 claims
- 0844US9760132B2Stiffening electronic packages by disposing a stiffener ring between substrate center area and conductive padNVIDIA CORP·Filed 2013·Granted Sep 12, 2017·0 cites·30 claims
- 0944US9368439B2Substrate build up layer to achieve both finer design rule and better package coplanarityNVIDIA CORP·Filed 2012·Granted Jun 14, 2016·0 cites·20 claims
- 1040US2014117527A1Reduced integrated circuit package lid heightNVIDIA CORP·Filed 2012·Application pending·0 cites
- 1139US2014124254A1Non-solder mask defined copper pad and embedded copper pad to reduce packaging system heightNVIDIA CORP·Filed 2012·Application pending·0 cites
- 1237US9087830B2System, method, and computer program product for affixing a post to a substrate padZHANG LEILEI·Filed 2012·Granted Jul 21, 2015·0 cites·13 claims
- 1335US2013313720A1Packaging substrate with reliable via structureZHANG LEILEI·Filed 2012·Application pending·0 cites
- 1435US2013251967A1System, method, and computer program product for controlling warping of a substrateZHANG LEILEI·Filed 2012·Application pending·0 cites
- 1534US2013256873A1System, method, and computer program product for preparing a substrate postZHANG LEILEI·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →